• Title/Summary/Keyword: 접착 파손

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A Study on Shoe Bonding Mechanism Considering Recycling (재활용을 고려한 신발 접착 메커니즘에 관한 연구)

  • Song, Hyun-Su;Moon, Kwang-Sup;Mok, Hak-Soo
    • Resources Recycling
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    • v.27 no.2
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    • pp.3-10
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    • 2018
  • In this paper, Proposed bonding mechanism that can separate sole and upper for recycle and reuse of parts. It was confirmed that the PVC film with better physical properties than the existing parts was inserted between the sole and the upper. It was confirmed that the separation of the desired form can be induced. As a result of checking the performance of the proposed mechanism, it is confirmed that intentional separation is possible and the separated sole and upper can be recycled or reused.

Failure Characteristics of Scarf Patch-repaired Composite Single-lap Joints (스카프 패치로 수리한 복합재 단일겹침 체결부의 파손 특성 연구)

  • Kim, Choong-Hyun;Yoo, Jae-Seung;Byeon, Chang-Seok;Ju, Hyun-Woo;Park, Min-Young;Choi, Jin-Ho;Kweon, Jin-Hwe
    • Composites Research
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    • v.29 no.3
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    • pp.117-124
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    • 2016
  • The failure strength of composite single-lap joint repaired using scarf patch was investigated by test and finite element method. A total of 45 specimens were tested changing scarf ratio, stacking pattern, and defect size to study the failure strength and mode. Except for one case, all repaired specimens showed the equal or higher strength than the sound specimens and the effect of considered repair parameters was not remarkable. It was found through the failure mode inspection that the surface treatment for bonding was not enough in the case which failed at the lower load than the sound specimen. Three-dimensional finite element analysis was conducted to verify the test results. It was confirmed that the considered repair parameters do not significantly affect the stress distribution of the specimens. It was also observed that the applied tensile load is relieved passing through the overlapped region thickness of which is almost double. From this study, it is concluded that if the bonding procedure for adherends and patch including surface treatment for fabric layer is thoroughly followed, the strength of repaired single-lap joint can be restored up to the strength of sound one.

Convergence Study on Fracture at Joint Using Adhesive at Inhomogeneous Materials Bonded with CFRP (CFRP와 결합된 이종재료들에서의 접착제를 이용한 접합부의 파손에 관한 융합 연구)

  • Kim, Jae-Won;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.9 no.5
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    • pp.151-156
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    • 2018
  • In this study, CFRP and metal or nonmetal were bonded with adhesive and the fracture study on this material was carried out. CFRP at the upper side of specimen and metal or nonmetal were assigned at the lower side of specimen by using DCB specimen as the analysis condition. And it was desribed that the structural adhesive were bonded between both upper and lower sides. As this analysis result, the least equivalent stress was shown at the specimen bonded with aluminium. The maximum shear stress was shown to become lowest at the de-bonded CFRP specimen when titanium was used. In conclusion, it was shown that the deformation of specimen became lowest when titanium was used. On the basis of this study result, the esthetic sense can be shown as the fracture data of bonded interface using adhesive are grafted onto the real life.

Mixed-mode fracture toughness measurement of a composite/metal interface (복합재료/금속 접착 계면의 혼합모드 파괴인성 측정)

  • Kim, Won-Seock;Jang, Chang-Jae;Lee, Jung-Ju
    • Composites Research
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    • v.24 no.2
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    • pp.1-8
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    • 2011
  • Interfacial fracture toughness under various mixed-mode loading is measured to provide a mixed-mode fracture criterion of a composite/metal bonded joint. Experimental fracture characterization tests were carried out using a SLB (single leg bending) specimen, which controls mode ratio with the specimen thickness. The experimental result of the SLB test conforms that interfacial fracture toughness increases as the mode II component increases. The effect of loading mode on interfacial crack growth is investigated on the basis of crack path observation using microscopic image acquisition technique. The influence of interfacial roughness on adhesion strength is also discussed.

A Study on the Fracture Behavior of Composite Laminated T-Joints Using AE (AE를 이용한 복합재료 T 조인트부의 파괴거동에 관한 연구)

  • Kim, J.H.;Ahn, B.W.;Sa, J.W.;Park, B.J.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.19 no.4
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    • pp.277-287
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    • 1999
  • Quasi-static tests such as monotonic tension and loading/unloading tension were performed to investigate the bond characteristics and the failure processes for the T-joint specimens made from fiber/epoxy composite material. Two types of specimens, each consists of two components, e. g. skin and frame. were manufactured by co-curing and secondary bonding. During the monotonic tension test, AE instrument was used to predict AE signal at the initial and middle stage of the damage propagation. The damage initiation and progression were monitored optically using m (Charge Coupled Device) camera. And the internal crack front profile was examined using ultrasonic C-scan. The results indicate that the loads representing the abrupt increase of the AE signal are within the error range of 5 percent comparing to the loads shown in the load-time curve. Also it is shown that the initiation of crack occurred in the noodle region for both co-cured and secondarily bonded specimen. The final failure occurred in the noodle region for the co-cured specimen. but at the skin/frame termination point for the secondarily bonded specimen. Based on the results, it was found that two kinds of specimen show different failure modes depending on the manufacturing methods.

