• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.5
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• pp.1462-1471
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• 1991

본 연구에서는 미소 결함주위에서 발생, 전파하는 균열들에 미치는 초기 결함 깊이와 상호 간섭 영향을 검토하기 위하여 기존 재료가 갖고 있는 결함이나 비금속 개 재물로 대신할 수 있다고 생각되는 미소 원공의 크기를 변화시킨 모델에 대해 유한 요 소법을 이용하여 3차원적으로 응력을 해석하였다. 실제 사용하고 있는 부재에 결함 들이 존재할 경우 응력장의 간섭으로 피로 균열 진전이 가속화됨으로 미소 원공 주위 의 응력 분포 및 미소 원공사이의 응력장의 간섭과 미소 원공에서 발생, 전파하는 표 면 균열의 응력 확대 계수에 미치는 영향에 대하여 비교검토 하였다.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.145-153
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• 1999

This study has been performed to investigate the stress distribution around defects that behave as stress concentrators and fracture mechanical analysis for cracks initiatiating at stress concentrators. The stress distribution was analyzed using Finite Element Method and non dimensional stress intensity factor was determined by the mean stress method. In addition, stress interaction effects around defects and cracks were compared.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.5 s.176
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• pp.1288-1296
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• 2000

In this study, fatigue crack behavior between arbitrarily located defects was investigated by experiment. Especially, stress interaction between micro hole defects and fatigue cracking, and fatigue crack initiation life following the variation of location of micro hole defects were considered. In addition, crack initiation position by micro hole stress interaction and the relationship between stress concentration factor and fatigue initiation life are studied in detail.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.5
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• pp.1259-1268
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• 1995

The stress distribution around micro holes and the behavior of stress interaction between micro holes are considerd in the study. Several conclusions are extracted as follows : (1) The stress interaction varies with the distance e between micro holes. When the two micro holes are spaced in such a manner that theri two closest points are separated by a distance of micro hole radius (e=1), stress distribution is affected by a opposite micro hole in all the closest region. In addition, if two closest points are seperated by twice the distance of a micro hole radius (e=2), stress distribution is affected by a opposite micro hole in the region of -0.8.leq.x/r.leq.0.8 and the interaction effect can be neglected for e=4. (2)If the depth becomes larger than the radius, or the radius varies, the shape and magnitude of stress distribution around micro holes varies. (3) Hoop stress around a micro hole for the two dimensional configuration is larger than that of the three dimensional micro hole located on the surface of material for .theta. < 60.deg., but it is reversed for .theta > 60.deg.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.25-30
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• 2003

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• Journal of Ocean Engineering and Technology
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• v.1 no.2
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• pp.74-82
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• 1987

This study has been made to investigate into the behavior of fatigue limit, of fatigue crack initiation, and of fatigue crack propagation under the condition of rotating bending stress; specifically on the independency of stress field as well as the crack behavior of surface micro hole defect, which is made artificially through the specimen. The results obtained can be summarized as followa; 1) For the single micro hole defect, initiation of fatigue crack is occurred at both tips of microhole defect simultaneosly along the slip which are produced in the range of maximum principal stress arround micro hole defect independent of the size of micro hole defect. 2) For the neighbored deuble micro hole defects with equal size, in the range ($\frac{L}{r}$)ratio $\gtrsim$ 3 defined as the size of micro hole defect(2r) to the distance between the centers of micro hole defects (2L), the crack behavior of the micro hole defects is same as single one. However, for the range of $\frac{L}{r}$<3, the interference effect becomes significant as the ratio approaches to 1.