• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.3
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• pp.89-95
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• 2003

This research analyzes the cutting mechanism of A1100-H18 of commercially pure aluminum by image processing in SEM(Scanning Electron Microscope) for the measurement of strain rate distribution near a cutting edge in orthogonal micro-cutting. The distribution is measured using various methods in order. The methods are in-situ observations of cutting process in SEM, inputting image data, a computer image processing, calculating displacements by SSDA(Sequential Similarity Detection Algorithm) and calculating strain rates by FEM. The min results obtained are as follows: (1)It enables to measure a microscopic displacement near a cutting edge. (2) An application of this system to cutting process of various materials will help to make cutting mechanism clear.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.190-197
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• 2005

For precise micro-grooving and surface machining, a mechanism for creating elliptical vibration cutting (EVC) motion is proposed which uses two parallel piezoelectric actuators. And based on its kinematical analysis, variations of EVC path are investigated as a function of dimensional changes in the mechanism, phase difference and amplitude of excitation sinusoidal voltages. Using the proposed PZT mechanism, various types of two dimensional EVC paths including one dimensional vibration cutting path along the cutting direction and thrust direction can be easily obtained by changing the phase lag, the amplitude of the piezoelectric actuators, and the dimension of the mechanism.

• Journal of the Korean Society for Precision Engineering
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• v.1 no.2
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• pp.24-32
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• 1984

The object of the study is to discuss the effect of magic ink as a surface active substance on the mechanism of chip formation in oblique cutting. The Rehbinder effect has been known as a phenomenon that the mechanical strength reduces when the metal is coated with some surface active substances. In order to interpret these surface effects defined by Rehbinder, the influence on the shear strength of shear plane by coating surface active substances, cutting force by the depth of cut, surface roughness and hardness ratio were observed. The results are as follows: 1. By coating the magic ink on free surface of the forming chip, the effective shear angle increases, and the cuttinbg force and the deformed chip thickness decreases. 2. With the large inclination angle the effective shear angle increases, and the specific cutting force and the friction angle decrease. 3. Cutting of the coated surface improves the surface roughness and the hardness ratio drops, which means another Rehbinder effect.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.604-607
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• 2003

This study investigates the micro-cutting of cemented carbides using PCD(polycrystalline diamond) and PCBN(polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was investigated, including cutting speed. depth of cut and various tool rake angle.

• Journal of Korean Ophthalmic Optics Society
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• v.11 no.2
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• pp.85-89
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• 2006

To research of the improved mechanical properties of materials for spectacle lens cutting, SiC and TiC were used as the main powder. Also, $Al_2O_3$ and $Y_2O_3$ was included as a sintering additive. The weight ratio of the alumina($Al_2O_3$) to yttria($Y_2O_3$) was set to 1:1. The materials for spectacle lens cutting were fabricated by hot-pressing at $1810^{\circ}C$ for 1h and subsequently annealed at $1860^{\circ}C$ for 3, 6 and 12h to initiated grain growth. The longer annealing time is, the bigger the grain size is. The microstructures were observed by scanning electron microscopy (SEM). The SEM images were quantitatively analyzed by image analysis (Image-Pro Plus, Media Cybernetics, Maryland, U.S.A.). Crack deflection by elongated SiC grains was most frequently observed as the dominant toughening mechanism. Crack deflection was generally observed for elongated SiC grains with aspect ratio(AR) > 2.5 and grain thickness < $2.3{\mu}m$. Crack bridging was also observed as one of the operating toughness mechanism.

• Journal of the KSME
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• v.43 no.8
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• pp.64-73
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• 2003

2002년도 한 해 동안 생산 및 설계공학 관련 분야를 중심으로, 소성가공, 절삭가공, 금형 및 사출성형, 용접 및 특수가공, 생산자동화 및 관리, CAD/CAM, 기계요소 및 기구설계, 공작기계 및 기계시스템설계, 지적설계 및 최적설계, 윤활 및 마멸, 생체공학, MEMS 등으로 분류하여 각 분야에서 그 동안 발전 개발하여 게재된 연구 및 실험 논문들을 중심으로 이들 분야에 대한 관련 동향등을 정리하면 다음과 같다.

• Journal of Oral Medicine and Pain
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• v.31 no.3
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• pp.211-221
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• 2006

