• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.2
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• pp.60-65
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• 2008

The high-technology industries including a semi-conductor and an information communication need an ultra-precision technology from the technological points of view. Nano technology based on an ultra-precision technology is being studied to overcome the delicate technology that may occur in the semi-conductor fields. Then, the transferring equipment with high resolution and long displacement becomes an important technology. The goal of this study is to analyze the displacement magnification mechanism driven by piezoelectric actuator which has high resolution and fast response characteristics using flexure hinge with the merits of soft displacement, negligible back-lash and stick-slip, and no-lubrication. The analyses to reduce the magnification losses occurred during the magnification process are performed using ANSYS software based on FEM. The five design variables such as arm thickness, thickness of hinge, radius of hinge, length of input side at the 1st lever and magnification ratio of 1st lever are optimized to induce the maximum magnification ratio using Taguchi method.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.3
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• pp.277-283
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• 2014

This paper presents the design, optimization and fabrication of a piezo driven micro-positioning stage constructed using a 3D-printer. 3D printing technology provides many advantageous aspects in comparison to traditional manufacturing techniques allowing more rapid prototyping freedom in design, etc. Micro-positioning stages have traditionally been made using metal materials namely aluminum. This paper investigates the possibility of fabricating stages using ABS material with a 3D printer. CAE simulations show that equivalent motion amplification can be achieved compared to a traditional aluminum fabricated stage while the maximum stress is 30 times less. This leads to the possibility of stages with higher magnification factors and less load on the driving piezo element. Experiment results agree with the simulation results. A micro-position stage was fabricated using a 3D printer with ABS material. The motion amplification is very linear and 50 nm stepping was demonstrated.

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.