• Clean Technology
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• v.28 no.4
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• pp.278-284
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• 2022

This study presents an excellent planar heater based on low-dimensional composites. By optimizing the ratio of 1D carbon nanotubes (CNT) and 2D MXene (Ti₃C₂T_X), it is possible to create a planar heater that has superior electrical conductivity and high heat generation characteristics. Low-dimensional composites were prepared by mixing CNT paste and MXene solution with eco-friendly waterborne polyurethane (WPU). In order to find the optimal mixing ratio for the MXene-CNT-WPU composites, samples with MXene to CNT weight ratios of 3:1, 1:1, 1:3, 1:7, and 1:14 were investigated. In addition to these different weight ratios, 5 wt% WPU was equally applied to each sample. It was confirmed that the higher the weight ratio of CNT, the lower the sheet resistance and the higher the heating temperature. In particular, when the MXene-CNT-WPU planar heater was fabricated by mixing MXene and CNT at a weight ratio of 1:7 and 1:14, the heating temperature was higher than the heating temperature of a CNT-WPU planar heater. These characteristics are due to the optimized mixture of the 1D materials (CNT) and the 2D materials (MXene) causing the formation of a flat surface and a dense network structure. The low-dimensional composites manufactured with the optimized mixing ratios found in this study are expected to be applied in flexible electronic devices.

• Journal of Korean Electronics
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• v.21 no.11
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• pp.19-23
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• 2001

향후 디지털 사회는 포스트 PC가 주도할 전망이다. 이에 따라 포스트 PC사업을 둘러싸고 마이크로소프트와 리눅스 업체들 간 협력사 확보 경쟁도 치열하게 전개되고 있으며 연말쯤에는 윈도우와 리눅스 계열의 포스트 PC제품이 속속 등장해 수요경쟁을 벌일 것으로 전망된다. 이에 본회 정보 통신 산업 팀에서는 지난 10월 12일 COEX에서 한국전자전 부대행사로 본회 회원사, 컴퓨터 업체, 정보통신 벤처 업계 등 1000개사가 참석한 가운데 국내 POST PC산업현황과 향후 발전방안을 주제로 기술세미나를 개최하였다. 본고는 세미나 내용 중 전자부품연구원 서경학 본부장이 발표한 내용을 중심으로 요약 정리하였다.

• ETRI Journal
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• v.11 no.4
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• pp.3-21
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• 1989

본고에서는 TDX 시스팀의 신뢰도 보증 및 효율적 관리를 위하여 TDX-1A 시스팀에서 사용되고 있는 부품의 신뢰도 예측치와 현장운용데이터에서 나온 신뢰도 평가치를 비교 검토한후, TDX-1A 시스팀의 신뢰도 예측결과를 검증하고, 또한 외국의 고장율 예측방법과의 차이점을 도출하여 이를 TDX 시스팀의 신뢰도 예측방법에 적용한 후 TBX-1A 현장운용데이터로 보완된 TDX 환경에 적합한 부품 고장율 예측방법을 정립, 제시하고자 한다.

• Electronics and Telecommunications Trends
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• v.4 no.4
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• pp.47-64
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• 1989

최근 날로 전자기기의 소형, 경량화, 다기능화와 초정밀화 추세로 기술혁신이 급속히 진전됨에 따라 이 분야의 최적 설계를 위한 부분중 열설계 기술의 중요성이 더욱 인식되고 있다. 따라서, 본고에서는 전자 부품들의 상호 접속지지체로서 기능을 가진 인쇄배선판(PCB)에서 고정도, 미세화등의 고밀도화가 점점 가중되고 있는 점을 감안하여 설계시 고려되어야 할 열설계 기술의 제반 사항에 대해 기술하였다.

