• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Journal of the Korean Wood Science and Technology
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• v.13 no.4
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• pp.3-57
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• 1985

This research was conducted to examine the feasibility of developing fire retardant particleboard and complyboard. Particleboard were manufactured using meranti particle(Shorea spp.)made with Pallmann chipper, and complyboard meranti particle and apitong veneer (Dipterocarpus spp.). Particles were passed through 4mm (6 mesh) and retained on 1mm (25 mesh). Urea formaldehyde resin was added 10 percent on ovendry weight of particle. Face veneer for complyboard was 0.9, 1.6 and 2.3mm in thickness and spread with 36 g/(30.48 cm)$^2$ glue on one side. Veneers were soaked with 10 percent solution of five fire retardant chemicals (diammonium phosphate, ammonium sulfate, monoammonium phosphate, Pyresote and Minalith), and particles with 5, 10, 15 and 20 percent solution of five chemicals. Particleboard and complyboard were evaluated on physical and mechanical properties, and fire retardancy. The results obtained were summarized as follows. 1. Among five fire retardant chemicals treated to particleboard and complyboard, the retention of ammonium sulfate in 5 percent solution showed the lowest as 1.39 kg/(30.48 cm)$^3$ exceeding the minimum retention of 1.125 kg/(30.48 cm)$^3$ recommended by Forest Products Laboratory and Koch. 2. Particleboard and complyboard treated with diammonium phosphate showed higher modulus of rupture (MOR), modulus of elasticity (MOE), internal bond strength and screw holding power than those with the other chemicals. 3. MOR and MOE of complyboard treated with fire retardant chemicals were greater than those of fire retardant particleboard. 4. Thickness swelling of fire retardant complyboard was lower than that of fire retardant particleboard. 5. The moisture content of the boards treated with Pyresote and Minalith increased and with monoammonium phosphate reduced. 6. Fire retardant particleboard showed no ignition, and fire retardant complyboard started ignition, but time required to ignite was prolonged comparing the controlboard. Complyboard with only shell veneer treated showed ignition and lingering flame, but lingering flame time was shorter than controlboard. Complyboard with treated both core and veneer showed ignition but not lingering flame. 7. Flame length, carbonized area and weight loss were smaller than controlboard but had no significant difference among chemicals treated. 8. Temperature of unexposed surface of fire retardant particleboard was lowered with the increasing concentration of five chemicals. 9. Temperature of unexposed surface of fire retardant particleboard was lowered with the highest in Pyresote and the lowest in Minalith. 10. Temperature of unexposed surface of fire retardant complyboard was lower than that of controlboard.

• Korean Chemical Engineering Research
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• v.51 no.2
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• pp.214-220
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• 2013

Hydrophobic coating on a silicate-based yellow phosphor ($Sr_2SiO_4:Eu^{2+}$) was carried out by using hexamethyldisiloxane (HMDSO) precursor in an atmospheric pressure dielectric barrier discharge plasma reactor, eventually to improve the long-term stability and reliability of the phosphor. The phosphor powder samples were characterized by a scanning electron microscope (SEM), a transmission electron microscope (TEM), a fluorescence spectrophotometer and a contact angle analyzer. After the coating was prepared, the contact angle of the phosphor powder increased to $133.0^{\circ}$ for water and to $140.5^{\circ}$ for glycerol, indicating that a hydrophobic layer was formed on its surface. The phosphor coated with HMDSO exhibited photoluminescence enhancement up to 7.8%. The SEM and TEM images of the phosphor powder revealed that the plasma coating led to a morphological change from grain-like structure to smooth surface with 31~46 nm thick hydrophobic layer. The light emitting diode (3528 1 chip LED) fabricated with the coated phosphor showed a substantial enhancement in the reliability under a special test condition at $85^{\circ}C$ and 85% relative humidity for 1,000 h (85/85 testing). The plasma-mediated method proposed in this work may be applicable to the formation of 3-dimensional coating layer on irregular-shaped phosphor powder, thereby improving the reliability.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.48 no.1
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• pp.77-83
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• 2011

