• Title/Summary/Keyword: 칩핑

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Machining Characteristics Detection of Endmill Milling Tool (엔드밀 밀링공구의 가공특성검출)

  • 맹민재;조성산;정준기
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.678-682
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    • 1996
  • Acoustic emission(AE) is monitored during end milling with a sensor attached to the cutting fluid discharge nozzle. Cutting forces are also measured and compared with the AE signals to examine the reliability of the AE signals. It is demonstrated that the AE signals provide reliable informations about the cutting processes and tool states. Moreover, edge chipping and fracture of tools can be successfully detected using both the AE signals and cutting forces.

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고속 가공을 위한 연속 나선형 공구 경로의 생성

  • 이응기
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.208-208
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    • 2004
  • 공작기계와 절삭 공구의 발달로 고속 가공(high speed machining)의 도입이 가속화되고 있다. 고속 가공은 소재 제거율(MRR; material removal rate)을 향상시킴으로써 생산비용 및 생산 시간의 단축이 가능하며, 소경 공구를 이용한 고속 고회전 가공으로 고정밀 가공이 가능한 방법으로 생산 효율성 및 정밀성의 증대를 동시에 추구할 수 있는 가공 방법이다. 고속 가공에서 공구의 절입 및 퇴출 시에 급격한 절삭력의 변화로 인하여 공구의 파손(breakout) 및 칩핑(chipping)의 발생 가능성이 보다 높다.(중략)

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The Bond Characteristics of Ultra Rapid Hardening Mortar for Repair using Magnesia-Phosphate Cement (마그네시아 인산염 시멘트를 이용한 초속경 보수 모르타르의 접착특성)

  • Lee, Sun-Ho;Kwon, Hee-Sung;Paik, Min-Su;Ahn, Moo-Young;Lee, Young-Do;Jung, Sang-Jin
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.04a
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    • pp.609-612
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    • 2008
  • Ultra Super Early Strength Cement is a material that satisfies these requirements. early hydration heat however, is significant over regular concrete, thus discretion is advised for thermal cracks in accordance with heat generation when constructing a large-scale structures. In addition, the negative point that it is difficult to achieve required strength in a short period of time following rubbing process while retaining workability, the cement is being used conditionally for engineering material and Ultra Super Early Strength Cement for maintenance material for construction doesn't exist. Magnesia Phosphate Cement, which is currently under studies in overseas uses no extra admixture and has strong points of Ultra Super Early Strength as well as favorable construction-ability and adhesive stability to the prototype concrete. These factors stem recognition that it could be used as maintenance material for construction of diverse applicability. In order to provide necessary data to increase practicality of the magnesia phosphate cement for Ultra Super Early Strength Mortar, the study carried out simulate experiment on member of framework to review field applicability.

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A Study on Ultraprecision Dicing Machining of Silicon Wafer (실리콘 웨이퍼의 초정밀 절단가공에 관한 연구)

  • 이은상;송지복;김성철
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.6
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    • pp.185-191
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    • 2000
  • Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

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Chip Load Control Using A NC Verification Model Based on Z-Map (Z-map 기반 NC 검증모델을 이용한 칩부하 제어)

  • 백대균;고태조;김희술
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.801-805
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    • 2000
  • This paper presents a new method of tool path optimization. A NC verification model based Z-map was utilized to obtain chip load in feed per tooth. This developed software can regenerate a NC program from cutting condition and the NC program that was generated in CAM. The regenerated NC program has not only all same data of the ex-NC program but also the new feed rates in every block. The new NC data can reduce the cutting time and manufacture precision dies with the same chip load in feed per tooth. This method can also prevent tool chipping and make constant tool wear. This paper considered the effects of acceleration and deceleration in feed rate change.

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Kinematics Modeling of the Chipping Process at Saw Blade using the Maximum Chip Thickness (최대 칩두께를 이용한 쏘블레이드에서 칩핑과정의 역학적 모델링)

  • 김경우;김우순;최현민;김동현
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.101-106
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    • 2001
  • In order to establish the optimum process parameters and diamond saw blade composition for machining natural stone, the chip formation process and the wear process must be understood. Diamond saw blade is one of the most effective, versatile, and extensively used methods of processing rock and other hard materials, such as granite, marble, concrete and asphalt. For many years, it has been known that chip thickness is one of the most significant in the understanding of the sawing process, and other variables such as force and power have been correlated with it. In this study, mathematical relations of a material chipped by a single grit of the saw blade will be undertaken. The material chipping geometries have been mathematically defined and derived as maximum chip thickness.

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Tool Fracture Detection in Milling Process (II) -Part 2: Tool Fracture Detection in Rough Milling Using Spindle Motor Current- (밀링 공정시 공구 파손 검출 (II) -제 2 편: 주축모터 전류를 이용한 밀링의 황삭 가공 중 공구파손 검출-)

  • 김기대;이강희;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.5
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    • pp.110-119
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    • 1998
  • Dynamic cutting force variations in milling process were measured indirectly using spindle motor current. Magnitude of the spindle motor current is independent of cutting direction. Quasi-static sensitivity of the spindle motor current is higher than that of the feed motor current. Dynamic sensitivity of the spindle motor current is lower but cutting force was correctly represented by spindle RMS current in rough milling. In rough milling, chipping and tool fracture were well detected by the proposed tool fracture index using spindle motor current.

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A Study on Ultraprecision Dicing Machining of Silicon Wafer (실리콘 웨이퍼의 초정밀 절단가공에 관한 연구)

  • 김성철
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.502-506
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    • 1999
  • Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.

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A Study on the Analysis of Tool-wear Patterns and Mechanisms in Face Milling (정면밀링에서 공구마멸 패턴과 메커니즘 분석에 관한 연구)

  • Jang, Sung-Min;Baek, Seung-Yub
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.4
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    • pp.24-29
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    • 2017
  • This paper provides an experimental analysis on the breakage of the coated tool using the face-milling cutter of the machining center due to changes in the cutting speed and the feed rate. The experimental studies were conducted using STS 304 materials and the damage to the tool was analyzed according to the change in machining time. The experiments confirmed that the cutting speed and feed rate affected the tool damage and the mechanical impact and thermal shock were determined to severely damage the tool. From the production engineering point of view, it has been experimentally investigated that the increased feed rate significantly influences the material removal rate more than the increased cutting speed.

A Study on Meandering Phenomenon in Dicing process (다이싱가공에 있어서 가공구사행현상에 대한 연구)

  • 정윤교
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.144-149
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    • 1994
  • 반도체 산업계에 있어서 IC 등을 주류로 하는 마이크로칩의 생산성 및 성능이 현저히 성장하여 많은 경제효과를 가져오고 있다. 이와함께 전자부품에 사용되어지는 취성재료의 종류 및 그양도 점점 증가하는 추세이다. 이러한 취성재료의 절단에는 초극박의 다이야몬드 브레이드가 널리 사용되어지고 있다. 실리콘웨이퍼와 같은 취성재료의 다이싱가공에서 문제가 되고있는것은 칩핑과 사행현상의 발생이다. 사행현상의 원인으로서는 브레이드축면의 비대칭성,절삭날의 둔화,숫돌축과 이송방향의 위치결정오차,후렌지 단면의 흔들림등을 들수 있다. 그러나, 사행의 발생영역과 사행이 계속되는 이유에 대해서는 전혀 검토되어진바 없는것이 현실이다. 본 연구에서는 다이싱가공시의 사행현상에 주목해서 사행현상의 발생영역을 명확하게 함과 동시에 AE 센서를 이용하여 인프로세서로 사행현상의 검출방법을 개발하는 것을 목적으로 한다.

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