• Title/Summary/Keyword: 이동통신 단말기용

Search Result 72, Processing Time 0.02 seconds

Design of a CMOS Tx RF/IF Single Chip for PCS Band Applications (PCS 대역 송신용 CMOS RF/IF 단일 칩 설계)

  • Moon, Yo-Sup;Kwon, Duck-Ki;Kim, Keo-Sung;Park, Jong-Tae;Yu, Chong-Gun
    • Journal of IKEEE
    • /
    • v.7 no.2 s.13
    • /
    • pp.236-244
    • /
    • 2003
  • In this paper, RF and IF circuits for mobile terminals which have usually been implemented using expensive BiCMOS processes are designed using CMOS circuits, and a Tx CMOS RF/IF single chip for PCS applications is designed. The designed circuit consists of an IF block including an IF PLL frequency synthesizer, an IF mixer, and a VGA and an RF block including a SSB RF mixer and a driver amplifier, and performs all transmit signal processing functions required between digital baseband and the power amplifier. The phase noise level of the designed IF PLL frequency synthesizer is -114dBc/Hz@100kHz and the lock time is less than $300{\mu}s$. It consumes 5.3mA from a 3V power supply. The conversion gain and OIP3 of the IF mixer block are 3.6dB and -11.3dBm. It consumes 5.3mA. The 3dB frequencies of the VGA are greater than 250MHz for all gain settings. The designed VGA consumes 10mA. The designed RF block exhibits a gain of 14.93dB and an OIP3 of 6.97dBm. The image and carrier suppressions are 35dBc and 31dBc, respectively. It consumes 63.4mA. The designed circuits are under fabrication using a $0.35{\mu}m$ CMOS process. The designed entire chip consumes 84mA from a 3V supply, and its area is $1.6㎜{\times}3.5㎜$.

  • PDF

Design of a LTCC Front End Module with Power Detecting Function (전력 검출 기능을 포함하는 LTCC 프런트 엔드 모듈 설계)

  • Hwang, Mun-Su;Koo, Jae-Jin;Koo, Ja-Kyung;Lim, Jong-Sik;Ahn, Dal;Yang, Gyu-Yeol;Kim, Jun-Chul;Kim, Dong-Su;Park, Ung-Hee
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.19 no.8
    • /
    • pp.844-853
    • /
    • 2008
  • This paper describes the design of a FEM(Front End Module) having power detection function for mobile handset application. The designed FEM consists of a MMIC(Monolithic Microwave Integrated Circuits) power amplifier chip, SAW Tx filter and duplexer, diode power detector and stripline matching circuit. An LTCC(Low Temperature Co-fired Ceramics) technology is adopted for miniaturized FEM. The frequency band is $824{\sim}869$ MHz which is the uplink Tx band of the CDMA mobile system. The size of designed FEM is $7.0{\times}5.5{\times}1.5\;mm^3$, which is an ultra-small size even though the power detector circuit is included. All sub-components of FEM have been developed and measured in advance before being integrated into FEM. The measured output power and gain are 27 dBm and 27 dB, respectively. In addition, the measured ACPR characteristics are 46.59 dBc and 55.5 dBc at 885 kHz and 1.98 MHz offset, respectively.