In this thesis, 50W Doherty amplifier was designed and implemented for Beyond 3G's repeater and base-station. Auxiliary amplifier of doherty amplifier was implemented by Gate bias control circuit. Though gate bias control circuit solved auxiliary's bias problem, output characteristics of doherty amplifier was limited. To enhance the output characteristic relativize Drain control circuit And To improve power efficiency make 3-way Doherty power amplifier. therefore, 3-way GDCD (Gate and Drain bias Control Doherty) power amplifier is embodied to drain bias circuit for General Doherty power amplifier. The 3-way GDCD power amplifier composed of matching circuit with chip capacitor and micro strip line using FR4 dielectric substance of specific inductive capacity(${\varepsilon}r$) 4.6, dielectric substance height(H) 30 Mills, and 2.68 Mills(2 oz) of copper plate thickness(T). Experiment result satisfied specification of amplifier with gains are 57.03 dB in 2.11 ~ 2.17 GHz, 3GPP frequency band, PEP output is 50.30 dBm, W-CDMA average power is 47.01 dBm, and ACLR characteristics at 5MHz offset frequency band station is -40.45 dBc. Especially, 3-way DCHD power amplifier showed excellence efficiency performance improvement in same ACLR than general doherty power amplifier.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.9
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• pp.11-18
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• 2002

This paper presents a CPW phase shifter and shunt stub with air-bridge on a 10-${\mu}m$-thick oxidized porous silicon(OPS) substrate using surface micromachining. The line dimensions of the CPW phase shifter was designed with S-W-Sg = 100-30-400 ${\mu}m$. And the width and length of the air-bridge with "ㄷ“ shape were 100 ${\mu}m$ and 400-460-400 ${\mu}m$, respectively. In order to achieve low attenuation, stepped air-bridge CPW phase shift was proposed. The insertion loss of the stepped air-bridge CPW phase shift is more improved than that of no stepped air-bridge CPW phase shift. The measured phase characteristic of the fabricated CPW phase shifter is close to 180$^{\circ}$ over a very broad frequency range of 28 GHz. The measured working frequency of short-end series stub is 28.7 GHz and the return loss is - 20 dB. And the measured working frequency of short-end shunt stub is 28.9 GHz and the return loss is - 23 dB at midband. As a result, the pattering of stub in the center conductor of CPW lines can offer size reduction and lead to high density chip layouts.

• Journal of Radiation Protection and Research
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• v.13 no.2
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• pp.9-20
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• 1988

In order to quantify the contribution of cosmic-ray ionizing component to the dose given by natural background radiation, a series of measurement has been carried out using LiF TLDs for about one and a half years on quarterly basis. Three different types of LiF TLDs namely, chips and PTFE based disks of $^{7}LiF$, and the same disks of $^{6}LiF$ for identifying possible contribution of neutron component were used. Measurements were made by placing badge-incased TLDs in a lead castle of 10 to 15cm thick installed in a room on the third floor of a four-story building in CNU Daedeok campus for 5 cycles of 90 days. For comparison a series of spectrometric study was also performed for the energy region over 3MeV using a 3'${\phi}\;{\times}\;3$'NaI(Tl) scintillation detector in association with an MCA of 1024 channels, and it was found that the data obtained by the TLDs placed in the lead castle indicate 75% of the dose given by outdoor cosmic-ray component. The results obtained by the TLDs through correction for shielding loss show that the outdoor dose contribution of ionizing component of cosmic rays at this campus is $34.3{\pm}1.1nGy/h$ which satisfactorily agrees with that expected for our particular location of measurement.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.71-71
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• 2009

