• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.850-853
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• 2000

It is well-known that Electro-rheological(ER) fluid is a material(suspension) which shows the dramatic change of rheological properties under an electric field. Using these properties, the concept that variable apparent viscosity of ER fluid could be applicable to the polishing for micro parts was introduced. It was investigated that how it works for polishing and how it affects ER effect when abrasives were mixed with an ER fluid. Therefore a few structures for polishing using ER fluid was suggested and evaluated by means of experiments. In this paper, fundamental mechanism and experimental results are described.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.7
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• pp.4405-4410
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• 2015

Two-dimensional displacements are obtained from the sandwiched patterns, which superpose two linearly-periodic patterns orthogonally, respectively. The transparent top pattern is identified by deflection of the laser beam due to a difference of refractivity and the opaque bottom pattern is identified by deviation of the beam intensity due to a difference of reflectance. In the sample setup, the top pattern made up of build-up film is manufactured by UV laser machining and the bottom pattern is manufactured by ultra-precision trench machining and deposition for aluminum plate. The proposed decoding method is verified experimentally using the $10{\mu}m$ equally spaced sample patterns and the devised optical system. The Korea Academia-Industrial cooperation Society.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.