• Title/Summary/Keyword: 최인훈

Search Result 61, Processing Time 0.023 seconds

Characteristics of the SrBi2Nb2O9 Thin Films Deposited by RF Magnetron Sputtering with Controlling of Bi Contents (RF마그네트론 스퍼터링 법에 의해 증착된 SrBi2Nb2O9 박막의 Bi 량의 조절에 따른 특성분석)

  • Lee, Jong-Han;Choi, Hoon-Sang;Sung, Hyun-Ju;Lim, Geun-Sik;Kwon, Young-Suk;Choi, In-Hoon;Son, Chang-Sik
    • Korean Journal of Materials Research
    • /
    • v.12 no.12
    • /
    • pp.962-966
    • /
    • 2002
  • The $SrBi_2$$Nb_2$$O_{9}$ (SBN) thin films were deposited with $SrNb_2$$O_{6}$ / (SNO) and $Bi_2$$O_3$ targets by co-sputtering method. For the growth of SBN thin films, we adopted the various power ratios of two targets; the power ratios of the SNO target to $Bi_2$$O_3$ target were 100 W : 20 W, 100 W : 25 W, and 100 W : 30 W during sputtering the SBN films. We found that the electrical properties of SBN films were greatly dependent on Bi content in films. The $Bi_2$Pt and $Bi_2$$O_3$ phase as second phases occurred at the films with excess Bi content greater than 2.4, resulting in poor ferroelectric properties. The best growth condition of the SBN films was obtained at the power ratio of 100 W : 25 W for the two targets. At this condition, the crystallinity and electrical properties of the films were improved at even low annealing temperature as $700^{\circ}C$ for 1h in oxygen ambient and the Sr, Bi and Nb component in the SBN films were about 0.9, 2.4, and 1.8 respectively. From the P-E and I-V curves for the specimen, the remnant polarization value ($2P_{r}$) of the SBN films was obtained about 6 $\mu$C/c $m^2$ at 250 kV/cm and the leakage current density of this thin film was $2.45$\times$10^{-7}$ $A/cm^2$ at an applied voltage of 3 V.V.

The dependence of the properties of InP grown by chloride vapor phase epitaxy on the growth temperature and on the $PCl_3/H_2$ molar fraction (Chloride VPE법에 의한 InP 에피층 성장시 성장온도 및 $PCl_3/H_2$ 몰비에 따른 특성변화)

  • 김현수;신동석;최인훈
    • Journal of the Korean Vacuum Society
    • /
    • v.6 no.1
    • /
    • pp.61-68
    • /
    • 1997
  • We examined the dependence of the growth of undoped InP epilayer by chloride vapor phase epitaxy on the growth temperature and on the $PCl_3$molar fraction. The growth temperature was varied from $620^{\circ}C$ to $650^{\circ}C$ and the $PCl_3$molar franction from $2.5{\times}10^{-2}$ to $4.5{\times}10^{-2}$. The undoped InP epilayer with hillock free surface was obtained at the growth temperature of $640^{\circ}C$ and at the PCl$_3$molar fraction of $3.0{\times}10^{-2}$. The surface morphology was improved with a decrease of the PCl$_3$molar fraction. The carrier concentration measured by Hall and ECV was less than $1{\times}10^{14}cm^{-3}$. The resistivity of the undoped InP epilayer, measured by using four probe method, showed a high value of <$3.0{\times}10^6{\Omega}\textrm{cm}$.

  • PDF

Characteristics of $Pt/SrBi_2Ta_2O_9/ZrO_2/Si$ structures for NDRO ERAM (NDRO FRAM 소자를 위한 $Pt/SrBi_2Ta_2O_9/ZrO_2/Si$ 구조의 특성에 관한 연구)

