• Journal of the Korea Concrete Institute
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• v.17 no.4 s.88
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• pp.543-550
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• 2005

In the present work, modulus of rupture (MOR), flexural toughness properties $(I_{30}\;and\;W_{2.0})$ and workability (slump) of high performance hybrid fiber reinforced concrete (HPHFRC) mixed with micro-fiber (carbon fiber) and macro-fiber (steel fiber), and replaced with a fine mineral admixture such as silica fume (SF) are characterized through the analysis of variance (ANOVA). Data of MOR, $I_{30}(or W_{2.0})$ and slump are used as the characteristic values to estimate flexural performance and workable property of HPHFRC. Specially, an experimental design was Planned according to the fractional orthogoanl nay method to reduce experimental number of times. The experimental results show that steel fiber is a considerable significant factor in MOR and I30 $(W_{2.0})$. Based on the significance of experimental factors about each characteristic factors, the following evaluation can be used: Experiment factors which reduce slump most remarkably are carbon fiber, steel fiber, silica fume order.; Those that improve MOR most significantly are silica fume $({\fallingdotseq}\;carbon\;fiber)$, steel fiber order; Those that increase flexural toughness most distinctly are silica fume, carbon fiber, steel fiber order. It is obtained that the combination of steel fiber $1.0\%$, carbon fiber $0.25\%$ and silica fume $5.0\%$ is the experimental condition that improve MOR and flexural toughness excellently with workability ensured within the experiment.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.223-223
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• 2016

산업 및 기술의 발전에 의해 많은 신소재들이 개발되고 있다. 그 중에서 금속 나노 분말의 경우, 자성소재, 차세대 MLCC, 전도성 페이스트, 살균 등 여러 산업분야에서 관심을 보이면서, 다양한 재료들이 개발되고 있는 추세이다. 그 중에서 금속 나노 분말은 입자 미세화에 따른 경도, 인성, 연성들의 기계적 특성 향상, 전자기적 기능의 향상 등 기존재료에 비해 우수한 물성, 새로운 기능의 발현이 입증되면서 차세대 소재로서 많은 연구가 진행되고 있다. 또한 최근에는 단순한 나노입자의 제조단계를 뛰어넘어 입경 및 입도의 제어 형상제어를 통한 입자 균일성이 요구되고 있다 DC 열 플라즈마를 이용한 나노입자 합성 방법은 초고온의 온도의 달성이 가능하여, 모든 금속원소에 대한 나노화 및 고순도화가 용이할 뿐만 아니라, 제조공정이 단순한 친환경 공법으로 저비용으로 나노입자를 제조할 수 있는 장점을 갖고 있다. 본 연구에서는 이송식 DC 열 플라즈마를 이용한 Cu 나노분말 제조, 비이송식 DC 열 플라즈마를 이용한 Fe 나노분말 합성 연구를 통해 반응기의 압력과 플라즈마 파워, Gas 유량등의 공정 변수가 나노입자 생성 특성에 미치는 영향을 확인 하였다. 또한 DC 열플라즈마 나노입자 합성 시스템에 대한 장비와 기술도 소개한다.

• Applied Chemistry for Engineering
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• v.9 no.3
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• pp.445-450
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• 1998

Interpenetrating polymer networks(IPNs) were prepared from castor oil-type polyurethanes(PUs) and epoxy resin. Two types of PU were prepared by using polypropylene ether glycol(PPG) as a chain extending agent and caster oil(CO) as a crosslinking agent. COPU/epoxy simultaneous interpenetrating polymer networks(SINs) based on CO had a better compatibility over the all composition than PPGPU/epoxy SINs based on PPG. The flexural strength of all PPGPU/epoxy SINs was decreased with decreasing entanglement of networks. COPU/epoxy SINs showed the higher fracture toughness and mechanial properties than the PPGPU/epoxy SINs. Fracture surfaces of all of the SINs showed the localized shear deformation and crack deflection rather than generation of stress whitening associated with the cavitation.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.4
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• pp.35-46
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• 2000

Semiconductor technology includes from semiconductor materials, design, fabrication, handling of process equipments, reliability test to packaged semiconductor devices. Our departmental curriculum is organized with 2-years/6-quarters system of Ulsan College: the understanding for the fundamental of semiconductor is carried out in the first academic year and the training for the design skill on semiconductor devices will be focused in the second academic year. The main focus is reflected on the worldwide trend on the design engineering of semiconductor devices and considered for the market establishment on design engineers trained by the lab-oriented practice as well as the fundamental of semiconductor technology.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.5
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• pp.185-189
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• 2005

This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.63-63
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• 2009

최근 연비 향상 및 배기가스 저감을 위한 친환경 경량 굴삭기에 대한 연구가 활발히 진행되고 있다. 이러한 시도는 굴삭기의 소재의 강도를 490MPa급에서 700MPa급으로 고강도화를 통하여 작업장치의 경량화를 도모하고 있다. 본 연구에서는 중장비용 고강도 열연강재로 재발중인 ATOS70강재의 기본 용접성 및 GMAW 용접부 특성을 검토하였다. 사용한 시험재는 현장시험재인 14~16mmt두께의 ATOS70강재를 사용하였고, 용접경화성 및 저온균열감수성을 평가하였다. 또한 GMAW 용접을 실시하여 용접부의 이음부 특성을 검토하였다. 14mmt 두께의 ATOS70강재의 탄소당량은 약 0.44수준이고, 모재 인장강도는 약 760MPa급 수준을 보였다. 한편 최고경도시험에 의한 용접부 최도경도는 약 300Hv 수준을 보였으며, 경사 y-groove구속시험에 의한 14mmt두께의 한계예열온도는 상온이었다. 한편 GMAW 용접부 인장시험결과 740MPa급 이상의 인장강도를 확보하였고, $-5^{\circ}C$ 용접부 Charpy 충격시험결과 48J 이상의 충격인성을 나타내었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.103.1-103.1
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• 2012

