• Title/Summary/Keyword: 접착공정

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Automotive Pre-primed Coatings with Automotive Structural Adhesive for Non-weldable Binding Process (자동차 구조용 접착제를 이용한 자동차용 Pre-primed 도료의 비용접식 접합공정 적용)

  • Moon, Je-Ik;Lee, Yong-Hee;Kim, Hyun-Joong;Noh, Seung Man;Nam, Joon Hyun;Kim, Min-Su;Kim, Jun-Ki;Kim, Jong-Hoon
    • Journal of Adhesion and Interface
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    • v.12 no.3
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    • pp.99-104
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    • 2011
  • Currently, automotive pre-primed coatings has been developed to overcome environmental regulations and to reduce manufacturing cost in automotive industry. By these reasons, an automotive pre-primed system has been investigated to remove the wash and pre-treatment process using a roll coating application. It is required to develop non-weldable pre-primed system for automotive structural adhesives, because pre-primed sheet coated with organic compounds is hard to be assembled by welding process. Primer 1 (polyester type) and primer 2 (urethane type) were designed to satisfy flexibility and formability for non-weldable pre-primed system. According to the results of physical property test of the primers, adhesion test such as single-lap shear test and T-peel test, primer 1 (polyester type) had better physical properties such as pencil hardness, solvent resistance, flexibility and adhesion with automotive adhesive than that of primer 2 (polyurethane type). In addition, the possibility of the non-weldable pre-primed system was applicable to automotive assembly process in place of welding process.

Adhesion Properties of UV-curable Acrylic PSA Tape for Automotive Sidemolding and Emblem (자동차용 사이드 몰딩과 엠블럼 적용을 위한 UV 경화형 아크릴 점착 테이프의 점착물성)

  • Park, Ji-Won;Lee, Seung-Woo;Kim, Hyun-Joong;Won, Dong-Bok;Kim, Dong-Bok;Lee, Kang-Shin;Woo, Hang-Soo;Kim, Eun-Ah
    • Journal of Adhesion and Interface
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    • v.12 no.3
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    • pp.81-87
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    • 2011
  • In this study, UV curing and crosslinking process was introduced for synthesis of acrylic foam tape that can be applied to the the automotive assembly process. Polymerized adhesive are laminated to baseform and varying the thickness of specimens were prepared. To measure basic mechanical properties, stainless steel was used. And in the test peel, dynamic shear and t-block were used. The acrylform adhesive show better results compare with typical adhesive and the properties depand on external factors - thick, wetting time -. To analysis functions of acrylic foam adhesive used to automobile production, evaluate the adhesive properties on the various plastic substrate. In PP and PE are categorized low surface energy materials, their properties have not been expressed. But dynamic shear tests show that some properties could be expressed by the difference break mechanism.

A Correlation Study on Surface Contamination of Semiconductor Packaging Au Wire by Components of Rinse (반도체 패키지용 Au Wire의 표면처리용 린스 성분에 따른 표면오염 비교 연구)

  • Ha-Yeong Kim;Yeon-Ryong Chu;Jisu Lim;Gyu-Sik Park;Jiwon Kim;Dahee Kang;Yoon-Ho Ra;Suk Jekal;Chang-Min Yoon
    • Journal of Adhesion and Interface
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    • v.25 no.2
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    • pp.63-68
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    • 2024
  • In this study, the contamination of gold(Au) wire according to the types of rinse applied for surface treatment in the wire bonding process is investigated and confirmed. For the surface treatment, rinses containing silicon(Si) or those based on organic materials are mainly employed. To identify their effects, surface treatment is conducted on Au wire using two types of rinse at a 1.0 wt% concentration, referred to as Si-including and Oil-based rinse-coated Au wire. Subsequently, a simulation experiment is performed to verify the reactivity of dust containing Si components that could occur in the semiconductor process. Through optical microscopy (OM) and scanning electron microscopy(SEM) analysis, it is observed that a larger amount of dust is adsorbed on the surface of Si-including rinse-coated Au wire compared with the Oil-based rinse-coated Au wire. This is attributed that the rinse containing Si components is relatively polar, causing polar interactions with dust, which also has polarity. Therefore, it is expected that using a rinse without Si components can reduce contamination caused by dust, thereby decreasing the defect rate in the practical wire bonding process.

