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Virtual Segmentation Path Construction for Unconstrained Handwritten Hangul Segmentation (무제약 필기체 한글분할을 위한 가상 분할경로 생성)

  • 박성호;조범준
    • Proceedings of the Korea Multimedia Society Conference
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    • 2004.05a
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    • pp.827-830
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    • 2004
  • 현재까지도 대부분의 필기체 한글 인식은 완벽한 분할을 가정하여 개발되고 있으며 한글 분할 그 자체에 대한 관심은 매우 낮은 편이다. 또한 한글은 자소의 모아쓰기 형태를 갖고 있어 문자내에 여백이 존재할 뿐만 아니라 문자와 문자 사이의 접촉되는 특징이 흔히 발생되기 때문에 기존의 영문자에 사용된 방법을 그대로 직접 적용하기에는 많은 어려움이 있다. 본 논문에서는 무제약 필기체 한글을 분할하기 위하여 가상 분할경로를 이용하는 방법을 제안한다. 제안된 방법은 기존의 분할 방법들이 갖는 직선화된 분할경로 뿐만 아니라 문자내에 존재하는 여백의 정보를 활용하여 꺽은선 분할경로를 주로 이용하는데 특징이 있다. 분할과정은 크게 2단계로 구성되는데 첫 번째 단계는 입력받은 한글 문자열에 대한 전처리 과정과 수직투영을 통해 직선화된 분할경로를 찾고 이에 따라 쉽게 분할 가능한 문자와 중첩되거나 접촉된 문자를 구분하여 다음 단계의 분할대상으로 결정한다. 두 번째 단계에서는 다양한 가상의 꺽은선 분할경로를 생성하기 위하여 각 문자에서 특징점을 추출하고, 인접한 특징점들 간의 무게 중심점을 찾아서 더 세밀한 경로 생성을 함으로서 가장 최상의 분할경로를 결정한다.

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Analysis of Rail Wear Rate according to Wheel/Rail Contact Pressure on Curved Track (곡선부 차륜/레일 접촉압력에 따른 레일마모진전 경향 분석)

  • Sung, Deok-Yong
    • Journal of the Korean Society for Railway
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    • v.20 no.4
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    • pp.512-520
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    • 2017
  • On a typical railway, trains travel using the friction between the wheel and the rail. Contact pressure is generated between the wheel and the rail, and the magnitude of the contact pressure changes depending on the weight, speed, wheel-set hunting, and contact point of the vehicle. In this study, the contact characteristics were analyzed through the finite element analysis for the wheel/rail system on curved track, and fatigue damage and wear rate of wheel/rail according to contact pressure were analyzed through rolling contact fatigue test. Results indicate that, general and heat treated rails showed higher wear rate than wheels, and general and heat treated rail wear rate increased rapidly over a certain number of repetitions. In addition, the general rail wear rate was about 7 ~ 15% higher than that of the heat treated rail, and a regression equation for the rail wear rate with the contact pressure in the contact pressure range of 900 ~ 1,500 MPa was presented.

A Development of Wireless Monitoring System for Temperature Monitoring by using IR Sensor (적외선 센서를 이용한 열화상태 무선감시 시스템 개발)

  • Kim, Jihee;Kim, Sinwoo;Kang, Yongsoo
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.1
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    • pp.239-245
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    • 2013
  • The temperature monitoring of power cable and cable junction point is the necessary link of the safe and reliable operation of the power system. Many kinds of cables and high voltage junction points are easy to exposed continuous vibrations and momentary impulse in industry field especially power plant industries. This system can predict the overheating of the electric cable interface and the possibility of all kinds of accident, and it helps for eliminating the hazards of electric cable interface and provides the effective guarantee for the safety operation. In order to avoid the faults of the inconvenience of installation and maintenance and the high cost of application, this system used small and contactless IR sensor module. The low power consumption is used in the system. The goal of this study is the low cost and on-line reliable monitoring of power cable and junction point temperature.

Contactless Fingerprint Recognition Based on LDP (LDP 기반 비접촉식 지문 인식)

  • Kang, Byung-Jun;Park, Kang-Ryoung;Yoo, Jang-Hee;Moon, Ki-Young;Kim, Jeong-Nyeo;Shin, Jae-Ho
    • Journal of Korea Multimedia Society
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    • v.13 no.9
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    • pp.1337-1347
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    • 2010
  • Fingerprint recognition is a biometric technology to identify individual by using fingerprint features such ridges and valleys. Most fingerprint systems perform the recognition based on minutiae points after acquiring a fingerprint image from contact type sensor. They have an advantage of acquiring a clear image of uniform size by touching finger on the sensor. However, they have the problems of the image quality can be reduced in case of severely dry or wet finger due to the variations of touching pressure and latent fingerprint on the sensor. To solve these problems, the contactless capturing devices for a fingerprint image was introduced in previous works. However, the accuracy of detecting minutiae points and recognition performance are reduced due to the degradation of image quality by the illumination variation. So, this paper proposes a new LDP-based fingerprint recognition method. It can effectively extract fingerprint patterns of iterative ridges and valleys. After producing histograms of the binary codes which are extracted by the LDP method, chi square distance between the enrolled and input feature histograms is calculated. The calculated chi square distance is used as the score of fingerprint recognition. As the experimental results, the EER of the proposed approach is reduced by 0.521% in comparison with that of the previous LBP-based fingerprint recognition approach.

Analysis of a Complete Contact Problem in Bonded Condition: Comparison of Experimental-Numerical Analyses and Theoretical Solutions (응착조건의 완전접촉문제 해석: 실험 및 수치해석과 이론해의 비교)

  • Kim, Hyung-Kyu;Jang, Jae-Won;Lee, Soon-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.39 no.6
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    • pp.583-588
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    • 2015
  • Asymptotic method has been often used to theoretically analyze the complete contact problem. The error of the asymptotic results increases as the distance from the contact edge increases. The singularity cannot be properly obtained from a finite element (FE) analysis owing to the finiteness of the element size. In the present work, the complete contact problem in bonded condition is analyzed using a combined experimental-numerical approach to assist and/or compare with the asymptotic results. Al and Cu alloys are used for the material combination of the punch and substrate. 120 and 135 degrees are used for the punch angle. The FE models are validated by comparison of displacement distributions obtained by the FE analysis and $moir{\acute{e}}$ experiment. Generalized stress intensity factors are evaluated using the validated FE models. Stress field in the vicinity of the sharp contact edges obtained from the FE and asymptotic analyses are compared. The discrepancies are also discussed.