  • 김은홍;최훈상;최인훈
    • Journal of the Korean Vacuum Society
    • /
    • v.9 no.4
    • /
    • pp.315-320
    • /
    • 2000
  • We have investigated the crystal structure and electrical properties of Pt/SBT/$ZrO_2$/Si (MFIS) and Pt/SBT/Si (MFS) structures for the gate oxide of ferroelectric memory. XRD spectra and SEM showed that the SBT film of SBT/$ZrO_2$/Si structure had larger grain than that of SBT/Si structure. $ZrO_2$ film between SBT film and Si substrate is confirmed as a good candidate for a diffusion barrier by the analysis of AES. The remanent polarization decreased and coercive voltage increased in Pt/SBT/$ZrO_2$/Pt/$SiO_2$/Si structure. This effect may increase memory window of MFIS structure directly related to the coercive voltage. From the capacitance-volt-age characteristics, the memory windows of Pt/SBT (210 nm)/$ZrO_2$ (28 nm)/Si structure were in the range of 1~l.5 V at the applied voltage of 4~6 V. The current densities of Pt/SBT/ZrO$_2$/Si with as -deposited Pt electrode and annealed at $800^{\circ}C$ in $O_2$ambient were $8\times10^{-8} A/\textrm{cm}^2$ and $4\times10^{-8}A/\textrm{cm}^2$ , respectively.

  • PDF

A study on the fabrication of $Pb(Fe^{0.5},Nb^{0.5}O_3$ thin films by a Co-sputtering technique and their characteristics properties (동시 스퍼터링법에 의한$Pb(Fe^{0.5},Nb^{0.5}O_3$박막의 제조 및 특성 평가에 대한 연구)

  • 이상욱;신동석;최인훈
    • Journal of the Korean Vacuum Society
    • /
    • v.7 no.1
    • /
    • pp.17-23
    • /
    • 1998
  • $Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$ thin films were prepared by rf magnetron co-sputtering method on $SiO_2/Si$, ITO/glass, and $Pt/Ti/SiO_2/Si$ substrates and post-annealed at the $N_2$ atmosphere by RTA(rapid thermal annerling). The degree of crystallinity of PFN films was identified on various substrates. Electrical properties of PFN films was characterized for $Pt/PFN/Pt/Ti/SiO_2/Si$ structure. The composition of PFN films was estimated by EPMA (electron probe micro analysis). PFN films would be crystallized better to perovskite phase on ITO/glass substrate than $SiO_2/Si$ substrate. This may be induced by the deformation of Pb deficient pyrochlore phase due to Pb diffusion into $SiO_2/Si$ substrate. PFN films on $Pt/Ti/SiO_2/Si$ substrate. PFN films with 5-10% Pb excess were crystallized to perovskite phase from $500^{\circ}C$ temperature. In summary, we show that Pb composition and annealing temperature were critically influenced on crystallinity to perovskite phase. When PFN film with 17% Pb excess was annealed at $600^{\circ}C$ at the $N_2$ atmosphere for 300kV/cm and 88. Its remnant polarization coercive field $2.0 MC/cm^2$ and 144kV/cm, respectively.

  • PDF

The Characteristics of the Wafer Bonding between InP Wafers and $\textrm{Si}_3\textrm{N}_4$/InP (Direct Wafer Bonding법에 의한 InP 기판과 $\textrm{Si}_3\textrm{N}_4$/InP의 접합특성)

  • Kim, Seon-Un;Sin, Dong-Seok;Lee, Jeong-Yong;Choe, In-Hun
    • Korean Journal of Materials Research
    • /
    • v.8 no.10
    • /
    • pp.890-897
    • /
    • 1998
  • The direct wafer bonding between n-InP(001) wafer and the ${Si}_3N_4$(200 nm) film grown on the InP wafer by PECVD method was investigated. The surface states of InP wafer and ${Si}_3N_4$/InP which strongly depend upon the direct wafer bonding strength between them when they are brought into contact, were characterized by the contact angle measurement technique and atomic force microscopy. When InP wafer was etched by $50{\%}$ HF, contact angle was $5^{\circ}$ and RMS roughness was $1.54{\AA}$. When ${Si}_3N_4$ was etched by ammonia solution, RMS roughness was $3.11{\AA}$. The considerable amount of initial bonding strength between InP wafer and ${Si}_3N_4$/InP was observed when the two wafer was contacted after the etching process by $50{\%}$ HF and ammonia solution respectively. The bonded specimen was heat treated in $H^2$ or $N^2$, ambient at the temperature of $580^{\circ}C$-$680^{\circ}C$ for lhr. The bonding state was confirmed by SAT(Scannig Acoustic Tomography). The bonding strength was measured by shear force measurement of ${Si}_3N_4$/InP to InP wafer increased up to the same level of PECVD interface. The direct wafer bonding interface and ${Si}_3N_4$/InP PECVD interface were chracterized by TEM and AES.

