• Journal of Adhesion and Interface
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• v.14 no.1
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• pp.21-27
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• 2013

Cellulose-based rayon fibers or fabrics can be thermally decomposed very fast within a narrow temperature window during stabilization process. Therefore the stabilization stage is critically important for producing rayon-based carbon fibers. Consequently, in the present study the effects of isothermal stabilization and ultrasonic cleaning on the weight loss, chemical composition, microstructure, and fabric texture of cellulose-based rayon fabrics were explored. The temperature of the isothermal stabilization process performed in the range of $200{\sim}240^{\circ}C$ influenced the processing time, carbon and oxygen contents, cellulose structural change, and fabric texture. The ultrasonic cleaning, which was conducted prior to the stabilization process, played a role in shortening the stabilization time, increasing the carbon contents, decreasing the oxygen contents, and changing the XRD pattern. Also, it was considered that the ultrasonic cleaning contributed to retarding the weight loss, to reducing the thermal shrinkage, and further to reducing the fast physical change of rayon fabrics.

• Journal of Adhesion and Interface
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• v.9 no.4
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• pp.12-16
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• 2008

Hot-melt adhesive was solid phase in room temperature as 100% solid contents. So it has advantage which attach to substrate with the low pressure heat, fast adhesion speed and environment friendly. In this study, We studied about the effect of a kind of SBS resin and petroleum resin as a tackifier resin and their ratio for hot-melt adhesive on properties. The styrene and $C_9$ resin contents in hot-melt adhesive was increased with increasing viscosity, tensile strength, peel strength and thermal resistance.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.15-22
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• 2002

We received 2 types flexible packaging films from two companies that laminated PET $16{\mu}m/dry$ lamination/aluminium foil $7{\mu}m/dry$ lamination/CPP $80{\mu}m$ films. For the reason of hot sealing's trouble through filling process, We separated each layer and compared thicks, film types and tested IR, DSC and sensory test. At the result, one sample's thick is different but film types is same between samples. Optimum hot-sealing conditions between two samples is $195^{\circ}C\;and\;210^{\circ}C$. The difference is $15^{\circ}C$. According to test of direct filling packaging process by four face fluid filling machine, two sample's sealing strength of hot-sealing is $4.76kg/cm2/15mm$(sample of optimum hot-sealing condition is $195^{\circ}C$) and $3.84kg/cm2/15mm(210^{\circ}C)$.

• Journal of Adhesion and Interface
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• v.5 no.3
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• pp.10-17
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• 2004

We investigated the effect of stabilization processing parameters on the thermal shrinkage, thermal stability and microstructure of rayon fabrics stabilized under various conditions such as heating rate, stabilization temperature, atmosphere gas, and chemical treatment. The presence and absence of phosphoric acid treatment and the heating rate have most importantly influenced the thermal shrinkage and the weight change of rayon fabrics. Especially, the phosphoric acid treatment decreases the reduction of thickness, length, and weight of the fabrics by about 80%, 20%, and 26%, respectively, in comparison with the untreated counterparts, showing the protective effectiveness of the thermal shrinkage involved. The thermal stability of stabilized rayon fabrics is also affected by all the processing conditions used: stabilization temperature, phosphoric acid treatment, atmosphere gas, and heating rate. In addition, the surface and diameter of the stabilized fiber significantly depend on the treatment of phosphoric acid prior to stabilization process.

• Journal of Adhesion and Interface
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• v.25 no.2
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• pp.43-49
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• 2024

In recent years, the flexible organic synaptic transistor (FOST) has garnered attention for its flexibility, biocompatibility, ease of processability, and reduced complexity, which arise from using organic semiconductors as channel layers. These transistors can emulate the plasticity of the human brain with a simpler structure and lower fabrication costs compared to conventional inorganic synaptic devices. This makes them suitable for applications in next-generation wearable devices and soft robotics technologies. In FOST, the organic substrate is sensitive to the device preparation temperature; high-temperature treatment processes can cause thermal deformation of the organic substrate. Therefore, low-temperature solution-based processing techniques are essential for fabricating high-performance devices. This review summarizes the current research status of low-temperature solution-based FOST devices and presents the problems and challenges that need to be addressed.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.69-72
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• 2002

섬유산업은 fiber로부터 시작하여 yarn, fabric을 거쳐 최종 섬유제품인 clothing을 생산하는 긴 stream을 가지고 있으며, 이와 같이 여러 단계의 공정을 거치는 가운데 섬유물은 새로운 형태를 가지게 되며 부가가치가 형성된다. 특히 garments manufacturing 공정에는 fusing press기가 사용되는데 이 방식은 같은 각속도와 지름을 가진 cylinder로 구동되는 두 개의 상하 벨트구동기구와 내부에 열전식 heather로 구성되어 상하 벨트의 내부로 원단과 심지를 통과시키며 열을 가함으로써 원단과 심지를 접착시킨다. (중략)

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1995.05a
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• pp.3-8
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• 1995

추진기관 적용에 따른 복합재연소관의 일반적 사항들을 논하였다. 추진기관의 효율에 주요인자인 경량화에 있어서 복합재 연소관의 무게가 철금속 연소관에 비해 약 50%의 감소효과가 있으며 단가의 측면에서도 부가가치가 있는 것으로 평가된다. 그러나 추진기관 체계적(추진제 공정 및 구조안정성) 관점에서 추진제 내면변형율(Inner Bore Strain)의 증가, 제작공차, 공정의 재현성, EPDM의 접착기밀성 및 외부습도 유입 문제 등의 앞으로 해결되어야 할 사항들이 제시되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.699-700
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• 2010

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.37-43
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• 2002

A number of thin-film deposition technologies have been developed. However, even a thin film whose properties are excellent may not be used as long as the adhesion strength between the thin film and the substrate is poor. For thin films, the adhesion strength is as important as the properties. In the present article, relation between interface structure and thin film adhesion, and factors affecting thin film adhesion are reviewed. Two kinds of factors, internal factors and external factors, affect thin film adhesion. Such factors as composition, structure, and reactivity of both thin film and substrate as well as surface roughness of the substrate and residual stress of the thin film belong to internal factors. And such factors as load, temperature, humidity, and corrosive environment belong to external factors. It is also reviewed that how we can control the internal factors and the external factors to enhance or keep the adhesion strength.

• Composites Research
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• v.36 no.5
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• pp.377-382
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• 2023

To enhance the performance of graphene-based devices, it is of great importance to better understand the interfacial interaction of graphene with its underlying substrates. In this study, the adhesion energy of monolayer graphene placed on dielectric substrates was characterized using mode I fracture tests. Large-area monolayer graphene was synthesized on copper foil using chemical vapor deposition (CVD) with methane and hydrogen. The synthesized graphene was placed on target dielectric substrates using polymer-assisted wet transfer technique. The monolayer graphene placed on a substrate was mechanically delaminated from the dielectric substrate by mode I fracture tests using double cantilever beam configuration. The obtained force-displacement curves were analyzed to estimate the adhesion energies, showing 1.13 ± 0.12 J/m² for silicon dioxide and 2.90 ± 0.08 J/m² for silicon nitride. This work provides the quantitative measurement of the interfacial interactions of CVD-grown graphene with dielectric substrates.