• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.303-304
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.249-250
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.246-246
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• 2004

현재 비구면렌즈를 만들기 위해서는 다양한 방법이 있다. Glass종류의 가공시 초정밀 절삭가공기(DTM)에서 가공하거나 정밀 연삭기를 가지고 가공하게 된다. 이 과정에서 렌즈 표면에 공구 흔적이나 표면거칠기 개선을 위해 연마작업을 하게 되는데, 사용하는 장비가 폴리싱 머신이다. 축대칭인 폴리싱머신의 경우 X, Z, $\theta$로 동시 3축제어가 가능하다. 하지만 이 장비의 경우 연마에서 원하는 형상정밀도와 표면거칠기를 얻기 위해 각축들의 위치정밀도와 분해능이 높은 부품을 사용하여 기계자체가 고가라는 점이 단점으로 작용한다.(중략)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.211-212
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• 2011

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.178-178
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• 2009

High-density optical information storing equipment, which is using Blu-ray, is the next generation information storing equipment that has about form six times to thirty-five times capacities. and high-density optical information storing equipment uses high NA(Numerical Aperture) aspheric glass objective lens as optical pick-up equipment to record and recognize high-density date. Generally this objective lens is developed and produced through a way of GMP(Glass Molding Press) that uses molding core that is performde by Ultra precision grinding, but grinding performing that has high-accuracy is very difficult because objective lens form is high NA. In this research, we preformed Ultra precision turning, using single crystal diamond bite, about WC(Co 0.5%), sintering brittleness material that is used molding core's material for GMP. and we confirmed aspheric glass lens compression of deformities molding core's Ultra precision turning possibility by measuring surface roughness(Ra) and processing surface's condition.

• 한국공작기계학회논문집
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• 제15권4호
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• pp.44-48
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• 2006

Recently, demand the ultra precision product which is increasing rapidly is used extensively frontier industry field such as semi-conductor, computer, aerospace, precision machine. Ultra precision processing is the portion that is very needed to NT in the field of mechanical engineering. The latest date, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts those are connected with these industrial fields. Specially, require motion accuracy of high resolution of nm order in stroke of hundreds millimeters according as diameter of processing object great and processing accuracy rises. In this case ,the response speed absolute delay because inertial mass of moving part is very large. Therefore, real time motion error compensation becomes very hardly. In this paper, we used ultra precision cutting unit(UPCU) to cope such problem. a UPCU is designed and tested to obtain sub-micrometer from accuracy in diamond turning of flat surfaces. The thermal growth spindle error is compensated for real time using a UPCU driven by piezoelectric actuator along with a laser encoder displacement sensor.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.414-417
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• 2005

Single point diamond turning technique for optical crystals is studied in this paper. The main factors which are influential the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimal machining conditions for ductile cutting of optical crystals and to apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material(Ge). Many technical challenges are being tried for the large space infrared telescope, which is one of the major objectives of the National Strategic Technology Road Map (NSTRM).

• 한국기계가공학회지
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• 제2권1호
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• pp.57-62
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• 2003

Machining technique for optical crystals with single point diamond turning tool is reported in tills paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. SPDT has been widely used in manufacturing optical reflectors of non-ferrous metals such as aluminum and copper which are easy to be machined for their proper ductility. But optical crystals being discussed here are characterized by their high brittleness which makes it difficult to obtain high quality optical surfaces on them. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result, the cutting force is steady, the cutting force range is 0.05-0.08N. The surface roughness is good when spindle is above 1400rpm, and feed rate is small. The influence of depth of cut is very small.

• 한국정밀공학회지
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• 제24권11호
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• pp.52-58
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• 2007

A cutting device capable of generating various shapes of the cyclic elliptical trajectory of a cutting tool was proposed and micro v-grooving experiments were performed to investigate the characteristics of elliptical vibration cutting (EVC). The proposed cutting device is comprised of a pair of parallel piezoelectric actuators with which harmonic voltages of varying phase difference and magnitude are supplied, creating various shapes of the elliptical tool path. The attributes of the elliptical locus involving the direction of the axis of an ellipse, the rotational direction and amplitudes of a trajectory were fine-tuned for stable operation of the EVC. The EVC characteristics performed with brass and copper revealed reduction in the cutting resistance and suppression of burr formation, resulting in the enhancement of form accuracy of machined micro-features. While the effect of the EVC increases with the increase of excitation frequency and the amplitude, it is found that a change in the cutting force decreases as the amplitude of an elliptical locus increases.

• 대한기계학회논문집
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• 제14권6호
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• pp.1515-1522
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• 1990

본 연구에서는 천연다이아몬드의 인선형상을 R형과 S형으로 구분하여 제작하 고 미세이송과 절삭속도 변화를 주어 이에 얻어지는 표현거칠기, 칩 생성기구 및 경면 성을 검토하였다.