• Title/Summary/Keyword: 전착

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EIS monitoring on corroded reinforcing steel in cement mortar after calcium electro-deposition treatment (칼슘 전착처리 후, 시멘트 모르타르 속 철근의 부식속도에 대한 EIS 모니터링)

  • Kim, Je-Kyoung;Kee, Seong-Hoon;Yee, Jurng-Jae
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.23 no.7
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    • pp.1-8
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    • 2019
  • The primary purposes of this study are to understand a fundamental effects of electro-deposition on reinforcing steel in saturated Ca(OH)2 electrolyte, and evaluate the corrosion rates of rebars under cyclic 3wt.%NaCl immersion and dry corrosion environment. The three cement mortar specimens with cover thickness 5, 10 and 30mm, were prepared in the experiment. To monitor the corrosion rates of rebars in mortar, the three cement mortar specimens were exposed to 110 wet-drying cycles(8-hour-immersion in 3wt.%NaCl and 16-hour-drying in a room temperature) in the laboratory. During the wet-dry cycles, the polarization resistance, Rp, and solution resistance, Rs, were continuously measured. The instantaneous corrosion rates of rebars on the effect of electro-depositing with sat. Ca(OH)2 electrolyte were estimated from obtained R-1p and degrees of wetness were estimated from Rs values. From the experimental results, the corrosion rates of rebars were greatly accelerated by wet/dry cycles. During the mortars exposed to drying condition, the large increases in the corrosion rates were showed at all rebar surfaces in three mortar specimen, attributed from the accelerated reduction rates of dissolved oxygen in drying process. However, the corrosion rates on rebar surface electrochemically deposited with sat. Ca(OH)2 electrolyte showed the clear decreases, caused by calcium deposits in the porous rust layer.

The Effects of Electrodeposited Lead Dioxide Structure on the Ozone Evolution (전착이산화납 결정구조가 전해에 의한 오존발생에 미치는 영향)

  • Kim, In Hwan;Lee, Choong Young;Nam, Chong Woo
    • Applied Chemistry for Engineering
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    • v.7 no.2
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    • pp.280-288
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    • 1996
  • In the ozone evolution using $PbO_2$, which was electrodeposited on Ti plate at various conditions in electrolyte, the effects of lead dioxide structure on the current efficiency and surface structure changes of lead dioxide were investigated. Also the effects of oxygen transfer reaction on the ozone evolution were investigated by means of a $PbO_2$ electrodeposited on the platinum rotating disk electrode. In order to develope an electrode for ozone evolution, durability of lead dioxide and optimum current density were investigated. At the electrodeposited lead dioxide with the larger grain size and higher crystallinity, the efficiency for ozone evolution was higher. Optimum current density to electrodeposite lead dioxide with large grain size and high crystalinity was $50mA/cm^2$. Lead dioxide deposited in the presence of glycerin showed the best advantage of ozone evolution. Also lead dioxide electrodeposited at less than $10mA/cm^2$ or at more than $100mA/cm^2$ has poor performance of ozone evolution and poor adhesive strength to substrate. In the beginning of ozone evolution, surface structure of lead dioxide was changed and this change resulted in good effects on ozone evolution. Lead dioxide doped with other elements was favorable not to ozone evolution but to oxygen evolution, so it is speculated that ozone evolution has not intermediate stage of oxygen evolution and occurs competitively with oxygen evolution. When ozone was evolved at $0.7{\sim}0.8A/cm^2$, the current efficiency was highest.

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A Study on the Kinetics of Copper Ions Reduction and Deposition Morphology with the Rotating Disk Electrode (RDE를 이용한 구리이온의 환원속도 및 전착형태에 관한 고찰)

  • Nam, Sang Cheol;Um, Sung Hyun;Lee, Choong Young;Tak, Yongsug;Nam, Chong Woo
    • Applied Chemistry for Engineering
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    • v.8 no.4
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    • pp.645-652
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    • 1997
  • Electrochemical characteristics and kinetic parameters of copper ion reduction were investigated with a platinum rotating disk electrode (RDE) in a diffusion controlled region. Reduction of Cu(II) in sulfate had one-step two-xelectron process, while the reduction of Cu(II) in chloride solution was involved two one-electron processes. The transfer coefficient of Cu(II) in sulfate solution was lowest, and the transfer coefficient of Cu(I) in halide solutions had the value of nearly one. In chloride solutions, electrodeposition rate of Cu(II) was about one hundred times faster than Cu(I). Diffusion coefficient increased in the order of Cu(II) in chloride solution, Cu(I) in the iodide, bromide, chloride solution, Cu(II) in sulfate solution. The calculated ionic radii and activation energy for diffusion decreased in the same order as above. Morphological study on the copper electrodeposition indicated that the electrode surface became rougher as both concentration and reduction potential increases, and the roughness of the surface was analyzed with UV/VIS spectrophotometer.

