• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.18-18
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• 2007

지난 수년 동안 Sn-3.0Ag-0.5Cu 합금은 전자산업의 표준 무연솔더 조성으로 전자제품의 제작에 사용되어져 왔으며, 그 신뢰성도 충분히 검증되어 대표적인 무연 솔더 조성으로의 입지를 굳혀왔다. 그러나 전자제품의 mobile화에 따른 내충격 신뢰성에 대한 요구와 최근의 급격한 Ag 가격의 상승은 Ag 함량의 축소에 의한 원가절감을 요청하게 되었으며, 이에 따라 소량의 Ag를 함유하는 솔더 조성 개발에 대한 연구가 산업 현장을 중심으로 절실히 요청되고 있다. Sn-Ag-Cu의 3원계 함긍에서 Ag는 합금의 융점을 낮추고, 강도와 같은 합금의 기계적 특성을 증가시키는 한편, 모재에 대한 합금의 젖음성을 향상시키는데 필수적인 원소로 인식되고 있다. 따라서 Sn-Ag-Cu의 3원계 함금에서 Ag의 함량을 감소시키게 되면, 합금액 액상선 온도와 고상선 온도가 벌어져 pasty range(또는 mush zone)가 증가하게 되고, wettability도 감소하게 되어 솔더 합금으로서의 요구 특성을 많이 상실하게 된다. 또한 Ag 함량을 감소시키게 되면 합금의 elongation이 향상되면서 내 impact 수명이 향상되는 효과를 볼 수 있으나, 합금의 creep 특성 및 기계적인 강도는 감소하면서 열싸이클링 수명은 감소하는 경향을 나타내게 된다. 따라서 솔더 합금의 내 impact 수명과 열싸이클링 수명을 동시에 만족시키지 위해서는 Ag 함량을 최적화하기 위한 고려가 필요하며, 합금원소에 대한 연구가 요청된다고 하겠다. 한편 Ag의 함량을 3wt.% 이상으로 첨가할 경우에도 비교적 느린 응고 속도에서는 조대한 판상의 $Ag_3Sn$ 상을 형성하는 경향이 있어 외관 물량을 야기 시킬 가능성이 매우 커지는 현상도 보고되고 있다. 따라서 Ag의 첨가량을 최적화 하면서 솔더 재료로서의 특성을 계속적으로 유지하기 위해서는 제 4 원소의 함유가 필수적이라고 할 수 있다. 본 연구에서는 Sn-Ag-Cu계에 첨부하는 제 4원소로서 In을 선택하였다. 비록 In은 Ag보다 고가이기 때문에 산업적인 적용을 위한 솔더 합금 원소로는 거의 각광받지 못했으나, 본 연구의 결과로는 In은 매우 소량 첨가할 경우에도 Sn-Ag-Cu계 합금, 특히 소량의 Ag를 함유하는 Sn-Ag-Cu계 합금의 wettabilty와 기계적 특성 향상에 매우 효과적임을 알 수 있었다. 결론적으로 본 연구를 통해 구현된 Sn-Ag-Cu-In계 최적 솔더 조성의 경우 Sn-3.0Ag-0.5Cu의 표준 조성에 비하여 약 18%의 원자재 가격 절감을 도모할 수 있을 것으로 예상되는 한편. Sn-3.0Ag-0.5Cu에 유사하거나 우수한 wettability 특성을 나타내었고. Sn-1.0Ag-0.5Cu 또는 Sn-l.2Ag-0.5Cu-0.05Ni 조성보다는 월등히 우수한 wettability 특성을 나타내었다. 더구나 Sn-Ag-Cu-In계 최적 솔더 조성은 합금의 강도 저하는 최소화 시키면서 합금의 elongation은 극적으로 향상시켜 합금의 toughness 값이 매우 우수한 특성을 가짐을 알 수 있었다. 이렇게 우수한 toughness 값은 솔더 조인트의 대표적 신뢰성 요구 특성인 열싸이클링 수명과 내 impact 수명을 동시에 향상시킬 수 있을 것으로 예상된다. 요컨대 본 연구를 통해 구현된 Sn-Ag-Cu-In계 솔더 조성은 최적 솔더 조성에서 요구되는 4가지 인자, 즉, 저렴한 원재료 가격, 우수한 wettability 특성, 합금 자체의 높은 toughness, 안정하고 낮은 성장 속도의 계면 반응층 생성을 모두 만족시키는 특징을 가짐으로서 기존 무연솔더 조성의 새로운 대안으로 자리 잡을 것으로 기대된다.

