• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1618-1623
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• 2019

In this paper, inductive couplers realizing broadband powerline communication (PLC) are fabricated using Fe-based nanocrystalline alloy and their performance is analyzed. As a result of the field tests using the distribution automation system (DAS), the couplers achieve comparatively excellent data communication in the principal frequency band of broadband PLC although there is a difference in communication rate depending on the presence or absence of a branch. In addition, it has been confirmed that the communication speed is maintained for a real-time transmission even in a high current environment although there is a difference in the transmission rate depending on the distance. Hence, it is considered that the inductive couplers can be used as a core device to realize the intelligent power network by exploiting them for the monitoring and remote controlling of the power plant equipments for the DAS located in the inaccessible areas.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.1-9
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• 2024

This paper addresses the significance of Cu/Polymer Hybrid Bonding technology in the advancement of semiconductor packaging. As the demands of the AI era increase, the semiconductor industry is exploring heterogeneous integration packaging technologies to achieve high I/O counts, low power consumption, efficient heat dissipation, multifunctionality, and miniaturization. The conventional Cu/SiO₂ Hybrid Bonding structure faces limitations such as achieving compatibility with CMP processes to attain surface roughness below 1nm and the occurrence of bonding defects due to particles. However, Cu/Polymer Hybrid Bonding technology, utilizing polymers, is gaining attention as a promising alternative to overcome these challenges. This study focuses on the deposition, patterning, and material properties of polymers essential for Cu/Polymer Hybrid Bonding, highlighting the advantages and potential applications of this technology compared to existing methods. Specifically, the use of polymers with low glass transition temperatures (Tg) is discussed for their benefits in low-temperature bonding processes and improved mechanical properties due to their high coefficients of thermal expansion. Furthermore, the study explores surface property modifications of polymers and the enhancement of bonding mechanisms through plasma treatment. This research emphasizes that Cu/Polymer Hybrid Bonding technology can serve as a critical breakthrough in developing high-performance, low-power semiconductor devices within the industry.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4773-4779
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• 2012

In this paper we propose two types of reconfigurable 3-D beam steering antenna for intelligent or smart antenna system. Proposed antennas are composed of triangular(structure1.) or circuler(structure2.) loop structure and bended dipole antenna structure. This antenna can steer beam pattern of 6 direction at xy-plane state (0, 1, 2) and xz-plane state (3, 4, 5) by 4 switch motion with one antenna element. Antenna structure1. is symmetric equilibrium structures based on feeding point. There is no grounding point. As a result, designed antenna's gain is similar to dipole antenna. Also, As unbalanced structure by using CPWG in the form of a semicircular, structure2. is enhanced directivity. The operation frequency of antenna are 2.5 GHz(Structure1.) and 2.55 GHz(Structure2.), maximum gain is 1.04 ~ 2.06 dBi(Structure1. : Omni-directional beam), 1.6 ~ 4 dBi(structure2. : Directional beam). The overall HPBW is about over $160^{\circ}$ in the both of the xy-plane and xz-plane at structure1. and over $125^{\circ}$ at structure2.

• Journal of Sensor Science and Technology
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• v.7 no.1
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• pp.31-38
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• 1998

Multi-channel sensors can be used to increase the reliability and remove the random iloise in ion-sensitive field effect transistors(ISFETs). Multi-channel sensors is also an essential step toward potential fabrication of sensors for several ionic species in one device. However, when the multi-channel sensors are separately biased, the biasing problems become difficult, that is to say, the bias circuit is needed as many sensors. In this work, a circuit for biasing the four pH-ISFETs in null-balance method, where bias voltages are switched, was proposed. The proposed concept is need only one bias circuit for the four sensors. Therefore it has advantages of smaller size and lower power consumption than the case that all sensors are separately biased at a time. The proposed circuit was tested with discrete devices and its performance was investigated. In the recent trend, sensor systems are implemented as portable systems. So the verified measurement circuit was integrated by using the CMOS circuit. Fortunately, ISFET fabrication process can be compatible with CMOS process. Full circuit has a mask area of $660{\mu}m{\times}500{\mu}m$. In the future, this step will be used for developing the smart sensor system with ISFET.