• Title/Summary/Keyword: 접합 계면

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Stress Intensity Factors of a Crack Embedded in Bonded Elastic Layers (접합된 탄성층 내에 존재하는 균열의 응력강도계수)

  • 박재학
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.15 no.5
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    • pp.1538-1550
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    • 1991

  • 본 연구에서는 접합된 두 층이 유한한 두께를 가지고, 또한 균열은 임의의 각 도로 기울어져 있는 경우의 문제를 해석하여 층의 두께 등이 응력강도계수에 미치는 영향을 살펴보았다.

  • https://doi.org/10.22634/KSME.1991.15.5.1538 인용 PDF

Anodic bonding Characteristics of MLCA to Si-wafer Using Evaporated Pyrex #7740 Glass Thin-Films for MEMS Applications (파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성)

  • Chung, Gwiy-Sang;Kim, Jae-Min;Yoon, Suk-Jin
    • Journal of Sensor Science and Technology
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    • v.12 no.6
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    • pp.265-272
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    • 2003

  • This paper describes anodic bonding characteristics of MLCA (Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100%, input power $1\;W/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA and Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-0.08 %FS. Moreover, any damages or separation of MLCA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MLCA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

  • https://doi.org/10.5369/JSST.2003.12.6.265 인용 PDF KSCI