• Title/Summary/Keyword: 트리밍

Search Result 61, Processing Time 0.018 seconds

Design of 4Kb Poly-Fuse OTP IP for 90nm Process (90nm 공정용 4Kb Poly-Fuse OTP IP 설계)

  • Hyelin Kang;Longhua Li;Dohoon Kim;Soonwoo Kwon;Bushra Mahnoor;Panbong Ha;Younghee Kim
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
    • /
    • v.16 no.6
    • /
    • pp.509-518
    • /
    • 2023
  • In this paper, we designed a 4Kb poly-fuse OTP IP (Intellectual Property) required for analog circuit trimming and calibration. In order to reduce the BL resistance of the poly-fuse OTP cell, which consists of an NMOS select transistor and a poly-fuse link, the BL stacked metal 2 and metal 3. In order to reduce BL routing resistance, the 4Kb cells are divided into two sub-block cell arrays of 64 rows × 32 rows, with the BL drive circuit located between the two 2Kb sub-block cell arrays, which are split into top and bottom. On the other hand, in this paper, we propose a core circuit for an OTP cell that uses one poly-fuse link to one select transistor. In addition, in the early stages of OTP IP development, we proposed a data sensing circuit that considers the case where the resistance of the unprogrammed poly-fuse can be up to 5kΩ. It also reduces the current flowing through an unprogrammed poly-fuse link in read mode to 138㎂ or less. The poly-fuse OTP cell size designed with DB HiTek 90nm CMOS process is 11.43㎛ × 2.88㎛ (=32.9184㎛2), and the 4Kb poly-fuse OTP IP size is 432.442㎛ × 524.6㎛ (=0.227mm2).