전자제품의 다양한 기능들의 융복합화 및 휴대 편의성 경향은 이제 더 이상 새로운 것이 아니다. 이러한 추세에 따라 전자부품들은 모듈화 되고, 휴대하기 용이해 지고 있다. 또한 다양한 제품 디자인에 적용하기 위해 제품에 장착되는 부품의 기구적 위치 배열의 한계 또한 제약 받고 있다. 따라서 최근의 전자부품은 모듈화 되고 있으며, 기구적 한계를 극복하기 위한 Flexible 모듈의 사용이 증가하고 있다. 또한 양산측면에서 Roll-to-Roll(R2R) 방식을 적용함으로써 생산성을 극대화 하고 있다. 이때 R2R 적용을 위해서는 제품이 굴곡 될 수 있도록 유연성이 보장되는 Bendable 전자모듈의 개발이 필수적으로 요구되고 있다. Flexible 기판은 더 이상 새로운 기술이 아니지만, Felxible 기판 내부에 칩이 내장되고, 회로가 형성되어 자체적으로 기능을 수행할 수 있도록 한 Bendable 전자모듈을 R2R 방식으로 제조하는 기술은 매우 새로운 접근이라 할 수 있다. 이러한 기술개발이 현실화 된다면, Wearable Electronics 및 Flexible Display 등 다양한 전자제품에 응용될 수 있을 것으로 기대된다. 그러나 이러한 제품의 상용화를 위해서는 Bendable 전자모듈에 대한 신뢰성이 확보되고, 제품으로써의 수명이 보증되어야 한다. 신규 개발되는 제품의 신뢰성 검증항목이나 수명평가 모델은 현재까지 제안되지 않고 있는 실정이다. 또한 다양한 사용 환경에서 고장(Failure) 발생을 유발하는 스트레스 인자(Stress Factor)를 도출함으로써, 가속시험 또는 신뢰성 검증을 위한 인가 스트레스를 선정할 수 있다. 그러나 이러한 고장물리를 기반으로 스트레스 인자를 해석한 결과는 아직 보고되고 있지 않다. 따라서 본 연구에서는 $50{\mu}m$ 두께의 Si Chip에 저항변화를 관찰하기 위한 회로를 형성한 후 폴리이미드 기판을 이용하여 Si Chip이 임베딩된 Bendable 전자모듈을 제작하였다. 전자모듈의 실사용 환경에서의 수명예측을 위한 사전단계로써 고장물리에 기반한 고장모드와 고장메카니즘을 해석하는 것이 최우선 수행되어야 하며, 이를 바탕으로 고장을 유발하는 스트레스 인자를 도출 하였다. 고장도출을 위해 시제품은 JEDEC J-STD-020C의 MSL시험, 고온가압시험, 열충격시험 및 고온저장시험을 각각 수행하였으며, 이로부터 발생된 각각의 고장유형을 분석함으로써 스트레스 인자를 도출하였다. 또한 모아레(Moire) 간섭계를 이용하여 제작된 샘플의 온도변화에 따른 변형해석을 수행하였고, 동시에 Half Symetry Model을 이용한 유한요소해석(FEA)을 수행하여 변형해석 및 스트레스 유발원인을 도출하였다. 이 결과로 부터 고장물리 기반의 고장해석과 Moire 분석 그리고 시뮬레이션 해석 결과를 바탕으로 Bendable 전자모듈의 고장유발 스트레스 인자를 해석할 수 있었다.

• Journal of Animal Environmental Science
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• v.17 no.2
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• pp.71-80
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• 2011

Trickling filter has been extensively studied for the domestic wastewater treatment especially for the small scale plants in rural area. The purpose of this research is to survey the physical and microbial characteristics of wood chip media and the removal efficiency of animal wastewater using wood chip trickling filter system. The trickling filtration system comprises a filtration bed packed with wood chip media having a particle dia. of 5~7cm. The method comprises natural air from the bottom of the bed. The system also comprises a control mechanism including a time a constant discharge pump for controlling supply of the wastewater into the bed. The following conclusions were obtained from the results of this research. 1. The specific surface area of wood chip was 0.4123 $m^2$/g, pore volume was 0.0947 $cm^3$/g, density was 0.49 g/$cm^3$. It has forms of parallelogram and oblong which have numerous small pore space. This wood chip has been good condition for microorganism's habitat, having very larger specific surface area by complex the three dimension structure of cellulose at wood's major ingredients. 2. The total counts of in attached aerobic microbes were ranged from $10^6$ to $10^8$ CFU/g, and anaerobes microbial numbers were from $10^4$ to $10^7$. The aerobic microbial numbers appeared to be much more than those of anaerobic microbial numbers. 3. The average efficiency of $BOD_5$ and CODcr were 74.5% and 51.5%, respectively. The removal efficiency of T-N and T-P were 61.4%, 56.2%, respectively. But SS removal levels remain 19.3%.