• Title/Summary/Keyword: 테라헤르츠 영상

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The Doping Concentration and Physical Properties Measurement of Silicon Wafer Using Terahertz Wave (테라헤르츠파를 이용한 실리콘 웨이퍼의 도핑 정도와 물리적 특성 측정에 관한 연구)

  • Park, Sung Hyeon;Oh, Gyung Hwan;Kim, Hak Sung
    • Journal of the Korean Society for Nondestructive Testing
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    • v.37 no.1
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    • pp.1-6
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    • 2017
  • In this study, a terahertz time domain spectroscopy (THz-TDS) imaging technique was used to measure doping concentration and physical properties (such as refractive index and permittivity) of the doped silicon (Si) wafers. The transmission and reflection modes with an incidence angle of $30^{\circ}$ were employed to determine the physical properties of the doped Si wafers. The doping concentrations of the prepared Si wafers were varied from $10^{14}$ to $10^{18}$ in both N-type and P-type cases. Finally, the correlation between the doping concentration and the power of the THz wave was determined by measuring the powers of the transmitted and reflected THz waves of the doped Si wafers. Additionally, the doped thickness, the refractive index, and permittivity of each doped Si wafer were calculated using the THz time domain waveform. The results indicate that the THz-TDS imaging technique is potentially a promising technique to measure the doping concentration as well as other optical properties (such as the refractive index and permittivity) of the doped Si wafer.

Nondestructive Imaging of an Object Using the Compact Continuous-Wave Sub-Terahertz Imaging System (소형 CW Sub-THz 이미징 시스템을 이용한 물체의 비파괴 이미징)

  • Jang, Jin-Seok;Kwon, Il-Bub;Yoon, Dong-Jin;Seo, Dae-Cheol
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.4
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    • pp.352-358
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    • 2010
  • This paper presented compact CW sub-THz imaging system using the terahertz transmitter(Tx) that generating 0.34 THz electromagnetic wave on based electronic device. Using 0.34 THz electromagnetic wave generated by Tx, we transmitted to sample by point by point scan method and measured transmitting terahertz wave magnitude and phase information respectively with terahertz receiver(Rx) based on sub harmonic mixer. This paper measured and compared images of several samples to obtain better imaging results by changing time delay and step distance of scanning stage which affect image resolution. Also, through the imaging measurement of various samples, we were able to assure possibility of application of terahertz wave.

Imaging with terahertz electromagnetic pulses (테라헤르츠 전자기파 펄스의 변조를 이용한 이미징의 해상도 연구)

  • Oh, Seung-Jae;Kang, Chul;Son, Ju-Hyuk
    • Korean Journal of Optics and Photonics
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    • v.15 no.1
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    • pp.46-50
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    • 2004
  • Images were acquired by the modulation of terahertz electromagnetic signals and compared by modulation frequencies. For the real-time acquisition of images a fast scanning method has been adopted utilizing a galvanometer. The acquired time domain waveforms were transformed into frequency domain data by fast Fourier transformations (FFT). We chose some frequency components to compare the resolution of images. The beam profiles at the focal position were measured by a knife-edge technique. Beam diameter was shown to decrease as the frequency increased. By scanning one- and two-dimensional samples a significant image enhancement was observed with the frequency increment. A nondesouctive imaging system using ㎔ electromagnetic pulses was also demonstrated.

Terahertz Transmission Imaging with Antenna-Coupled Bolometer Sensor (안테나 결합형 볼로미터 방식 테라헤르츠 센서를 이용한 이차원 주사 방식의 투과형 테라헤르츠 영상 취득에 관한 연구)

  • Lee, Kyoung Il;Lim, Byung Jik;Won, Jongsuk;Hong, Sung Min;Park, Jae Hyoun;Lee, Dae Sung
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.311-316
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    • 2018
  • An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.