• Journal of the Korean Society for Precision Engineering
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• v.33 no.4
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• pp.279-286
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• 2016

To enhance the safety of nuclear reactors after the Fukushima accident, researchers are developing various types of accident tolerant fuel (ATF) to increase the coping time and reduce the generation of hydrogen by oxidation. Coated cladding, an ATF concept, can be a promising technology in view of its commercialization. We applied 3D printing technology to the fabrication of coated cladding as well as of coated pellets. Direct metal tooling (DMT) in 3D printing technologies can create a coated layer on the tubular cladding surface, which maintains stability during corrosion, creep, and wear in the reactor. A 3D laser coating apparatus was built, and parameter studies were carried out. To coat pellets with erbium using this apparatus, we undertook preliminary experiments involving metal pellets. The adhesion test showed that the coated layer can be maintained at near fracture strength.

• Journal of Drive and Control
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• v.16 no.3
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• pp.42-50
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• 2019

3D printing AM processes have advantages in complex shapes, customized fabrication and prototype development stage. However, due to various parameters based on both the machine and the material, the AM process can produce finished output after several trials and errors in the initial stage. As such, minimizing or optimizing negative factors for various parameters of the 3D printing AM process could be a solution to reduce the trial-and-error failures in the early stages of such an AM process. In addition, this can be largely solved through software simulation in the preprocessing process of 3D printing AM process. Therefore, the objective of this study was to investigate a simulation technology for the AM software, especially Ansys Inc. The metal 3D printing AM process, the AM process simulation software, and the AM process simulation processor were examined. Through this study, it will be helpful to understand 3D printing AM process and AM process simulation processor.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.206.1-206.1
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• 2014

최근 전자 장비의 금속 전도성 패턴 제작에 있어서 직접적인 프린트가 가능한 프린팅 기술이 기존의 복잡한 photolithography 를 대체할 기술로 주목 받고 있다. 이와 함께 금속 전도성 패턴 제작에 사용되는 고가의 전도성 물질인 Ag ink 및 paste 를 저가의 Cu ink 및 paste 로 대체하기 위한 연구가 진행되고 있다. 하지만 일반적으로 copper 는 대기 중 에서 쉽게 산화되어 높은 저항을 야기시킨다. 따라서 Cu ink 또는 paste 를 제작할 때 copper nanoparticles 을 유기 용매에 분산하여 inert atmosphere에서 합성하거나 [1] copper ink 또는 paste 를 substrate 에 프린트하여 reduction atmosphere 에서 소성시킨다 [2]. 이번 연구에서 Cu paste 를 유리 기판에 screen printing 하여 혼합가스(질소 95%, 수소 5%)와 질소 가스 분위기에서 소성하여 Cu 전극의 소성 거동과 전기적 특성을 분석하였다. 4-point probe를 통해 소성된 Cu 전극의 저항을 측정하여 전도도를 조사하였으며 Thermal Gravimetric Analysis (TGA), Fourier Transform Infrared(FTIR)를 통해 소성된 Cu 전극의 유기물 분해가 전도도에 미치는 영향을 분석하고 Field Emission Scanning Electron Microscopy (FESEM)과 High Resolution Transmission Electron Microscopy (HRTEM)을 통해 Cu nanoparticles 의 grain growth가 전도도에 미치는 영향을 조사하였다.

• Journal of Drive and Control
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• v.16 no.3
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• pp.51-58
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• 2019

The objective of this study was to investigate a simulation technology for the AM field based on ANSYS Inc.. The introduction of metal 3D printing AM process, and the examining of the present status of AM process simulation software, and the AM process simulation processor were done in the previous study (part 1). This present study (part 2) examined the use of the AM process simulation processor, presented in Part 1, through direct execution of Topology Optimization, Ansys Workbench, Additive Print and Additive Science. Topology Optimization can optimize additive geometry to reduce mass while maintaining strength for AM products. This can reduce the amount of material required for additive and significantly reduce additive build time. Ansys Workbench and Additive Print simulate the build process in the AM process and optimize various process variables (printing parameters and supporter composition), which will enable the AM to predict the problems that may occur during the build process, and can also be used to predict and correct deformations in geometry. Additive Science can simulate the material to find the material characteristic before the AM process simulation or build-up. This can be done by combining specimen preparation, measurement, and simulation for material measurements to find the exact material characteristics. This study will enable the understanding of the general process of AM simulation more easily. Furthermore, it will be of great help to a reader who wants to experience and appreciate AM simulation for the first time.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.65-70
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• 2023

Nanoimprint lithography (NIL) has attracted much attention due to its process simplicity, excellent patternability, process scalability, high productivity, and low processing cost for pattern formation. However, the pattern size that can be implemented on metal materials through conventional NIL technologies is generally limited to the micro level. Here, we introduce a novel hard imprint lithography method, extreme-pressure imprint lithography (EPIL), for the direct nano-to-microscale pattern formation on the surfaces of metal substrates with various thicknesses. The EPIL process allows reliable nanoscopic patterning on diverse surfaces, such as polymers, metals, and ceramics, without the use of ultraviolet (UV) light, laser, imprint resist, or electrical pulse. Micro/nano molds fabricated by laser micromachining and conventional photolithography are utilized for the nanopatterning of Al substrates through precise plastic deformation by applying high load or pressure at room temperature. We demonstrate micro/nanoscale pattern formation on the Al substrates with various thicknesses from 20 ㎛ to 100 mm. Moreover, we also show how to obtain controllable pattern structures on the surface of metallic materials via the versatile EPIL technique. We expect that this imprint lithography-based new approach will be applied to other emerging nanofabrication methods for various device applications with complex geometries on the surface of metallic materials.