Purpose The aims of this study were to evaluate micro-tensile bond strength of composite resin bonded to dentin following high-speed rotary handpiece preparation or Er:YAG laser preparation with two different adhesive systems and to assess the influence of different Er:YAG laser energies on the micro-tensile bond strength. Materials and Methods In this study, 40 third morlars were used. Flat dentin specimans were obtained and randomly assigned to eight groups. Dentin surfaces were prepared with one of four cutting types: carbide bur, Er:YAG laser (2 W, 3 W and 4 W) and conditioned with two bonding systems, Scotchbond Multipurpose Plus (SM), Clearfil SE bond (SE) and composite resin-build ups were created. After storage for 24 hours, each specimen was serially sectioned perpendicular to the bonded surface to produce more than thirty slabs in each group. Micro-tensile bond strength test was performed at a crosshead speed of 1.0 mm/min. Micro-tensile bond strengths (${\mu}TBS$) were expressed as means$\pm$SD. Data were submitted to statistical analysis using two-way ANOVA, one-way ANOVA, Student-Newman-Keuls' multiple comparison test and t-test. Results and Conclusion 1. Regardless of bonding systems, the ${\mu}TBS$ according to cutting types were from highest to lowest : 3 W, 2 W, Bur, and 4 W. In addition, there was no significant difference between Bur and 4 W (p<0.001). 2. Regardless of cutting types, SM showed significantly higher ${\mu}TBS$ than SE (p<0.001). 3. Bonding to dentin conditioned with SM resulted in higher ${\mu}TBS$ for 3 W compared to Bur, 2 W, and 4 W. There was no significant difference between 2 W and Bur (p<0.001). 4. Bonding to dentin conditioned with SE resulted in higher ${\mu}TBS$ for 3 W compared to 2 W, 4 W, and Bur. Bur exhibited significant lower ${\mu}TBS$ than all other cutting types. There were no significant differences between 3 W, 2 W and between 4 W and Bur (p<0.001). 5. The ${\mu}TBS$ of laser cutting groups were shown in order from highest to lowest: 3 W, 2 W and 4 W in two bonding systems. There was no significant difference between 2 W and 3 W in SE (p<0.001). : The ${\mu}TBS$ of composite resin bonded dentin was significantly affected by interaction between the cutting type and bonding system. In the range of 2 W-3 W, cavity preparation of the Er:YAG laser seems to supply good adhesion of composite resin restoration no less than bur preparation. In particular, if you want to use the self-etching system, including Clearfil SE bond for the purpose of a simplification of the bonding procedures and prevention of adverse effects by excessive etching, an Er:YAG laser may offer better adhesion than a bur.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.12
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• pp.1185-1191
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• 2011

The kinematic characteristics of cutting device significantly affects cutting performance in 2-dimensional elliptical vibration cutting(EVC) where the cutting tool cuts workpiece, traversing a micro-scale elliptical trajectory in a trochoidal motion. In this study, kinematical characteristics of EVC device constructed with two parallel stacked piezoelectric actuators were analytically modeled and compared with the experimental results. The EVC device was subjected to step and low-frequency(0.1 Hz) sinusoidal inputs to reveal only its kinematical displacement characteristics. Hysteresis in the motion of the device was observed in the thrust direction and distinctive skew of the major axis of the elliptical trajectory of the cutting tool was also noticed. Discrepancy in the voltage-to-displacement characteristics of the piezoelectric actuators was found to largely contribute to the skew of the major axis of the elliptical trajectory of the cutting tool. Analytical kinematical model predicted the cutting direction displacement within 10 % error in magnitude with no phase error, but in estimating the thrust direction displacement, it showed a $27^{\circ}$ of phase-lag compared with the measured displacement with no magnitude error.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.9
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• pp.903-909
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• 2012

In elliptical vibration cutting(EVC) where the cutting tool traces a micro-scale 2-dimensional elliptical trajectory, the kinematical and vibrational characteristics of the EVC device greatly affect cutting performance. In this study, kinematical and vibrational characteristics of an EVC device constructed with two orthogonally-arranged stacked piezoelectric actuators were investigated both analytically and experimentally. The step voltage was applied to the orthogonal EVC device and the associated displacements of the cutting tool were measured to assess kinematical characteristics of the orthogonal EVC device. To investigate the vibrational characteristic of the orthogonal EVC, sinusoidal voltage was applied to the EVC device and the resulting displacements were measured. It was found from experiments that coupling of displacements in the thrust and cutting directions and the tilt of the major axis of the elliptical trajectory exists. In addition, as the excitation frequency is in vicinity of resonant frequencies the distortion in the shape of the elliptical trajectory becomes greater and change in the rotation direction occurs. To correct the shape distortion of the elliptical trajectory, the shape correcting procedure developed for the parallel EVC device was applied for the orthogonal EVC device and it was shown that the shape correcting method successfully corrects distortion.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.85-91
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• 2013

The machinability of wear-resistible tungsten carbides and the tool wear behavior in machining of V30 and V50 tungsten carbides using PCD (Poly Crystalline Diamond) cutting tool was investigated to understand machining characteristics. This material is one of the difficult-to-cut materials in present, but their usage has been already broadened to every commercial applications such as mining tools, and impact resistant tools etc. Summary of the results are as follows. (1) Tool wear progression of PCD tools in turning of wear-resistible tungsten carbides were observed specially fast in primary cutting distance within 10m. (2) Three components of cutting resistance in this research were different in balance from the ordinary cutting such as that cutting of steel or cast iron. Those were expressed large value by order of thrust force, principal force, feed force. (3) If presume from viewpoint of high efficient cutting within this research, a proper cutting speed was 15m/min and a proper feed rate was 0.1mm/rev. In this case, it was found that the tool life of PCD tool was cutting distance until 230m approximately. (4) In cutting of wear-resistible tungsten carbides such as V30 and V50, it was recognized that the tool wear rate of V30 was very fast as compared with V50. (5) When the depth of cut was 0.1mm, there was no influence of the feed rate on the feed force. And the feed force tended to decrease as the cutting distance was long, because the tool was worn and the tool edge retreated. (6) It was observed that the tungsten carbides were adhered to the flank.