• Composites Research
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• v.12 no.2
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• pp.91-100
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• 1999

The manufacture of high strength polyethylene(HSPE) tape yarns has been accomplished by a solid state processing(SSP) method as the compaction of ultra-high molecular weight polyethylene(UHMWPE) powders and drawing of the compacted film under the melting point without any organic solvents. In this study, the characteristics of HSPE tape yarns produced by SSP which is desirable for production cost and environmental aspect were analyzed. As the results, tensile strengths of HSPE tape yarns increased with increasing the draw ratio and the fracture morphology of highly drawn HSPE tape yarns showed more fibrillar shape than the low drawn one. Interfacial shear strengths of HSPE tape yarns with vinylester resin increased by $O_2$ plasma treatment and maximum interfacial shear strength was obtained in the plasma treatment condition of 100W and 5min. In addition, mechanical properties of HSPE tape yarn reinforced composites were investigated and compared with those of the gel spun HSPE fiber reinforced composites.

• Journal of Adhesion and Interface
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• v.12 no.2
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• pp.73-80
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• 2011

In order to develop the environmental-friendly new materials based on soybean protein which is plantable macromolecule, thermal characteristics of the soybean protein resin (SPI) modified by plasticizers (1,3-propandiol, glycerol) and cross linking agents (glutaraldehyde, epichlorohydrin, glyoxal, urea) were analyzed by TGA. Mechanical properties of modified SPI were investigated and fracture was observed by SEM. As the result, flexibility of SPI film was increased by adding plasticizers; 1,3-propandiol and glycerol. Plasticization effect of glycerol was relatively greater than that of 1,3-propandiol. With the application of crosslinking agents (glycerol, epichlorohydrin and glyoxal), strength and thermal stability of SPI increased with their content. On the other hand, in case of addition of urea, thermal stability of SPI decreased and its strength was reduced because cross-linking between urea and SPI was somewhat difficult. Fracture surfaces and domain interfaces of the modified SPI resins were observed with SEM.

• Resources Recycling
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• v.23 no.4
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• pp.30-36
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• 2014

300,000 tons of waste tires are annually being produced with development of the automotive industry in Korea. Landfill and incineration treatment system are causing the economic problem through secondary environmental pollution and waste. Therefore, as one of the ways to take advantage of this, Thermo-Plastic Vulcanized (TPV) composite was prepared by the ground waste tire and plastic powders. The waste tire powder was gained by mechanical fracturing through crushers. The waste tire powder was ground by a shear crushing method and a 2-stage disk mill method instead of cutting crushing one. The waste tire powder of 50 mesh was mixed with Polypropylene(PP) in various proportions. TPVs were prepared by an extrusion, and tensile and impact tests were performed. In addition, the same experiments were repeated in 40, 80, 140 mesh conditions in order to observe size effect of waste tire powders.

• Composites Research
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• v.35 no.2
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• pp.86-92
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• 2022

This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

• Proceedings of the Korean Reliability Society Conference
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• 2006.05a
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• pp.239-246
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• 2006

프레스다이용 코일스프링은 자동차 및 전자제품의 외형생산에 필요한 금형 내에 장착되는 금형용 스프링으로서 녹아웃 및 스트리퍼 등에 사용되고 있다. 프레스다이용 코일스프링이 사용 중 파손 시에는 고가인 금형의 손상 및 생산성에 영향을 미칠 수도 있기 때문에 사용 환경에서의 신뢰성확보가 요구되어지고 있다. 특히 중(重)하중 및 극중(極重)하중용 스프링은 과거 현장에서 파손사례가 자주 발생함으로 인해 외산을 선호하는 경향이 있는 형편이다. 이에 국산 스프링의 신뢰성검증 및 확보를 위해 신뢰성기반구축사업을 통해 신뢰성평가기준(RS D 0014)가 제정되었으며, 이 평가기준에 의거하여 국내 업체의 제품에 대해 신뢰성평가를 실시하였다. 프레스다이용 코일스프링의 파손원인은 주로 반복하중에 의한 피로파손과 일정한 변위의 변형으로 발생하는 코일스프링 자유높이의 축소로 크게 구분되어질 수 있다. 시험결과 주 파손양상은 피로에 의한 균열발생이었으며, 코일 끝단부와 끝단부 직하부의 코일과의 마찰에 의한 균열발생이 주원인이었다. 즉, 코일의 끝단면과 직하면 코일이 연속적으로 부딪침으로써 발생한 변형 및 마모에 의해 표면균열이 발생하고, 표면균열에서 반복적인 부하하중이 가해짐으로써 피로균열 진전을 통해 점차적으로 파손이 진행되어졌음을 알 수 있었다. 본 발표에서는 기준에 의거하여 로하중용 프레스 다이용 코일스프링을 평가한 신뢰성평가시험 결과에 대해 보고하고, 파단면 관찰과 외산제품과의 미세조직 및 조성 등의 비교분석결과 등을 기초로 파손원인을 분석한 결과에 대해 보고하고자 한다.제고할 수 있을 것으로 기대한다.X>$CdCl^+,\;CdSO_4$ 등이 형성되었다. 수은의 경우는 해수 및 증류수를 용출용매로 이용한 모든 경우에서 납, 구리, 카드뮴과는 달리 대부분 침전하였다. 더욱이 해수에 존재하는 고농도 염소($Cl^-$)와의 수착으로 인해 finite solid인 calomel($Hg_2Cl_2$)이 형성되어 대부분 침전(SI=0)되기 때문에 납, 구리, 카드뮴 보다 더 낮은 환경이동성을 갖을 것으로 사료된다. 상기 실험결과 용출용매로 증류수와 해수를 이용했을 때, 제강 슬래그에서 용출되는 납, 구리, 카드뮴, 수은의 용출 경향의 차이를 확인할 수 있었고 이에 따라서, 납, 구리, 카드뮴의 용출 유해성은 낮기 때문에 해양구조물로의 제강슬래그 유효이용은 적합할 것으로 판단되었다.im80%$로 계산되었다. 열형광선량계로 측정된 방사선량은 각각 1.8, 1.2, 0.8, 1.2, 0.8 (70 cm 거리) cGy로 측정되었으며, 환자의 복부 표면에서의 서베이메터를 이용한 측정량은 10.9 mR/h였다. 차폐구조물의 사용 시 전체 치료 동안에 태아선량은 약 1 cGy 정도로 평가되었다. 결론 : AAPM Report No.50의 자료에 따르면, 임산부의 방사선 치료 시 태아의 방사선 피폭선량은 5 cGy 이하일 경우에 방사선 피폭에 따른 태아의 위험이 거의 없는 것으로 제시되고 있다. 본원에서 차폐 구조물을 설치하였을 경우에 측정된 태아선량은 약 1 cGy로 측정되었고, 고안된 차폐구조물

