• Journal of Adhesion and Interface
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• v.10 no.4
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• pp.191-198
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• 2009

UV-curable aliphatic epoxy acrylates were prepared by the reaction of glycerol diglycidyl ether (GDE) with 2-carboxyethyl acrylate (2-CEA) or 2-hydroxyethyl acrylate (2-HEA). The structures of the epoxy acrylates were characterized by FT-IR, $^1H$-NMR, and $^{13}C$-NMR and the yield was obtained by prep-LC. The UV- and the thermal-curing behaviors of the product were investigated using photo-DSC and DSC, respectively. The reactivity of 2-CEA was higher than 2-HEA and the yield of the product (GEA-C) which was prepared using 2-CEA was about 83%. The maximum UV-curing time ($T_{max}$) of the GEA-C contained non-reactive components and by-product was about 10 seconds. The GEA-C showed low color difference (${\Delta}E^*$), low viscosity, and good thermal stability - its value was 2.51, 192 cps, and $299^{\circ}C$ (at 5% weight loss), respectively. The activation energies ($E_a$) of thermal-curing reaction calculated from Kissinger and Ozawa-Flynn-Wall method were 91~92 kJ/mol.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.672-675
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• 2005

To imprint 70-nm wide line-patterns, we used a newly developed ultraviolet nanoimprint lithography (UV-NIL) process in which an elementwise patterned stamp (EPS), a large-area stamp, and pressurized air are used to imprint a wafer in a single step. For a single-step UV-NIL of a 4' wafer, we fabricated two identical $5'\times5'\times0.09'(W{\times}L{\times}H)$ quartz EPSs, except that one is with nanopatterns and the other without nanopatterns. Both of them consist of 16 small-area stamps, called elements, each of which is $10\;mm\;\times\;10\;mm$. UV-curable low-viscosity resin droplets were dispensed directly on each element of the EPSs. The volume and viscosity of each droplet are 3.7 nl and 7 cps. Droplets were dispensed in such a way that no air entrapment between elements and wafer occurs. When the droplets were fully pressed between ESP and wafer, some incompletely filled elements were observed because of the topology mismatch between EPS and wafer. To complete those incomplete fillings, pressurized air of 2 bar was applied to the bottom of the wafer for 2 min. Experimental results have shown that nanopatterns of the EPS were successfully transferred to the resin layer on the wafer.