• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 추계학술대회 논문요약집
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• pp.37-37
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• 2003

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 추계학술대회 논문요약집
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• pp.39-39
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• 2003

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1224-1226
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• 2003

In this work, we developed a high resolution printing technique based on transferring a pattern from a PDMS stamp to a Pd and Au substrate by microcontact printing Also, we fabricated various 2D metallic and polymeric nano patterns with the feature resolution of sub-micrometer scale by using the method of microcontact printing (${\mu}$CP) based on soft lithography. Silicon masters for the micro molding were made by e-beam lithography. Composite poly(dimethylsiloxane) (PDMS) molds were composed of a thin, hard layer supported by soft PDMS layer. From this work, it is certificated that composite PDMS mold and undercutting technique play an important role in the generation of a clear SAM nanopattern on Pd and Au substrate.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.624-627
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• 2003

Microcontact printing (uCP) of alkanethiols on gold was the first representative of soft-lithography processes. This is an attempt to enhance the accuracy of classical to a precision comparable with optical lithography, creating a low-cost, large-area, and high-resolution patterning process. Microcontact printing relies on replication of a pattered PDMS stamp from a master to form an elastic stamp that can be inked with a SAM solution(monolayer -forming ink) using either immersion inking or contact inking. The inked PDMS stamp is then used to print a pattern that selectively protects the gold substrate during the subsequent etch.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1511-1513
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• 2005

The polymer-light emtting diodes(PLEDs) were comprised a design of OLED array, process develop by using ITO thin glass, and fabrication of PDMS stamp by using nanocontact printing. In the study, we describe a different approach for building OLEDs, which is based on physical lamination of thin metal electrodes supported by a PDMS stamp layer against an electroluminescent organic. We develop that devices fabricated in this manner have better performance than those constructed with standard processing techniques. The lamination approach avoids forms of disruption that can be introduced at the electrode organic interface by metal evaporation and has a reduced sensitivity to pinhole or partial pinhole defects. Also, it is easy to build patterned PLED with feature sizes into the nanometer regime. This method provides a new route to PLED for applications ranging from high performance displays to storage and lithography systems, and PLED can used for organic electronics and flexible display.