  • PDF

Physical and Electrical Characteristics of SrBi$_2$Ta$_2$O$_9$ thin Films Etched with Inductively Coupled Plasma Reactive Ion Etching System (유도결합형 플라즈마 반응성 이온식각 장치를 이용한 SrBi$_2$Ta$_2$O$_9$ 박막의 물리적, 전기적 특성)

  • 권영석;심선일;김익수;김성일;김용태;김병호;최인훈
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.9 no.4
    • /
    • pp.11-16
    • /
    • 2002
  • In this study, the dry etching characteristics of $SrBi_2Ta_2O_9$ (SBT) thin films were investigated by using ICP-RIE (inductively coupled plasma-reactive ion etching). The etching damage and degradation were analyzed with XPS (X-ray photoelectron spectroscopy) and C-V (Capacitance-Voltage) measurement. The etching rate increased with increasing the ICP power and the capacitively coupled plasma (CCP) power. The etch rate of 900$\AA$/min was obtained with 700 W of ICP power and 200 W of CCP power. The main problem of dry etching is the degradation of the ferroelectric material. The damage-free etching characteristics were obtained with the $Ar/C1_2/CHF_3$ gas mixture of 20/14/2 when the ICP power and CCP power were biased at 700 W and 200 W, respectively. The experimental results show that the dry etching process with ICP-RIE is applicable to the fabrication of the single transistor type ferroelectric memory device.

  • PDF

Characteristics of ferroelectric $YMnO_3$ thin film with low dielectric constant for NDRO FRAM (비파괴 판독형 메모리 소자를 위한 저유전율 강유전체 $YMnO_3$박막의 특성 연구)

  • 김익수;최훈상;최인훈
    • Journal of the Korean Vacuum Society
    • /
    • v.9 no.3
    • /
    • pp.258-262
    • /
    • 2000
  • $YMnO_3$thin films are deposited on Si(100) and $Y_2O_3/Si(100)$ substrate by radio frequency sputtering. The deposition condition of oxygen partial pressure and annealing temperature have significant influences on the preferred orientation of $YMnO_3$film and the size of memory window. The results of x-ray diffraction show that the film deposited in the oxygen partial pressure of 0% is highly oriented along c-axis after annealing at $870^{\circ}C$ for 1 hr in oxygen ambient. However, the films deposited on Si and $Y_2O_3/Si$ in the oxygen partial pressures of 20% show $Y_2O_3$ peak, the excess $Y_2O_3$ in the $YMnO_3$film suppresses the c-axis oriented crystallization. Especially memory windows of the $Pt/YMnO_3/Y_2O_3/Si$ capacitor are 0.67~3.65 V at applied voltage of 2~12 V, which is 3 times higher than that of the film deposited on $Y_2O_3/Si$ in 20% oxygen (0.19~1.21 V) at the same gate voltage because the film deposited in 0% oxygen is well crystallized along c-axis.

  • PDF

A Study on the Image of a Nurse in Korean Modern Novels (한국 현대소설에 나타난 간호사 이미지 연구)

  • Hwang, Hyo Sook
    • Journal of Digital Convergence
    • /
    • v.20 no.4
    • /
    • pp.725-735
    • /
    • 2022
  • This study analyzed how the literary works embodying nurses accommodate various discourses about nurses and reproduce them in literature. The subject of analysis is a Korean modern novel featuring a nurse, and 29 works were selected from 1927 to 2016. The analysis method is the content analysis of the novel among the qualitative research methods. The unit of analysis adopts a narrative or dialogue that deals with the image of a nurse in a novel as a unit of analysis, The image determining factors of previous studies were integrated and categorized into 4 types and considered. As a result of analyzing the image of a nurse in the novel, First, traditional image types include Lee Kwang-soo 『Love』, Kim Eui-jung 『Doctor Han』, Jo Jung-rae 『Han River』, Gong Ji-young's 「Field of Stars」, Baek Min-seok 「Poor Little Hans」 Second, social image types include Kang Kyung-ae 「Dark」, Kim Kyung-wook 「Heaven's Gate」, Choi Jeong-hee 「Cheonmaek」 Third, professional image types include Lee Cheong-jun 「Mr. Jo Man-deuk」, 「Discharge」, Choi In-hoon 『The Square』, Kim Yeon-soo 「The Night in the Tunnel Where I Listened to Jusaeng Tudipini」, Jeong Se-lang 『Public health teacher Ahn Eun-young』and Fourth, personal image types include Choi In-ho 「Apprentice Patient」, Kim Jeong-han 「The Third Ward」, Eun Hee-kyung 『Minor League』, Hoon Kim 「Hwajang」, Ha Seong-ran 「The Joy of Eating」, Kim Ji-yeon 「Hippocrates Love Song」, Park Kyung-ri 「Era of Distrust」, Jeong Mi-kyung 「The Lady of Arsenal」 typed as. Through the image of the nurse in the novel, the implications of the novel for human care were discussed.