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A Study on the Effect of Adhesion Condition on the Mode I Crack Growth Characteristics of Adhesively Bonded Composites Joints (복합재 접착 체결 구조의 접착 상태가 모드 I 균열 성장 특성에 미치는 영향에 대한 연구)

  • No, Hae-Ri;Jeon, Min-Hyeok;Cho, Huyn-Jun;Kim, In-Gul;Woo, Kyeong-Sik;Kim, Hwa-Su;Choi, Dong-Su
    • Composites Research
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    • v.34 no.5
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    • pp.323-329
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    • 2021
  • In this paper, the characteristics of fracture in mode I loading were analyzed for adhesively bonded joints with non-uniform adhesion. The Double Cantilever Beam test was performed and mode I fracture toughness was obtained. In the case of non-uniform adhesively bonded joints, the stable crack growth sections and unstable crack growth section were shown. The fracture characteristics of each section were observed through the load-displacement curve of the DCB test and the fracture surface of the specimen. Finite Element Analysis was performed at the section based on segmented section by crack length measured through the test and using the mode I fracture toughness of each section. Through DCB test results and finite element analysis results, it was confirmed that the fracture behavior of specimens with non-uniform adhesion can be simulated.

A study on the acoustic emission characteristics of laminated composite structures (복합재료 적층 구조물의 음향방출 특성 연구)

  • 박재성;김광수;이호성
    • Composites Research
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    • v.16 no.6
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    • pp.16-22
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    • 2003
  • This paper studied the AE(acoustic emission) characteristics of the laminated composite structures. The composite stiffened panels under the compressive loading emitted various AE signals when they buckled or changed the buckling modes. In addition, the failure initiated and propagation generated a lot of complex signals. From the continuous signal generation. we identified when the failures initiated and whether they propagated or not. The single lap joint of laminated plates under tensional load also generated AE signals when bonding region failed. The first failure occurrence and its propagation are monitored by generated AE signals. The characteristics of AE signals used in this analysis are cumulative hits, hit distribution, peak frequency of generated AE waveform and amplitude of signals. The analysis of AE signals shows that continuous increment of cumulative hits can be regarded as damage propagation and three dominant peak frequencies can correspond to typical failure modes in the laminated composites.

Convergence Study on Damage of the Bonded Part at TDCB Structure with the Laminate Angle Manufactured with CFRP (CFRP로 제작된 적층각도를 가진 TDCB 구조물에서의 접착부의 파손에 관한 융합 연구)

  • Lee, Dong-Hoon;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.9 no.12
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    • pp.175-180
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    • 2018
  • In this study, CFRP was manufactured with the laminate angle of $45^{\circ}$. The specimen of TDCB bonded with the adhesive for structure was designed by CATIA and the analysis was progressed by using the finite element analysis program of ANSYS. This study model was designed on the basis of British industry and ISO standard and the configuration factor(m) was established with variable according to the angle of model configuration. As the study result of this paper, the maximum deformations at the specimens with the tapered angles of $4^{\circ}$ and $8^{\circ}$ become most as 12.628 mm and least as 12.352mm respectively. Also, the maximum equivalent stresses at the specimens with the tapered angles of $6^{\circ}$ and $8^{\circ}$ become most as 9210.3 MPa and least as 4800.5 MPa respectively. The damage data of TDCB structure with the laminate angle which was manufactured with CFRP could be secured through this study result. As the damage data of TDCB structure bonded with CFRP obtained on the basis of this study result are utilized, the esthetic sense can be shown by being grafted onto the machine or structure at real life.

The Stress Analysis of Semiconductor Package (반도체 패키지의 응력 해석)

  • Lee, Jeong-Ick
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.3
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    • pp.14-19
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    • 2008
  • In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

Strength of Composit Single-lap Bonded Joints with Different Saltwater Moisture Contents (서로 다른 수분율을 갖도록 염수환경에 노출된 복합재 접착체결부의 강도)

  • Yang, Hyeon-Jeong;Jeong, Mun-Gyu;Kweon, Jin-Hwe;Choi, Jin-Ho
    • Composites Research
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    • v.24 no.4
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    • pp.48-54
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    • 2011
  • The effect of moisture contents by salt water on the strength of composite single-lap bonded joints is investigated. The specimens were manufactured in an autoclave by secondary bonding and immersed in the 3.5% salt water of $71^{\circ}C$ for different durations to get various moisture contents; 0, 0.2, 0.5, 1.0, and 2.0%(saturation). A total of 80 joint specimens were tested for 5 different moisture contents and 2 temperature environments. Test results show that while the joint strengths after the saturation of moisture decrease compared to those of dry ones, the strengths of the pre-saturated joint up to 1.0% of moisture content increase in both room and elevated temperature conditions. It is also shown that the strengths of joints tested in elevated temperature are slightly higher than the strength in room temperature by 2-5% until the moisture content reaches 1 %. In contrast, the high temperature strength of the saturated joint is about 5% lower than the room temperature strength.