• Journal of The Korean Society For Urban Railway
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• v.6 no.4
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• pp.327-337
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• 2018

Since the track of the ballastless steel plate girder bridge is connected to a main girder without a deck and a ballast, the impact generated by train passage is transferred directly to bridge main members, and it can cause frequent damage of the bridge as well as higher noise and vibration level. Applying the CWR (Continuously Welded Rail) technology can reduce this structural problems, and, to this end, it is necessary to understand the characteristics of factors influencing vehicle-track or track-bridge interaction. In this paper, experimental study results are presented for examining the longitudinal resistance characteristics of the track, including a rail fastener, a sleeper fastener, and a track skeleton, installed on a ballastless steel plate girder bridge. The experiment is conducted using a disposed bridge from service, which is transported to a laboratory. The experimental results show that the rail fastener satisfies the performance criteria of the longitudinal resistance presented in KRS TR 0014-15, and the longitudinal resistance of old and new type sleeper fasteners is higher than the values provided in the existing research. Also, the unloaded longitudinal resistance of the ballastless track is between the ballast and the concrete tracks.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.372-378
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• 2021

A body armor vest is a form of munition related directly to the safety and life of combatants. Therefore, it must meet the requirements for ballistic resistance. The ROK demands the performance of body armor vest meet the Level IIIA specified by the NIJ STD-0101.06 published by the US National Institute of Justice. This study performed acceptance tests on body armor vests. The factors for evaluating the ballistic resistance evaluated were not only whether it penetrates when shooting but also whether the BFS (Backface Signature) depth does not exceed 44 mm when it does not penetrate. The factors were assessed to determine if they were consistent or not. The BFS depth is affected by various test factors, such as the physical properties of the backing material and the changes in the amount of impact with the bullet velocity. In this study, an analysis of the bulletproof performance was performed by extracting the data with the same conditions using ANOVA to remove the influence of these external factors. The analysis revealed a correlation between the BFS depth, bullet velocity, vest conditions, and protection area. The mass production process was analyzed by estimating the Interval of BFS on each lot. Through this, a new methodology for ballistic resistance evaluation and paradigm for future quality assurance is suggested.

• Korean Journal of Agricultural and Forest Meteorology
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• v.9 no.3
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• pp.188-194
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• 2007

The relationships between pine mushroom emergence and meteorological factors were analyzed with three years (from 2003 to 2005) of measurement data at Yangyang site, in order to evaluate the effect of micrometeorological environment on pine mushroom production. fine mushroom was daily monitored and collected in the survey area during the its producing period (approximately one month). Pine mushroom production was highest in 2005 with the meteorological conditions of high temperature and frequent rainfalls in October. The production was lowest in 2004 due to dry conditions from mid September to late October, The meterological factors related to humidity (i.e., relative humidity, soil water content, and precipitation) were better correlated than those related to temperature (i.e., air and soil temperature, soil heat flux and solar radiation) with pine mushroom production. However, all of the correlation coefficients were statistically insignificant with values ranging from 0.15 to 0.46. Such poor correlations may be attributed to various other environmental conditions (e.g., topography, soil, vegetation, other fungi, the relationship between pine mushroom and pine forest) affecting pine mushroom production. We found that a mycelium requires a stimulation of low temperature (of three-day moving average) below $19.5^{\circ}C$, in order to farm a mushroom primordium which grows to pine mushroom after 16 days from the stimulation. We also found that the pine mushroom production ended when the soil temperature (of three-day moving average) fell below $14.0^{\circ}C$.

• Journal of Veterinary Clinics
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• v.31 no.6
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• pp.495-501
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• 2014

The objective of this study was to evaluate the differences and reproducibility of Hounsfield unit (HU) value and volume measurements on different computed tomography (CT) scanner types and different collimations by using a gelatin phantom. The phantom consisting of five synthetic simulated calculus spanning diameters from 3.0 mm to 12.0 mm with 100 HU was scanned using a two-channel multi-detector row CT (MDCT) scanner, a four-channel MDCT scanner, and two 64-channel MDCT scanners. For all different scanner types, the thinnest possible collimation and the second thinnest collimation was used. The HU values and volumes of the synthetic simulated calculus were independently measured three times with minimum intervals of 2 weeks and by three experienced veterinary radiologists. ANOVA and Scheff$\acute{e}$ test for the multiple comparison were performed for statistical comparison of the HU values and volumes of the synthetic simulated calculus according to different CT scanner types and different collimations. The reproducibility of the HU value and volume measurements was determined by calculating Cohen's k. The reproducibility of HU value and volume measurements was very good. HU value varied between different CT scanner types, among different beam collimations. However, there was not statistically significant difference. The percent error (PE) decreased as the collimation thickness decreased, but the decrease was statistically insignificant. In addition, no statistically significant difference in the PEs of the different CT scanner types was found. It can be concluded that the CT scanner type insignificantly affects HU value and the volumetric measurement, but that a thinner collimation tends to be more useful for accurate volumetric measurement.