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Effect of the particle size on the electrical contact in selective electro-deposition of copper (구리의 선택적 전착에서 결정 입자의 크기가 전기적 접촉성에 미치는 영향)

  • Hwang, Kyu-Ho;Lee, Kyung-Il;Joo, Seung-Ki;Kang, Tak
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.1 no.2
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    • pp.79-93
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    • 1991
  • With the advent of ULSI, many problems in previous metallization techniques and interconnection materials have become more serious. In this work, selective deposition of copper to fill the submicron contact has been tried. After forming electro-deposited copper films on p-type (100) silicon wafer using 0.75M $CuSO_4{\cdot}$5H_2O$ as an electrolyte, the effect of deposition time, current density and concentration of an additive on film properties were investigated. Film thickness, particle size and resistivity were analyzed by Alpha Step, SEM and 4 - point probe measurement respectively. The deposition rate was about $0.5-0.6\mu\textrm{m}$/min at $2A/dm^2$ and the particle size increased with increasing current density. The resistivities of electro-deposited copper films were about $3-6{\mu}{\Omega}{\cdot}$cm for the particle size above $4000{\AA}$. By the addition of 0.2 g/l gelatin, the particle size was reduced to less than $0.1{\mu}m $ and selective plugging of copper on submicron contacts could be successfully achieved.

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Formation Control of Calcium and Magnesium Compounds by Electrodeposition Process in Seawater (해수 중 전착 프로세스에 의한 칼슘 및 마그네슘 화합물의 형성 제어)

  • Park, Jun-Mu;Hwang, Seong-Hwa;Choe, In-Hye;Gang, Jun;Lee, Myeong-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.164-164
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    • 2017
  • 해양환경 중 많이 사용되는 철강재료들은 그 가혹한 부식환경에 대응하기 위하여 일반적으로 피복 도장방식법이나 음극방식법이 적용되고 있다. 여기서 음극방식법은 선박 및 해양구조물의 해중부 부식에 대해 가장 효과적인 방식법으로 알려져 있다. 한편, 이와 같이 해수 중 철강재에 음극방식을 적용할 경우, 피방식체인 그 강재 표면에 해수 중 용존된 산소의 음극환원 반응이 일어나며 국부적인 알카리 표면 조건을 형성시켜 $Mg(OH)_2$$CaCO_3$의 막을 석출시킨다. 이와같이 음극방식 중 형성된 전착물은 방식해야 될 표면적을 감소시켜 방식전류밀도를 감소시키는 효과가 있는 것으로 보고되고 있다. 이렇게 석출된 전착물은 음극표면에 부분적으로 형성되고, 여러 가지 환경 조건 등의 영향을 받아 그 피막의 형성 정도도 가늠하기 어렵기 때문에 음극방식 설계 시 그 정도에 따른 영향을 고려-반영하기가 곤란하다. 또한 이 전착물은 그 형성 메커니즘에 관한 해석이나 강도, 균일한 밀착성, 장기적인 방식효과 및 효율성 등이 아직 충분히 입증되어 있지 않은 실정에 있다. 따라서 본 연구에서는 해수 중 다양한 전착 프로세스에 의해 제작된 전착물의 기간별, 도장코팅 종류별 특성변화를 분석 및 평가하고, 전착물에 의한 희생양극 소모전류 변화 측정 분석을 통해 전착막을 균일하고 치밀하게 형성시키기 위한 최적의 조건을 찾고자 하였다. 또한 석출속도, 밀착성 및 내식특성을 향상시키기 위해 해수 중 기체를 용해시켜 제작한 막의 특성을 분석-평가하였다. 본 연구에 사용된 강 기판은 일반구조용강(KS D 3503, SS400)으로 ${\varnothing}42.7{\times}1,000mm{\times}4.0t$의 형상으로 제작하였다. 인가된 전류밀도는 1, 3 및 $5A/m^2$이고 도장 코팅 종류별 전착 석출물의 형성차이 비교 분석을 위한 실험은 선박 및 해양구조물에 많이 사용되는 Universal Epoxy 도료 2종을 선정하여 진행하였다. 또한 Steel Wire Mesh의 영향을 알아보기 위해 Mesh를 설치하여 실험을 진행하였다. 기간별-도장 종류별 외관관찰, 전착물의 두께 측정, SEM, EDS 및 XRD를 통해 막의 모폴로지, 조성원소 및 결정구조를 분석하였으며, 전착물의 내식성과 내구성을 평가하기 위해 테이핑 테스트(Taping Test) 및 전기화학적 양극분극 시험을 실시하였다. 희생양극 소모율에 대한 전착물의 영향을 확인하기 위해 외부전원을 인가하여 전착 피막을 형성시킨 강 기판에 희생양극을 연결하여 희생양극 소모효율 측정 시험을 진행하였다. 전착물의 석출량은 시간 및 전류밀도의 증가에 따라 비례하여 증가하였으며, 음극전류 인가 시 금속과 용액 계면 사이의 확산층에서 발생한 $OH^-$ 이온으로 인해 금속과 용액 계면 사이 pH가 부분적으로 증가하여 $Mg(OH)_2$ 화합물이 많이 생성되는 것으로 확인되었다. 또한 Mesh의 부착으로 평활하지 않게 형성된 미세한 굴곡구조 및 표면적 증가로 인하여 단계적으로 피복되는데 필요한 시간이 지연되면서 $CaCO_3$에 비해 $Mg(OH)_2$ 화합물이 상대적으로 증가한 것으로 사료된다. $CaCO_3$(Aragonite) 구조는 견고한 피막으로 치밀하고 화학적 친화력이 높아 우수한 밀착성을 보였으며 전착물의 영향으로 양극 전류가 감소하였고, 이로인해 방식전류 절감효과를 얻을 수 있을 것으로 기대된다.

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