• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2277-2286
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• 2002

The application of bonded dissimilar materials to industries as automobiles, aircraft, rolling stocks, electronic devices and engineering structures is increasing gradually because these materials, compared to the homogeneous materials, have many advantages for material properties. In spite of such wide applications of bonded dissimilar materials, the evaluation method of quantitative strength considering the stress singularities for its bonded interface has not been established clearly. In this paper, the stress singularity for Bctors and the stress intensity factors were analyzed by boundary element method(BEM) for the scarf joints of Al/Epoxy with and without a crack, respectively. From static fracture experiments of the bonded scarf joints, a fracture criterion and a evaluation method of interface strength in bonded dissimilar materials were proposed and discussed.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.43-50
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• 2002

Friction welding has many merits such as energy efficiency, simple processing, etc butt difficult to obtain good weld at the welded interface and heat affected zone. To date, the continuum mechanics and fracture mechanics are utilized to analyse stresses at the interface and propagation of cracks. In this study. STS304 and SM15C are selected because they can be differentiated distinctively from metallic point of view and crack can be observed easily. It is ovserved during friction welding that STS304, rotary part is hatter than SH15C, fixed part. The last fracture occurs around the center because the surface of fatigue fracture has smooth regions, due to the separation phenomenon in plastic flows layers and striation dimple pattern.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.221-221
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• 2003

본 연구에서는 스핀밸브 다층박막에서 교환 바이어스에 영향을 끼치는 요인 중 하나인 강자성층과 반강자성층사이의 접합 계면에서의 표면 거칠기 [1,2]를 줄이기 위해 현재 반도체 공정에 사용되고 있는 이온빔 에칭 장비를 사용하여 스핀 밸브 다층박막의 씨앗층 에칭에 따른 교환 바이어스를 알아보고자 하였다. 스핀밸브 구조는 강자성층/비자성층/강자성층의 기본구조를 갖는데 이중 하나의 강자성층의 스핀방향이 반강자성층에 의해 고정되는 구조[3]로써 이러한 고정 효과를 교환 바이어스(exchange bias)라 부른다. 교환 바이어스(exchange bias)현상은 강자성과 반강자성의 접합계면에서 강한 상호 교환결합력에 의해 나타나는 현상으로 이러한 교환 바이어스 특성은 하드드라이브의 고밀도 자기헤드소자 및 비휘발성 자기 메모리소자에 응용되어 기존의 자기저항 소자의 특성을 크게 향상시킬 수 있게 되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.437-440
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• 2000

Composite material consists of more than two materials and make various kinds of composite materials by combining different single materials. Copper clad aluminum composite material is composed of Al and Cu, and it has already been put to practical use in Europe because of its economic benefits. This paper presents the interface bonding according to the variation of extrusion ratio and semi-angle die by observing the interface between Cu and Al using metal microscope. By that result, we can predict the conditions of the interface bonding according to the extruding conditions.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.5
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• pp.180-185
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• 2000

An interface V-notched crack problem can be formulated as a eigenvalue problem. there are the eigenvalues which give stress singularities at the V-notched crack tip. The RWCIM is a method of calculating the eigenvector coefficients associated with eigenvalues for a V-notched crack problem. Obtaining the stress intensity factors for an interface crack in dissimilar materials is examined by the RWCIM. The results of stress intensity factors for an interface crack are compared with those of the displacement extrapolation method by the BEM

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.301-306
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• 1999

Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evaluation applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/ Epoxy bonded dissimilar materials were proposed.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.346-346
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• 2009

For high efficiency hetero junction solar cell over 20%, good silicon wafer passivation is one of the most important technological factor. Compared to the conventional PECVD technique, HWCVD has appeared as an promising alternative for high quality passivation layer formation. In this work, HWCVD passivation layer characteristics have been intensively investigated on wafer surface treatment, Hydrogen density in deposited thin layer and thermal effects in deposition process. Comprehensive results of the individual process factors on interface passivation has been discussed and resultant silicon hetero junction solar cell characteristics has been investigated.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.2
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• pp.67-75
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• 2006

In this paper, the compensation of ultrasonic scattering on interface crack depending on thickness variations of A1/Epoxy bonded dissimilar components was applied to improve measuring accuracy by using ultrasonic attenuation coefficient. The optimum conditions of theoretical value and experimental measuring accuracy by the ultrasonic method in A1/Epoxy bonded dissimilar components have been investigated. From the experimental results, the measurement method of interfacial crack lengths by using ultrasonic attenuation coefficient was proposed and discussed. After the ultrasonic scattering compensation depending on thickness variations of bonded dissimilar components was carried out, the measuring accuracy of interfacial crack length was improved by 5%.