• Proceedings of the KSME Conference
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• 2000.04b
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• pp.246-251
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• 2000

In the present study, the analysis on heat and fluid flow in the single screw extruder is carried out by simultaneously considering the metering section and the die. The finite difference method and the finite volume method are applied to the metering section and the die, respectively. The zonal method is used to couple the metering section and the die. To investigate the effect of die on the characteristics of heat and fluid flow in the single screw extruder, the pressure back flow is included in the analysis. The screw-tip rotation is also considered by employing the quasi 3-dimensional die model. The present results are compared with the numerical and experimental data available in the literatures.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.