• Title/Summary/Keyword: 잔불감지

Search Result 1, Processing Time 0.016 seconds

Study of IoT Module Package Design Optimization for Drop Testing by Drone (IoT 모듈 패키지 디자인 최적화 및 드론에서의 낙하해석 연구)

  • Jo, Eunsol;Kim, Gu-Sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.28 no.4
    • /
    • pp.63-67
    • /
    • 2021
  • In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO2) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.