• Title/Summary/Keyword: 칩 만곡

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Mechanistic Analysis Modeling for the 3-D Chip Formation Process (3-D 칩생성과정의 역학적 해석 모델링)

  • Kim, Gyeong-U;Kim, U-Sun;Kim, Dong-Hyeon
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.12
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    • pp.163-168
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    • 2000
  • Once the chip has developed a mixed mode of side-curl and up-curl, it would generally curl to strike the tool flank. The development of the bending stresses and sheat in the chip would ultimately lead to chip failure. This paper approach this problem from a mechanics-based approach, by treating the chip as a 3-D elastic curved beam, and applying appropriate constraints and forces. The expressions for bending, shear and direct stresses are developed through an energy-based criterion. The location of the maximum stresses is also identified and explained for simulated test conditions.

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A Study of Bending Stress for the 3-D Chip Curl (3-D 칩 만곡의 굽힘응력에 관한 연구)

  • 윤주식;김우순;김경우;김동현
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.730-734
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    • 2000
  • Once the Chip has developed a mixed mode of side-curl and up-curl, it would generally curl to strike the too] flank. The development of the bending stresses and shear in the chip would ultimately lead to chip failure. This paper attacks this problem from a mechanics-based approach. by treating the chip as a 3-D elastic curved beam, and applying appropriate constraints and forces. The expressions for bending. shear and direct stresses are developed through an energy-based criterion. The location of the maximum stresses is also identified and explained for simulated test conditions.

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An Experimental Study on New Type Chip Brakeer(Part 1) (신形 칩折斷具에 관한 實驗的 硏究 (제1보))

  • 손명환;이호철
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.6
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    • pp.1121-1140
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    • 1992
  • In metal cutting the shape of generated chip varies according to cutting conditions, characteristics of workpiece and geometry of cutting tool. The best surface roughness of machined workpiece is obtained when generating flow type contrinuous chip. If the generated chip is not broken, that is not only tangled workpiece and cutting tool, but also may give damage on the machined surface of workpiece or danger for a operator. The flow type continuous chip may bring the low productivity in high speed any heavy cutting, automatic machining process and non-human factory. There are two type of chip break process ; controlling cutting condition and using chip breaker. In present study we carried out the experiment on new type chip breaker compared with conventional type and proved the efficiency of a new type and showed the chip break condition to be applied in actual metal cutting. In the experiment SM 20 C as a workpiece material and WC as a tool material were used and cutting speed of 30-150m/min, feed of 0.071-0.210mm/rev and depth of cut of 1mm were applied as cutting condition. The results of the experiment are as follows : (1) The mechanism of chip curl can be explained more clearly by plastic flow of workpiece material and moment of shearing force. (2) The most effective radius of curled chip and flat distance from cutting edge is 2.0-2.5mm and 1.5mm in both types. (3) The effective inclination angle of chip break surface and side cutting edge angle are 30.deg.- 45.deg. and 20.deg. in conventional type, while the radius of arc surface, lower arc angle A, upper arc angle B and side cutting edge angle are 3mm, 20.deg.- 45.deg., 0.deg.- 45.deg. and 10.deg.- 20.deg. in new type. (4) The probability to be obtained 100% chip breaking ratio is much higher in new type than in conventional type.

Paraboloidal 2-mirror Holosymmetric System with Unit Maginification for Soft X-ray Projection Lithography (연X-선 투사 리소그라피를 위한 등배율 포물면 2-반사경 Holosymmetric System)

  • 조영민;이상수
    • Korean Journal of Optics and Photonics
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    • v.6 no.3
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    • pp.188-200
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    • 1995
  • A design of unit magnification 2-mirror system with high resolution is presented. It is for soft X-ray(wavelength of 13 nm) projection imaging and suitable for preparation of high density semiconductor chip. In general, a holosymmetric system with unit magnification has the advantage that both coma and distortion are completely eliminated. In our holosymmetric 2-mirror system, spherical aberration is addtionally removed by using two identical paraboloidal mirror surfaces and field curvature aberration is also corrected by balancing Petzval sum and astigmatism which depends on the distance between two mirrors, so that the system is a aplanatic flat-field paraboloidal 2-mirror holosymmetric system. This 2-mirror system is small in size, and has a simple configuration with rotational symmetry about optical axis, and has also small central obscuration. Residual finite aberrations, spot diagrams, and diffraction-based MTF's are analyzed for the check of performances as soft X-ray lithography projection system. As a result, the image sizes for the resolutions of$0.25\mum$and $0.18\mum$are 4.0 mm, 2.5 mm respectively, and depths of focus for those are $2.5\mum$, $2.4\mum$respectively. This system should be useful in the fabrication of 256 Mega DRAM or 1 Giga DRAM. DRAM.

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