• Proceedings of the KSME Conference
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• 2001.06d
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• pp.572-578
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• 2001

This study is to research the heat transfer characteristics in copper-water heat pipes with screen wick, #100. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size is smaller than before. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle ${-6}^{\circ}$, #100 2layer screen mesh is shown the best heat transfer performance.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.48-53
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• 2001

This experimental study is to research heat transfer characteristics in copper-water heat pipes with screen wick, the 150 and 200-mesh. Recent advances in the miniaturization and large capacity of electronic devices have had a major impact on the design of electronic equipment. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle, number of layer and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle $6^{\circ}$, the 200-mesh screen wick 3-layer is shown the best heat transfer performance.