• Journal of the Korean Society for Nondestructive Testing
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• v.14 no.3
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• pp.194-205
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• 1994

이종재료 접합재의 연구개발(R&D)이나 품질보증(QA)분야에서 최적 접합조건의 신속한 결정과 사용중 접합재의 접합강도에 결정적으로 영향을 미치는 접합계면의 박리 미접합부등의 비파괴진단 평가기법에 적극 활용되고 있는 초음파비파괴평가(UNDE)기법의 주된 특징과 적용한계, 향후 연구되어야할 과제등을 최근의 특징적인 연구경향과 적용예를 중심으로 소개하고자 한다. 본고(本稿)에서 기술하는 초음파비파괴평가기법은 부분적으로는 기술의 안정화단계에 까지 상당히 접근하여, 현재 국내 반도체산업의 품질보증분야에서는 접합재료 접합계면의 비파괴적해석에 그 유용성이 어느정도 확인되고 있으나 정량적비파괴평가(QNDE)와 검사시스템의 꽃이라 불리는 전문가시스템화에의 접근에는 아직 해결되어야할 문제가 많다. 따라서, 저자들은 앞으로 접합재료 접합계면의 비파괴적해석에 관련한 연구사례와 결과를 정량적비파괴평가의 중요성과 방향성에 초점을 두고 본학회지를 통하여 계속 연재할 계획이다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.19-26
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.

• Proceedings of the KAIS Fall Conference
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• 2012.05b
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• pp.759-761
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• 2012

초음파는 정보 측정분야와 에너지를 이용한 용접 및 가동 등에서 널리 사용되고 있으며 최근에는 이 종금속 접합방법에 있어 초음파 에너지를 이용한 용접이 사용되고 있다. 진공유리 최종공정인 배기공정에 있어 연납과 유리의 접합에 초음파 에너지를 사용하고 있는데 초음파 접합기 하단부의 O링이 열에 의해 변형이 되어 기밀이 유지되지 않게 된다. 본 연구에서는 혼 하단부와 O링의 온도를 최적으로 유지하기 위해 냉각유로를 설치하여 O링의 온도에 미치는 영향에 대해 고찰하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.79-79
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• 2009

Ultrasonic fine welding, cutting, cleaning, inspection and measurement is widely used in various fields over 20kHz. However, for High Frequency of 60kHz or more study areas is still insufficient, and the result is lacking. Therefore, this study used ultrasonic horn to the Bonding of Dissimilar Materials for effective design. Finite element analysis (FEA) is using the equations of motion to establish the model. The optimal design for the basic interpretation of vibration characteristics of the ultrasonic measures horn will examine the design.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.283-286
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• 2000

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.2
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• pp.163-168
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• 2001

Due to aging, adhesively bonded and riveted aircraft lap joints can contain distends, cracks around rivet holes, fatigue induced flaws, and corrosion. It is required for the safety of aircraft to inspect these defects through the whole region of mint in rapid speed. Bond quality or adhesively bonded and riveted aluminum lap splice joints is investigated using non-contact remote ultrasonic nondestructive evaluation (NDE). Non-contact ultrasonic tests are performed using laser generation and air-coupled transducer detection. A Q-switched Nd:YAG laser and a periodic transmission mask are used to generate a selected Lamb mode. The Lamb wave is generated on one side of the lap splice joint, propagates along the plate, interacts with the joint and is detected on the other side by a micromachined air-coupled capacitance transducer. Analysis of recorded signals allows to evaluate the condition of the bond.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.437-443
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• 2010

In recent years, as nano scale structured thin film technology has emerged in various fields such as the materials, biomedical and acoustic sciences, the quantitative nondestructive adhesion evaluation of thin film interfaces using ultra high frequency scanning acoustic microscopy(SAM) has become an important issue in terms of the longevity and durability of thin film devices. In this study, an effective technique for investigating the interfaces of nano scale structured thin film systems is described, based on the focusing of ultrasonic waves, the generation of leaky surface acoustic waves(LSAWs), V(z) curve simulation and ultra high frequency acoustical imaging_ Computer simulations of the V(z) curve were performed to estimate the sensitivity of detection of micro flaws(i.e., delamination) in a thin film system. Finally, experiments were conducted to confirm that a SAM system operating at a frequency of 1 GHz can be useful to visualize the micro flaws in nano structured thin film systems.