• Title/Summary/Keyword: 진공증착중합

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A study on the curing characteristics of polyimide thin film fabricated by vapor deposition polymerization (진공증착중합법에 의해 제조된 6FDA/DDE 폴리이미드박막의 열처리에 따른 특성에 관한 연구)

  • Lee, B.J.;Kim, H.G.;Jin, Y.Y.;Park, G.B.;Kim, Y.B.;Lee, D.C.
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1552-1554
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    • 1997
  • In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-IR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From AFM and ellipsometer experimental, the higher curing temperature is, the films thickness decreases and reflectance increases. Therefore, PI could be fabricated stable by increasing curing temperature.

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A Study on the Humidity Sensing Properties of Polyimide thin films prepared (진공증착중합법에 의해 제초된 폴리이미드 박막의 습도감지 특성에 관한 연구)

  • 황선양;김형권;이붕주;박구범;김영봉;이은학;이덕출
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.402-405
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    • 1999
  • The Study of this paper is to establish the optimum fabricating condition of specimens using Vapor Deposition Polymerization Method which belongs to a mode of preparation of functional organic thin films with dry process and to develop thin film type humidity sensor which has good humidity sensitive Characteristics. Scanning electron microscopy Atomic force microscopy were used to analyze the characteristics of thin film and the basic structure of the humidity sensor is a parallel capacitor which consists of three layers of Al/PI/Al. The characteristics of fabricated samples were measured under various conditions and obtained linear characteristics in the range of 20∼80%RH independent of temperature change and low hysteresis characteristics.

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Electrical Properties and Preparation of 6FDA/4-4'DDE Polyimide Thin Films by Vapor Deposition Polymerization Method (진공증착중합법을 이용한 6FDA/4-4'DDE 폴리이미드 박막의 제조와 전기적 특성)

  • Hwang, S.Y.;Lee, B.J.;Kim, H.G.;Kim, Y.B.;Park, K.S.;Lim, H.C.;Kang, D.H.;Park, K.H.;Lee, D.C.
    • Proceedings of the KIEE Conference
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    • 1998.07d
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    • pp.1487-1489
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    • 1998
  • In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-lR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and reflectance increases. Therefore, Pl could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about $1.05{\times}10^{15}{\Omega}cm$ at $30^{\circ}C$.

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