• Title/Summary/Keyword: 전기 은도금

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Trend of Silver Plating (은도금의 기술동향)

  • Kim, Yu-Sang;Jeong, Gwang-Mi
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.328-328
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    • 2012
  • 전기도금 중에서 가장 빠른 시기에 공업화된 것이 은도금이며 귀금속으로서 은의 특성은 장식성과 약품에 대한 민감한 화학특성 때문에 식기나 생활용품에 많이 사용되고 있다. 정보산업의 확대와 함께 전자산업에서 은도금의 수요는 비약적으로 늘었지만, 전도성을 주목적으로 하는 전기 전자산업이 뒤를 이으면서 기계적 특성을 이용한 용도를 들 수 있다. 본고에서는 최근의 습식주석도금의 특성을 중심으로 기술하였다.

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Surface Treatment of Dielectric Ceramic Resonator for High Frequency Devices (고주파용 유전체 세라믹 공진기의 표면처리)

  • Park, Hae-Duck;Kang, Sung-Goon
    • Korean Journal of Materials Research
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    • v.11 no.11
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    • pp.923-928
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    • 2001
  • An electrolytic silver plating process has been successfully developed for terminated electrode parts of dielectric ceramic resonator. High adhesion strength and high Qu is obtained and blister occurance is minimized under plating condition with $HNO_3$750 $m\ell/\ell$ and HF $ 250m\ell/\ell$ solution at $25^{\circ}C$ for 20 minutes. Adhesion strength has the highest value, 3.2 kg/mm$^2$ at etching temperature of $25^{\circ}C$. Adhesion strength, Qu and blister occurance are monotonically increased with the thickness of electrodeposition layer. In case of electrodeposition of Ag, Qu value of 380 has obtained higher than in case of electrolytic Cu plating with Qu value of 325. Therefore, terminated electrode parts of dielectric ceramic resonator reducing dielectric loss can be obtained using prensent process.

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A Study on he Electroless Deposits and Electrodeposits (무전해 은도금층과 전기도금층의 형성에 관한 연구)

  • ;;;;Gerard P. Martins
    • Journal of Surface Science and Engineering
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    • v.33 no.4
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    • pp.273-280
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    • 2000
  • Silver was deposited on glass by electroless plating and electroplating. Surface properties were investigated using the AFM. Crystal structure of deposit layers was confirmed by TEM and XRD. Electroplating is performed by DC plating and pulse plating, respectively. This study resulted in followings, first, deposit of electroless plating showed fine grain and was similar to the amorphous structure. Second, electrodeposit on the electroless layer was revealed following results ; (1) more uniform layer and finer grains were obtained with increasing frequency (2) more isotropic structure was obtained with increasing frequency (3) finer grains at 25% duty cycle was obtained (4) grain size and roughness of the silver deposit was decreased with increasing frequency.

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Fretting Corrosion Behavior of Silver-Plated Electric Connectors with Constant Displacement Amplitude (일정 변위 진폭조건에서의 은도금한 커넥터의 미동마멸부식 거동)

  • Oh, Man-Jin;Kim, Min-Jung;Kim, Taek-Young;Kang, Se-Hyung;Kim, Ho-Kyung
    • Tribology and Lubricants
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    • v.30 no.2
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    • pp.99-107
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    • 2014
  • Fretting corrosion tests are conducted with a constant displacement amplitude using silver-plated brass coupons to investigate the effect of contact pressure on fretting corrosion. Three behaviors are identified based on the change in electric resistance and friction coefficient during the fretting test period, and the identified behaviors are dependent on the magnitude of the applied load. The failure cycle ($N_f$) with an electric resistance of 0.1 D cannot be achieved due to the adhesion behavior of the metal and metal contact under the higher applied load of 0.45 N. This suggests that an average contact pressure higher than 159 MPa for the silver-coated connector is desirable to gain an almost infinite lifetime. The relationship between the electric contact resistance (R) and the average contact pressure (p) can be written as $p=106.2{\times}{\Omega}^{-1.5}$.