• Journal of the Korean Society of Food Science and Nutrition
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• v.44 no.12
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• pp.1895-1904
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• 2015

Foodborne illness associated with food service establishments is an important food safety issue in Korea. In this study, foodborne pathogens (Bacillus cereus, Clostridium perfringens, Escherichia coli, pathogenic Escherichia coli, Listeria monocytogenes, Salmonella spp., Staphylococcus aureus, and Vibrio parahaemolyticus) and hygiene indicator organisms [total viable cell counts (TVC), coliforms] were analyzed for food and environmental samples from foodservice establishments at schools in Gyeonggi province. Virulence factors and antimicrobial resistance of detected foodborne pathogens were also characterized. A total of 179 samples, including food (n=66), utensil (n=68), and environmental samples (n=45), were collected from eight food service establishments at schools in Gyeonggi province. Average contamination levels of TVC for foods (including raw materials) and environmental samples were 4.7 and 4.0 log CFU/g, respectively. Average contamination levels of coliforms were 2.7 and 4.0 log CFU/g for foods and environmental swab samples, respectively. B. cereus contamination was detected in food samples with an average of 2.1 log CFU/g. E. coli was detected only in raw materials, and S. aureus was positive in raw materials as well as environmental swab samples. Other foodborne pathogens were not detected in all samples. The entire B. cereus isolates possessed at least one of the diarrheal toxin genes (hblACD, nheABC, entFM, and cytK enterotoxin gene). However, ces gene encoding emetic toxin was not detected in B. cereus isolates. S. aureus isolates (n=16) contained at least one or more of the tested enterotoxin genes, except for tst gene. For E. coli and S. aureus, 92.7% and 37.5% of the isolates were susceptible against 16 and 19 antimicrobials, respectively. The analyzed microbial hazards could provide useful information for quantitative microbial risk assessment and food safety management system to control foodborne illness outbreaks in food service establishments.

• Journal of Radiation Protection and Research
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• v.33 no.4
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• pp.127-134
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• 2008

Potential economic impact of a hypothetical severe accident at a nuclear power plant(Uljin units 3/4) was estimated by applying the Delphi method, which is based on the expert judgements and opinions, in the process of quantifying uncertain factors. For the purpose of this study, it is assumed that the radioactive plume directs the inland direction. Since the economic risk can be divided into direct costs and indirect effects and more uncertainties are involved in the latter, the direct costs were estimated first and the indirect effects were then estimated by applying a weighting factor to the direct cost. The Delphi method however subjects to risk of distortion or discrimination of variables because of the human behavior pattern. A mathematical approach based on the Bayesian inferences was employed for data processing to improve the Delphi results. For this task, a model for data processing was developed. One-dimensional Monte Carlo Analysis was applied to get a distribution of values of the weighting factor. The mean and median values of the weighting factor for the indirect effects appeared to be 2.59 and 2.08, respectively. These values are higher than the value suggested by OECD/NEA, 1.25. Some factors such as small territory and public attitude sensitive to radiation could affect the judgement of panel. Then the parameters of the model for estimating the direct costs were classified as U- and V-types, and two-dimensional Monte Carlo analysis was applied to quantify the overall economic risk. The resulting median of the overall economic risk was about 3.9% of the gross domestic products(GDP) of Korea in 2006. When the cost of electricity loss, the highest direct cost, was not taken into account, the overall economic risk was reduced to 2.2% of GDP. This assessment can be used as a reference for justifying the radiological emergency planning and preparedness.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of Oriental Neuropsychiatry
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• v.15 no.2
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• pp.149-158
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• 2004