The Review for Various Mold Fabrication toward Economical Imprint Lithography (미세패턴 전사기법을 위한 다양한 몰드 제작법 소개)

  • Kim, Joo-Hee;Kim, Youn-Sang
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.96-104
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    • 2010
  • We suggest here a cost-effective replica fabrication method for transparent and hard molds for imprinting lithography such as NIL and S-FIL. The process starts with the use of a replica hard mold from a master, using a polymer copy as a carrier. The polymer copy as a carrier was treated by soluble process for forming anti-adhesion layer. Duplicated hard molds can eliminate direct contact between a hard master and a patterned polymer on a substrate and the generated contamination of a master during the imprinting process. The replica hard mold exhibits the glass-like properties introduced here, such as transparency and hardness, make it appropriate for nanoimprint lithography and step-and-flash imprint lithography.

A New Process for Liquid Phase Sintering of W-Cu Composite; Fluidized Beds Reductio Method (W-Cu 합금의 액상소결을 위한 새로운 공정의 개발:유동층 환원법)

  • Ihn, Tae-Hyoung;Lee, Seok-Woon;Joo, Seung-Ki
    • Korean Journal of Materials Research
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    • v.4 no.4
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    • pp.393-400
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    • 1994
  • A new process for uniform coating of copper to submicron tungsten powder has been developed. W-Cu alloy where copper can be uniformly distibuted has been made by the liquid phase sintering of thus prepared tungsten powder. It has been found that copper content can be lowered less than IOwt. % in our new process, maintaining the uniform distribution of copper in W-Cu alloy. Relative density above 96% was obtained after the liquid phase sintering when small amount of cobalt was added. It was revealed that the rapid increase of densification rate was due to the enhancement of wettability between tungsten particle and liquid copper.

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Properties and Curing Behaviors of UV Curable Adhesives with Different Coating Thickness in Temporary Bonding and Debonding Process (Temporary Bonding and Debonding 공정용 UV 경화형 접착 소재의 코팅 두께에 따른 물성 및 경화거동)

  • Lee, Seung-Woo;Lee, Tae-Hyung;Park, Ji-Won;Park, Cho-Hee;Kim, Hyun-Joong
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.10
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    • pp.873-879
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    • 2014
  • UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

Development of the Dual Thrust Rocket Motor with Two Kinds Propellant (이종추진제를 적용한 이중추력 추진기관 개발)

  • Kim, Kyungmoo;Kim, Jeongeun;Lim, Jaeil;Park, Sunghan
    • Journal of the Korean Society of Propulsion Engineers
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    • v.25 no.1
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    • pp.58-67
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    • 2021
  • This paper describes the development for the dual thrust rocket motor with two types of propellants with different combustion characteristics. We developed the composition of two kinds of propellant to be applied to a rocket motor, and improved a propellant charging process in a free grain type to improve the adhesion method and the problems of adhesion between different propellants. In addition, to meet the ignition phenomenon as a small rocket motor, the ignition delay was improved by applying a nozzle plug developed in a high density foam. The propulsion rocket motor reflecting this design and the improved manufacturing process was evaluated through a ground performance test.