• Fashion & Textile Research Journal
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• v.25 no.3
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• pp.398-408
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• 2023

Smart clothing products can experience a decrease in performance and reliability due to various mechanical, biological, and chemical stress factors that occur throughout their life cycle. These issues can hinder consumer acceptance of the products. This study aims to enhance the reliability of smart clothing and facilitate quality control by analyzing and identifying the current status of international standardization for smart clothing and electronic textiles (e-textiles). The focus of this analysis was on the durability test methods in the use environment. Furthermore, similar standards published by different standardization organizations for durability tests were compared in depth. The study showed that a total of 27 international standards have been developed or are currently under development. The current standardization efforts mainly aim to develop functionality and durability test methods for smart clothing and e-textile products. A detailed comparison was made between two international standards (IEC 63023-204-1:2023 and AATCC TM210:2019) specifically in relation to the washing durability test method and the electrical resistance measurement standards (BS EN 16812:2016 vs AATCC EP13-2021), before and after the environmental exposure tests. Based on this comparison, several suggestions have been made and discussed for the future revision of these international standards.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• The Optical Journal
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• s.145
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• pp.45-46
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• 2013

국내 최대 규모의 전자제조장비 종합 전시회 'Electronics Manufacturing Korea 2013(EMK 2013)'가 지난 4월 3일부터 5일까지 서울 삼성동 코엑스에서 개최됐다. EMK 2013은 K.Fairs와 학국광학기기산업협회, Reed Exhibition, J.EXPO가 공동 주최하고 산업통상자원부, 중소기업청, 전자부품연구원, 대한전자공학회, 한국산업기술시험원 등이 후원하는 전시로, 올해 약 20여 나라에서 260여 업체가 750여 부스 규모로 참여한 가운데 성황리에 진행됐다.

• Electronics and Telecommunications Trends
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• v.26 no.2
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• pp.100-110
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• 2011

반도체는 전자시스템의 제어 운용, 정보저장의 기능을 수행하는 핵심부품으로서 휴대폰, 자동차 등 주력산업의 경쟁력을 좌우할 정도로 파급효과가 크다. 중국은 전세계 전자장비 생산이 중국으로 이전되고 있고 중국 내수시장의 급속한 성장에 따라 반도체 산업이 고도성장을 기록하고 있다. 이미 세계 반도체 시장에서 최대의 소비국으로 자리잡고 있고, 파운드리 분야와 팹리스 분야에서 강점을 보이고 있다. 본 고에서는 중국의 반도체 산업을 중국 정부의 반도체 정책, 산업동향 및 특성, 반도체기업 현황을 중심으로 분석하고 우리에게 주는 시사점을 도출하고자 한다.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.53-64
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• 2021

As the 5G service market is expected to grow rapidly, the development of high-power, high-efficiency power amplifiers for the 5G communication infrastructure is indispensable. Gallium nitride (GaN) is attracting great interest as a key device in power devices and integrated circuits due to its wide bandgap, high carrier concentration, high electron mobility, and high-power saturation characteristics. In this study, we investigate the technology trends of Ka-band GaN radio frequency (RF) power devices and integrated circuits for operation in the millimeter-wave band of recent 5G mobile communication services. We review the characteristics of GaN RF high electron mobility transistor (HEMT) devices to implement power amplifiers operating at frequencies around 28 GHz and compare the technology of foreign companies with the device characteristics currently developed by the Electronics and Telecommunication Research Institute (ETRI). In addition, the characteristics of Ka-band GaN monolithic microwave integrated circuit (MMIC) power amplifiers manufactured using various GaN HEMT device technologies are reviewed by comparing characteristics such as frequency band, output power, and output power density of integrated circuits. In addition, by comparing the performance of the power amplifier developed by ETRI, the current status and future direction of domestic GaN power devices and integrated circuit technology will be discussed.

• Current Industrial and Technological Trends in Aerospace
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• v.6 no.1
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• pp.65-73
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• 2008

As the system requirements of performance, weight, cost are increasing, the needs of electronic parts which have high performance and efficiency are growing. To satisfy such requirements, demand of high performance and rapid upgraded commercial parts is also increasing compared to NASA or ESA standard parts. Especially, commercial PEM(Plastic Encapsulated Microcircuit) parts are applied in many space programs and research is continuing to broaden its application area. In this paper, concerns and verification trends of commercial PEM parts in space applications are introduced.