• Journal of the Society of Disaster Information
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• v.15 no.2
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• pp.259-267
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• 2019

Purpose: In this paper adhesive-bonded cylindrical lap joints are analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. Method: The distribution of the stresses in the adhensive is evaluated using the Finite Element Method. Nuverical examples for identical and different adherends bonded through a four parameter viscoelastic solid adhesive are illustrated. Results: The stress distribution in the adhesive layer with respect to time is shown. The stress distribution in the adhesive layer with respect to time is shown. The results are also shown that adherend thickness and elastic modulus give effect on the normalized stress. Conclusion: In this study, the stress distribution of the adhesive layer of the wrapped cylindrical body considering the viscoelasticity of the adhesive layer was numerically analyzed by using a four - element elastomer model.

• The Korean Journal of Rheology
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• v.8 no.2
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• pp.129-138
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• 1996

접착강도는 접착제의 점탄성을 반영한 온도·속도 의존성을 나타낸다는 것이 잘 알 려져있다. 특히 유리전이온도(Tg)에서의 역학적 완화기구가 접착층의 변형을 수반하는 접착 층의 변형을 수반하는 접착강도에 크게 영향을 미치고 있다. 또한 접착계의 모드I의 변형에 너지 해방율(GIC)를 측정할때에도 접착제의 변형과 파괴가 발생하기 접착제의 점탄성이 그 값에 어떠한 영향을 미치는 지에 흥미가 깊다. 본 연구에서는 2종류의 에폭시 수지를 블랜 드한 접착제를 이용하여 일정한 측정조건에서 인장 접착강도와 GIC의 상관관계에 대하여서 도 토론하였다.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.13 no.1
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• pp.97-103
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• 2000

This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.7
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• pp.1244-1254
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• 1992

This paper investigates the vibrational damping characteristics of laminated plates composed of elastic, viscoelastic and elastic layers by theoretical and experimental methods. Laminated plates are in cylindrical bending and visco-elastic adhesive layer is assumed as the visco-elastic spring which takes damping effect through both shear and normal deformations. Governing equations oof laminated plates are derived in the form of simultaneous first order differential equations, which account for the longitudinal displacements, rotary inertia and shear deformations of elastic base plate and elastic constraining plate. The numerical calculations of the equations are illustrated by the applications to the cantilever beam in transverse vibration. The results of the solutions agree well with the experimental measurements in general. The damping effects due to the shear and thickness deformations in the adhesives are analyzed and it is shown that for thicker adhesives, the damping effect due to thickness deformation becomes significant and for thinner adhesives, due to shear deformation.