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.593-598
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• 2013

In this study, we have evaluated the water absorption phenomenon of photoresist dry film, which is commonly used to build circuits on PCB (Printed Circuit Board) by photolithography, by using ATR-FTIR (Attenuated Total Reflectance-Fourier Transform Infrared). We have firstly observed significant change in fracture mode of dry film with respect to temperature and humidity, which we assumed the material transition from ductile to brittle. Secondly, we have established the process of absorption test for determining the diffusion coefficients of water into the dry film both with gravimeter and ATR-FTIR. We have successfully calculated the diffusion coefficients for each environmental conditions from the results which we achieved by gravimeter and ATR-FTIR. Compared to the gravimeter which is a conventional method for absorption test, the ATR-FTIR method in this study has been found to be very easy to use and have the same accuracy as gravimeter. Moreover, we are expecting to use the ATR-FTIR as an appropriate method to study the absorption phenomena related to any kinds of solvent and polymer system.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.1
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• pp.62-68
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• 2001

In order to characterize the microscopic fracture behaviour of the weldment din stress corrosion cracking(SCC) phenomena, SCC and acoustic emission(AE) tests were carried out simultaneously and the correlation between mechanical paramenters obtained from SCC and AE tests was investigated. In the case of base metal, much more AE events were produced at -0.5V than at -0.8V because of the dissolution mechanism before the maximum load. Regardless of the applied voltages to the specimens, however, AE events decreased after the maximum load. In the case of weldment, lots of AE events with larger amplitude $range(40{\sim}100dB)$ were produced because of the singularities of weld HAZ in comparision to the base metal and post-weld heat-treated(PWHT) specimens. Numerous and larger cracks for the weldment were observed on the fractured surfaces by SEM examination. From these results, it was concluded that SCC for the weldment appeared most severely in synthetic seawater. Weld HAZ was softened by PWHT which also contributed to the reduced susceptibility to corrosive environment in comparison to the weldment.

• Journal of Korea Foundry Society
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• v.41 no.5
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• pp.419-433
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• 2021

Al-Si-Cu alloys benefit from the addition of copper for better hardness and strength through precipitation hardening, which results in remarkably strong alloys. However, the addition of copper expands the solidification range of Al-Si-Cu alloys, and due to this, these alloys become more prone to hot tearing, which is one of the most common and serious fracture phenomena encountered during solidification. The conventional evaluation method of the hot tearing properties of an alloy is a relative and qualitative analysis approach that does not provide quantitative data about this phenomenon. In the present study, the mold itself part of a device developed in Instone et al. was partially modified to obtain more reliable quantitative data pertaining to the hot tearing properties of an Al-Si-Cu casting alloy. To assess the influence of Cu element, four levels of Cu contents were tested (0.5, 1.0, 3.0, and 5.0 wt.%) in the Al-Si-Cu system alloy and the hot tearing properties were evaluated in each case. As the Cu content was increased, the hot tearing strength decreased to 2.26, 1.53, 1.18, and 1.04 MPa, respectively. At the moment hot tearing occurred, the corresponding solid fraction and solidification rate decreased at the same temperature due to the increase in the solid-liquid coexistence range as the Cu content increased. The morphology of the fracture surfaces was changed from dendrites to dendrites covered with residual liquid, and CuAl₂ phases were observed in the vicinity of hot tearing.

• Journal of Aerospace System Engineering
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• v.12 no.3
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• pp.38-44
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• 2018

Military aircraft may have fatigue cracks in structurally weak areas due to multiple factors such as the accumulation of flight time while perform various missions and unpredictable air conditions. As a fatigue crack progresses, there is a risk that the structure will be destroyed in extreme cases, which can have a significant impact on flight safety. In this study, a cracking phenomenon was observed during the periodic inspection the inner support of the fairing, which is installed to protect the connection between the wing and the body of the aircraft. Therefore, a study on a series of quality improvement processes for reformation was described. In order to identify the causes of cracks, pre-load generation occurrence during the wing assembly process was investigated and a fracture analysis was performed. Also, the design of the support structure was suggested in terms of preventing recurrence of cracks. The structural integrity was verified using a stress and fatigue life analysis.