Ion Transmittance of Anodic Alumina for Ion Beam Nano-patterning (이온빔 나노 패터닝을 위한 양극산화 알루미나의 이온빔 투과)

  • Shin S. W.;Lee J-H;Lee S. G.;Lee J.;Whang C. N.;Choi I-H;Lee K. H.;Jeung W. Y.;Moon H.-C.;Kim T. G.;Song J. H.
    • Journal of the Korean Vacuum Society
    • /
    • v.15 no.1
    • /
    • pp.97-102
    • /
    • 2006
  • Anodic alumina with self-organized and ordered nano hole arrays can be a good candidate of an irradiation mask to modify the properties of nano-scale region. In order to try using porous anodic alumina as a mask for ion-beam patterning, ion beam transmittance of anodic alumina was tested. 4 Um thick self-standing AAO templates anodized from Al bulk foil with two different aspect ratio, 200:1 and 100:1, were aligned about incident ion beam with finely controllable goniometer. At the best alignment, the transmittance of the AAO with aspect ratio of 200:1 and 100:1 were $10^{-8}\;and\;10^{-4}$, respectively. However transmittance of the thin film AAO with low aspect ratio, 5:1, were remarkably improved to 0.67. The ion beam transmittance of self-standing porous alumina with a thickness larger than $4{\mu}m$ is extremely low owing to high aspect ratio of nano hole and charging effect, even at a precise beam alignment to the direction of nano hole. $SiO_2$ nano dot array was formed by ion irradiation into thin film AAO on $SiO_2$ film. This was confirmed by scanning electron microscopy that the $SiO_2$ nano dot array is similar to AAO hole array.

Electrical Characteristics of Pt/SBT/${Ta_2}{O_5}/Si$ Structure for Non-Volatile Memory Device (비휘발성 메모리를 위한 Pt/SBT/${Ta_2}{O_5}/Si$ 구조의 전기적 특성에 관한 연구)

  • Park, Geon-Sang;Choe, Hun-Sang;Choe, In-Hun
    • Korean Journal of Materials Research
    • /
    • v.10 no.3
    • /
    • pp.199-203
    • /
    • 2000
  • $Ta_2_O5$ and $Sr_0.8Bi_2.4Ta_2O_9$ films were deposited on p-type Si(100) substrates by a rf-magnetron sputtering and the metal organic decomposition (MOD), respectively.The electrical characteristics of the $Pt/SBT/Ta_2O_5/Si$ structure were obtained as the functions of $O_2$ gas flow ratio during the $Ta_2_O5$ sputtering and $Ta_2_O5$ thickness. And to certify the role of $Ta_2_O5$ as a buffer layer, the electrical characteristics of $Pt/SBT/Ta_2O_5/Si$ were compared. $Pt/SBT/Ta_2O_5/Si$ capacitor with 20% $O_2$ gas flow ratio during the $Ta_2_O5$ sputtering did now show typical C-V curve of metal/ferroelectric/insulator/semiconductor (MFIS) structure. The capacitor with 20% $O_2$ gas flow ratio during the $Ta_2_O5$ sputtering had the largest memory window. And the memory window was decreased as the $Ta_2_O5$ gas flow ratio during the $Ta_2_O5$ sputtering was increased to 40%, 60%. In the C-V characteristics of the $Pt/SBT/Ta_2O_5/Si$ capacitors with the different $Ta_2_O5$ thickness, the capacitor with 26nm thickness of $Ta_2_O5$ had the largest memory window. The C-V and leakage current characteristics of the Pt/SBT/Si structure were worse than those of $Pt/SBT/Ta_2O_5/Si$ structure. These results and Auger electron spectroscopy (AES) measurement showed that $Ta_2_O5$ films as a buffer layer tool a role to prevent from the formation of intermediate phase and interdiffusion between SBT and Si.

  • PDF