만성적이거나 반복적인 스트레스는 우울중이나 심신병 등의 발병 기전과 밀접한 관련이 있다. 전기적 자극(electric foot shock), 한랭 자극, 속박(immobilization), 투쟁(fighting), 에테르 노출 등과 같은 심한 스트레스 자극이 뇌 조직의 시상 및 시상하부, 편도체 등에서의 노르아드레날린(noradrenalin) 방출을 유의 하게 감소시키는 동시에 혈청 corticosterone을 증가시키는 것으로 알려져 있다. 한의학에서는 스트레스 인자에 대한 신체반응을 기(氣)의 변화로 인식하고 있고, 이러한 자극요인들은 신체에 대하여 병적 요인을 제공하여 제반 질환을 야기한다. 또한 질병 발생에 대한 근거로 정기(正氣)와 사기(邪氣)의 상호 관계 위주로 인식하는데, 내부의 기(氣)의 변조(變調)는 질병의 발생을 야기하는 기초가 된다. 실험에 사용된 연근(蓮根)은 연꽃과에 속한 수생초본인 연꽃의 뿌리부분으로 우(藕) 또는 우절(藕節)이라는 명칭으로 불리기도 한다. 성미(性味)는 감(甘) 삽(澁) 평(平) 무독(無毒)하고 폐(肺) 위(胃) 간경(肝經)으로 들어가며 수렴지혈(收斂止血) 화어(化瘀)의 효능이 있어 토혈(吐血) 객혈(喀血) 뇨혈(尿血) 편혈(便血) 등의 각종 출혈 증상에 사용되어져 왔다. 최근 연꽃의 부위별 추출물이 흰쥐의 지질 과산화 생성을 효과적으로 억제하는 것으로 보고되고 있어 연근(蓮根)에 대한 다양한 약리 효능의 검색이 필요할 것으로 생각되며 연꽃의 씨앗인 연자육(蓮子肉)이 양심안신(養心安神)의 효능이 있어 스트레스성 질환에 많이 응용되고 있는 것에 착안하여 본 연구를 착수하였다. 실험 동물은 ICR계 마우스를 이용하였으며, 사회 심리적 스트레스는 옆쪽 cage에서 다른 마우스의 신체에 가해지는 전기 충격을 하루 1시간 동안 지켜보게 하는 것으로 유발하였으며 이 상태에서 약물을 투여한 그룹을 실험군, 그렇지 않은 그룹을 대조군으로 하였다. 정상군은 아무런 자극 없이 하루 1시간 동안 일정 공간에 가두어 두는 것으로 하였다. 실험 결과 사회 심리적 스트레스를 받은 경우에 아무런 처치를 하지 않은 대조군에 비해 연근 추출물을 100mg/kg/day 용량으로 5 일간 투여한 실험군에서 혈청 중 corticosterone 함량이 유의하게 감소하였으므로 매우 효과적으로 스트레스를 해소하였음을 알 수 있다. 뇌세포 중에서 신경전달물질로 분비되는 노르아드레날린의 분비량은 전반적으로 증가되는 경향을 나타내었으나 유의성은 없었다. 신체적 또는 사회 심리적 스트레스가 간 조직 내 지질의 과산화를 유발하는 것으로 나타났으며 연근 추출물이 이 결과에는 영향을 주지 못하였다. 사회 심리적 스트레스로 인하여 간 조직 내 지질과산화 정도가 증가하였으므로 혈청 내 ALT 함량도 따라 증가할 것으로 추정되었으며 이에 대한 연근 추출물 경구 투여가 간 조직을 보호할 수 있는지를 확인하기 위해 분리한 혈청으로부터 ALT 함량을 측정한 결과 대조군에 비하여 유의한 감소를 나타내었다. 또한 연근 추출물이 혈청 내 지질 과산화물의 생성을 억제할 수 있다면 질병의 예방과 치료에 효과적일 것으로 추정할 수 있으므로 그 생성량을 측정하여 보았으나 대조군과의 차이가 나타나지 않았다. 이상의 결과들을 종합하여 보면 스트레스가 부하된 5일 동안 연근(蓮根) 추출물을 함께 투여한 결과 혈청 corticosterone 함량을 유의하게 감소시켰고 뇌 조직내 noradrenaline 함량을 증가시키는 경향을 나타내어 스트레스 해소에 도움이 될 수 있음을 시사하였다. 또한 혈청 내 ALT 함량을 유의하게 감소시켜 스트레스로 인해 발생하는 간 기능의 손상도 어느 정도 억제시키는 것을 확인할 수 있었는데 앞으로 연근(蓮根)의 이러한 작용에 대한 보다 자세한 연구들이 필요한 것으로 생각된다.