The Study on the Wafer Surface and Pad Characteristic for Optimal Condition in Wafer Final Polishing (최적조건 선정을 위한 Pad 특성과 Wafer Final Polishing의 가공표면에 관한 연구)
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- Journal of the Korean Society of Manufacturing Process Engineers
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- v.11 no.1
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- pp.26-32
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- 2012