본 연구는 차량경량화를 위하여 높은 인장강도와 우수한 인성을 가지는 590MPa급 이상조직강(Dual phase steel)을 이용하여 1991년 TWI(The Welding Institute)에서 개발된 마찰교반접합을 적용하여 접합을 실시하였다. 접합의 공정조건으로 툴의 회전속도는 250~350 RPM, 접합속도로는 50~350 mm/min로 겹치기접합을 실시하였다. 접합에서 사용된 툴은 Megastir에서 제작한 고융점마찰교반접합용 툴인 PCBN(Q-60)을 이용하였고 연구에 사용된 DP590은 포스코(POSCO)에서 제작된 1.4t(mm) 두께인 AHSS(advanced high strength steels)을 사용하였다. 모재인 DP590과 접합체의 미세조직은 광학현미경과 주사전자현미경을 이용하여 관찰하였으며 기계적 특성은 경도시험과 인장시험을 실시하여 조사하였다. 경도의 분포는 모재에서 약 220~230Hv이며 TMAZ부분에서 상승하기 시작하여 접합부에서 약 320Hv까지 상승하는 경향을 보였으며 인장시험 결과 접합속도 100~200 mm/min에서는 모든 시편이 모재에서 파단되어지는 것을 확인할 수 있었다. 위와 같은 결과 300~350 RPM, 100~200 mm/min의 공정조건에서는 접합이 성공적으로 이루어졌으며 차량경량화에 적용이 가능하다고 판단되어진다.

• Journal of the Korean Ceramic Society
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• v.37 no.1
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• pp.50-56
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• 2000

Precursor gels with the composition of xZrO2·(100-x)SiO2 systems (x=10, 20 and 30 mol%) were prepared by the sol-gel method. Kinetic parameters, such as activation energy, Avrami's exponent, n, and dimensionality crystal growth value, m, have been simultaneously calculated from the DTA data using Kissinger and Matusita equations. The crystallite size dependence of tetragonal to monoclinic transformation of ZrO2 was investigated using XRD, in relation to the fracture toughness. The crystallization of tetragonal ZrO2 occurred through 3-dimensional diffusiion controlled growth(n=m=2) and the activation energy for crystallization was calculated using Kissinger and Matusita equations, as about 310∼325±10kJ/mol. The growth of t-ZrO2, in proportion to the cube of radius, increased with increasing heating temperature and hteat-treatment time. It was suggested that the diffusion of Zr4+ ions by Ostwald ripening was rate-limiting process for thegrowth of t-ZrO2 crystallite size. The fracture toughness of xZrO2·(100-x)SiO2 systems glass ceramics increased with increasing crystallite size of t-ZrO2. The fracture toughness of 30ZrO2·70SiO2 system glass ceramics heated at 1,100℃ for 5h was 4.84 MPam1/2 at a critical crystaliite size of 40 nm.

• Korean Security Journal
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• no.42
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• pp.393-422
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• 2015

The school is committed to the role of public education for the effective development of student academic achievement and intellectual ability. It is also a space to expand the range of care and understanding for others with as a member of the academic community as well. However, the reality of our country schooling has been pointed out that if a lot about the lack of character education related to the attitude of life care for others and feel a sense of responsibility. An individual is not necessarily emotional intelligence There are side out, as well as grow into adults, schools are obliged to teach a variety of methods associated with it. Nevertheless, education is not of the country beyond the formal excessive administrative work or other activities due to the process of character education to neglect, including the work of teachers. Therefore, students brought the expansion of the act that should not, and eventually lead to serious social issues that directly harm others, such as school violence. Therefore, students brought the expansion of the act that should not, and eventually lead to serious social issues that directly harm others, such as school violence. This study is based on an act of juvenile delinquency and criminology education was to refine the concept of toughness and validate the relationship between school violence through empirical research. Accordingly, from July 1, 2013 September 31, 2013 to 277 high schools across the country are attending the third year of the schools available for non-response and analysis of the students who participated in the admission and simulated typical presentation of K University in Gyeonggi-do not judge students in the final analysis, except for the data and data from a total of 1045 patients were utilized. As a result, many schools have experienced violence, male student work can be applied to a lot of rock school violence was experienced. Also, a lot of experience can be applied to a healthy student rock school violence, anger-control and empathy, this is considered a low student showed consciousness experienced school violence exerted.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.3 no.3
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• pp.3-7
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• 2010

As the distance between signal lines in memories of high density ICs like SoCs decreases rapidly, failure occurs more frequently and effective memory test techniques are needed. In this paper, a new SRAM structure is proposed to decrease test complexity and test time for embedded DRAMs. In the presented technique, because memory test can be handled as a single port testing and read-write operation is possible at dual port without high complexity, test time can be much reduced.