• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.2
• /
• pp.19-26
• /
• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

• Journal of Welding and Joining
• /
• v.15 no.1
• /
• pp.92-100
• /
• 1997

Weld repair of ASTM A-470 class 8 high pressure (HP) steam turbine rotor steel has been performed to extend the service life of older fossil units. Microhardness measurements were conducted across the weldment from unaffected base metal (BM) to weld metal (WM). The hardness of the BM was VHN 253, however it dropped up to VHN 227 at the heat affected zone (HAZ) close to unaffected BM for multipass SAW. This area of hardness drop is called "siftening zone" and has a width of 0.5-0.6mm. During creep rupture test, failure occurred around the softening zone and rupture time was 772.4hr at 19Ksi (132 Mpa) and 593.deg. C. Multipass MIG and TIG welding have been employed to reduce the softening zone width. The softening zone width for MIG was 0.3-0.4mm and for TIG was zero-0.4mm depending on heat inputs. However creep rupture time was decreased as softening zone width reduced. Creep rupture time also showed a close relationship with heat inputs in TIG process. The higher heat input, the longer rupture time. Most failure occurred at intercritical HAZ (ICHAZ), however rupture location was shifted to coarse grained HAZ (CGHAZ) as heat input decreased. The rupture surface showed tearing and dimple which indicated transgranular fracture. fracture.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.10 no.6
• /
• pp.83-88
• /
• 2011

Magnesium alloys have been focussed for the applications for lightweight of vehicle and electronics due to their high strength, low specific density and good damping capacity. This paper deals with the creep strength of Mg-Nd-Zr-Zn alloy. For the alloy, pure magnesium(99.9%) was melt with atmosphere of $0.3%SF_6$ and $25%CO_2$. After melting, 0.3% of zinc was inserted to stir for 10min at elevated temperature of $770^{\circ}C$. Master alloys of Mg-15%Nd and Mg-15%Zr were stirred in furnace. The creep tests were performed to obtain creep rate and rupture in the temperature range of 200 to $220^{\circ}C$ and 280 to $310^{\circ}C$ at an applied stress of 156 to 172MPa and 78 to 94MPa, respectively. The deformation mechanism was predicted dislocation climb from measured apparent activation energy and stress exponent. Also the increaser the temperature and stress the lower the stress exponent and activation energy. Finally, LMP parameter gives good information for the predicted creep rupture life.