Optimization of Plain Jacked Vessel Design in Adhesive Production Process Using Computational Fluid Dynamics (Computational Fluid Dynamics를 활용한 점/접착 생산 공정 내 Jacketed Vessel 설계 최적화)

  • Joo, Chonghyo;Park, Hyundo;Cho, Hyungtae;Kim, Junghwan
    • Applied Chemistry for Engineering
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    • v.31 no.6
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    • pp.596-602
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    • 2020
  • Blending process of adhesive production has a cooling process to cool down the temperature of the solution which was heated up to 76 ℃ with a mineral insulated (MI) cable by 30 ℃ at room temperature. Using a MI cable in the adhesive production process makes the production inefficient because it takes about 10 h for the cooling process. If a jacketed vessel is used instead of the MI cable, it would shorten the cooling downtime without any additional cooling system by using cold water. However, there are various types of jacketed vessels, and thus the most suitable type should be found before set up. In this study, we designed the optimized jacketed vessel for the adhesive production process by calculating the cooling downtime, which impacts production efficiency, as a function of the jacket types using computational fluid dynamics. As a result, the cooling performance of the plain jacket was 32.7% superior to that of the half-pipe coil jacket with the same height. In addition, the plain jacket with 60% spiral baffle reduced the cooling downtime and operating time by 80.4% and 25.1%, respectively.

Ohmic Characteristics of Ni/3C-SiC Interface (Ni/3C-SiC 계면의Ohmic 특성)

  • Kim, In-Hui;Jeong, Jae-Gyeong;Jeong, Jae-Gyeong;Sin, Mu-Hwan
    • Korean Journal of Materials Research
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    • v.7 no.11
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    • pp.1018-1023
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    • 1997
  • 본 연구에서는 3C-SiC의 ohmic 접합에 대하여 그 전기적 특성과 미세구조의 상관관계에 대하여 분석하였다. 표준사진식각 공정을 통하여 ohmic접합 금속으로서 Ni을 진공증착시켜 일련의 TLM패턴으로 열처리에 따르는 전류-전압 특성을 조사하였고 TEM, SEM, AES, EDS를 사용하여 Ni/SiC 계면에 대한 미세구조, 화학적 특성을 분석하였다. 열처리 온도와 시간을 통한 thermal budget이 증가함에 따라서 접촉저항이 감소되었으며 그 값은 $10^{-2}$-$10^{-4}$$\textrm{cm}^2$의 범위에 속하였다. EDS와 AES를 통하여 7$50^{\circ}C$이상의 열처리 후 silicide(NiSi$_{2}$)의 주변에 carbon층이 형성되는 것을 확인하였으며, 열처리 온도가 증가함에 따라서 island형 silicide의 크기가 조밀해지며 SiC와의 접착성이 향상됨을 알 수 있었다. Ni/3C-SiC ohmic 접합의 전기적 특성은 계면에 생성되는 silicide와 carbon의 형성거동에 의하여 결정되는 것으로 믿어진다.

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기술현황분석 - 알루미늄 차체부품의 SPR 접합기술 동향

  • Seo, Jeong;Gang, Hui-Sin;Lee, Mun-Yong;Jo, Hae-Yong
    • 기계와재료
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    • v.23 no.3
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    • pp.138-146
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    • 2011
  • 자동차 차체 경량화를 위해 알루미늄 스페이스 프레임 구조가 개발되고 있으나, 관재결합이 필요하기 때문에 기존의 저항 점용접이 적용되기 어렵다. 또한, 멤버와 멤버의 연결부에서는 철강재난 고강도 재료의 사용이 요구되므로 이종재료 접합기술이 필요하다. 알루미늄 및 이종재료 접합방법으로는 볼트체결, 클린칭, SPR 접합, 접착재 등이 있으나, SPR 접합은 기계적인 결합방법의 하나로, 일반 리벳공정과는 달리 별도의 홀이 필요없기 때문에 자동화에 용이하며 작업시간도 빠르다. 리벳의 압입 방식으로 판재의 열변형이 거의 없고 친환경적인 공법으로 사용되고 있으며, 소음이 적고, 용접이 불가능한 이종재료의 결합도 가능하다. 무엇보다 자동차 양산용 장비 적용이 용이하기 때문에 기존의 저항 점용접을 대체하기 편리하다. 따라서, 본 글에서는 알루미늄 차체 부품 접합을 위한 SPR 접합공법에 대한 국내외 기술개발 동향을 분석하고, 한국기계연구원에서의 최근 기술개발 내용을 소개하고자 한다.

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