• The Korean Journal of Food And Nutrition
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• v.13 no.6
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• pp.534-538
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• 2000

Sample frying oil was manufactured from simple mixing treatment of capsicum. butter flavor and silicone resin. the amount were 0.20, 0.15% ($\omega$/$\omega$) and 10 rpm in soybean oil, respectively. This frying oil was confirmed to improving of heat stability as well as removal effect of meat flavor. Frying oil obtained from treatment of capsicum and silicone resin was appeared, acid value and smoke point were 0.301, 232$\^{C}$, than its value in the non-treated soybean oil were 0.385. 220$\^{C}$, respectively, in the case of continuous frying at 185$\pm$2$\^{C}$. These effects were likely to according both anti-oxidation effect of capsicum and inhibition of free fatty acids and smoke production from anti-expansion of surface area in frying oil. Meat flavor and burnt flavor of oil in the frying oil and fried foods were weakened by treating of butter flavor(0.15%, $\omega$/$\omega$), this effect will be produced to new type\`s frying oil product.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Journal of the Korean Ceramic Society
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• v.13 no.1
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• pp.11-19
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• 1976

This study was focused on the improvement of production techniques of small crucibles in relation with the appropriate selection of raw materials, various batch compositions and physical and chemical characteristics of the crucibles. Various tests gave the optimum batch composition for the carbon bond graphite cructble as follows: Pyontaek graphite flake (refractory aggregate) : 40Part Silicon carbide: 15Part Tar pitch (binder) : 11Part Inorganic additives (to improve the oxidation resistance) : 15 Part Cryolite : 3 Part Ferro manganese : 2 Part Ferrosilicon : 25 Part Crucibles pressed with 400kg/$\textrm{cm}^2$ at 12$0^{\circ}C$. and fired in reducing atmosphere at 120$0^{\circ}C$ brought the most favorable results as follows: Bulk density : 2.31 Apparent density : 2.58 Porosity : 15.2% Oxidation loss at 1, 50$0^{\circ}C$. for 3 hrs : below 3.77% Water absorption : 6.01% Compressive strength : 438kg/$\textrm{cm}^2$ Tensile strength : 256kg/$\textrm{cm}^2$.

• Journal of the Korean Geographical Society
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• v.46 no.4
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• pp.414-425
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• 2011

The aim of this research is to infer paleovegetation and paleoclimate in the Hwajeon archeological site of Gwangju city during mid-Holocene through the analysis of pollen, waterlogged woods, and sediments. Between 8200 ~ 6800 years ago, relatively dry climate resulted in a weakened dominance of oak and high diversity of tree genus. During the Holocene climatic optimum period (6800 ~ 5900 years ago), oak forests expanded while wetland areas diminished as warm/humid climate intensified. Between 5900 ~ 4700 years ago, the entire forest area as well as oak climax forests was reduced due to a relatively cool/dry climate. However at the end of this period, oak forests expanded since a favorable climate condition temporarily resumed. Lastly, between 4700 ~ 3300 years ago, oaks dominated but alders were weakened. The density of forest was low because of a relatively dry climate in this period.

• Fire Science and Engineering
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• v.25 no.4
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• pp.48-55
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• 2011

This paper presents the failure analysis of the rate of rise spot type heat detectors on artificially accelerated aging. The failures of heat detector turned out by two reasons. The first one is the separation of binder from plastic moulding, resulting in the leakage of air from heat chamber. The second reason is the crack of plastic. The large cracks were maybe created by these reasons, thermal expansion difference, mechanical stress, or growth of microcrack. In the sound detector, the separation and the crack were not occurred or not developed to the critical size. The glass fibers which increase the mechanical strength were added in the binder of detector 2010G. The densities of binder or plastic of each detector were similar. However, the TGA result shows that the thermal characteristics of 2005A and 2005B were not similar.

• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• 한국문화재보존과학회:학술대회논문집
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• 2004.03a
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• pp.78-91
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• 2004

염(Salts)은 일반적으로 가장 강력한 풍화요인 물질 중 하나이다. 염의 결정화(crystallization) 및 수화(hydration)작용은 석재의 화학적 풍화 뿐만이 아니라 물리적 풍화를 가속화 시킨다. 감은사지 석탑은 오랜 세월 대기 중에 노출되어 대기환경오염으로 인한 화학적 풍화 뿐만이 아니라 지리적으로 바다에 인접해 있어 바다에서 기원한 염화나트륨(NaCl)의 영향으로 다른 석조물에 비해 심한 물리적 풍화현상을 보이고 있다. 편광 현미경 및 SEM, XRD, XRF를 이용하여 석탑의 구성석재 및 염(salts)에 대한분석을 실시하였으며, 용출실험을 통해 얻은 용액에 대해서는 IC와 ICP-AES를 이용하여 분석하였고, 염류와 석재의 반응산물로 만들어진 염에 대해서는 정방위시료와 부정방위시료를 제작하여 분석하였다. 감은사지 석탑을 이루는 암석은 결정응회암으로 주 구성 광물은 사장석 및 정장석이며 소량의 석영 및 흑운모 등이 함유되어 있고 소량의 유리질 석기로 구성되어 있다. 석재의 표면에는 주 구성 광물들의 화학적 풍화로 인해서 생성된 2차 광물로 팽창성 점토광물인 스멕타이트가 존재하며, 대기오염물질과의 결합에 의해 생성된 대표적인 황산염인 석고$(gypsum,\;CaSO_4{\cdot}2H_2O)$, 소금(halite, NaCl), 해양기원 염류인 소금성분과 대기오염물질이 만들어낸 테나다이트$(thenardite,\;Na_2SO_4)$가 존재한다. 이들 염류는 일차적으로 암석의 표면에 백화현상을 초래하기도 하고, 대기 중의 오염물질과 결합하여 일부는 흑화현상을 보이기도 한다. 또한 암석 내 수분이 증가할 경우 이들 염들이 암석의 공극이나 열극을 따라 내부로 이동하여 subflorescence를 발생시켜 박락 및 박탈의 원인이 되었으며, 온도와 수분의 변화에 따른 이들 염(salts)의 수화 및 결정 작용 그리고 새로운 염(salts)의 침전작용을 반복하면서 석재 내부와 외부의 암석 및 결정에 균열과 미세열극 등이 생성되어 석재 자체의 구조적 안정성에 영향을 주고 있다. 따라서 감은사지 석탑은 지리적 환경 차이로 인해 일반적인 환경의 석조물들과는 다른 형태의 풍화양상을 보이고 있어서 풍화양상 및 풍화형태에 대한 정확한 연구와 이해를 바탕으로 보존대책이 마련되어야 한다.

• Clean Technology
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• v.10 no.3
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• pp.121-130
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• 2004

Pelletizer of dry ice snow produced by adiabatic expansion of liquid carbon dioxide and their blaster were designed and manufactured. The blaster had a high cleaning power against various contaminants on the surface such as stain, oily dirt, lacquer film and paints with low blasting pressure and low consumption of blasting air. The capacity of hopper for dry ice pellet supply was 12 kg and the mass rate of pellet blasting was controlled in 0 to 1.2 kg/min. The impact of the pellets was independent of standoff distance within a certain limiting distance, and dependent on the impact stress, angle and mass rate of dry ice pellet blasting. On the other hand the cleaning power was influenced by thermal properties and surface roughness of the substrates and decreased in the order of glass, copper, brass, steel and acryl. The power was also affected by hardness and adhesion of the contaminant on the substrate, and decreased in the order of grease, epoxy and paint. The noise was detected during blasting in the range of 85 to 100dBA.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.1
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• pp.25-36
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• 1995

We have investigated the structure and the conductivity of the $Cd_{1-y}Zn_{y}$ Te films evaporated on the glass substrates (Corning 7059) by Electron Beam Evaporator (EBE) in pressure of approximately $1 {\times} 10^{-6}$ torr.The structure temperatures were held at both room temperature and $300^{\circ}C$, and the samples have annealed for an hour at $300^{\circ}C$ The survace com-position of the as-prepared films were slightly different from those of CdZn Te source material.Cd losses on the CdZnTe surface was measured about 4% of atomic ratio at room temperature substrate, whereas Zn atomic ratio was nearly constant, relatively. The strure is observed to be polycrystalline whose phase is mainly cubic phase. Thermal expansion coefficient was $6.30 {\times} 10^{-5}/^{\circ}C$ which was calculated from the variation of lattice parameter by X-ray powder pat-terns measured at $400^{\circ}C$.Diffraction peaks were slightly increased by annealing for an hour at $300^{\circ}C $, but they werey highly affected by substrate temperature during evaporation.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.