• Title/Summary/Keyword: 유도 가열

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The power regulation of a High-Frequency Induction Heating System with time variance load using a neural fuzzy controller (뉴로퍼지 제어기를 이용한 고주파 유도 가열기의 시변부하에 대한 정전력 제어)

  • 장종승;김승철;임영도
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.2 no.2
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    • pp.223-230
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    • 1998
  • This paper describes a phase-shift pulse-width modulation and pulse-frequency modulation series resonant high-frequency inverter using IGBT(Insulated-Gated Bipolar Transistor) for the power control of high-frequency induction heating using neuro-fuzzy, which is practically applied for 20KHz~500KHz induction-heating and melting power supply in industrial fields. The adaptive frequency tracking based phase-shifting PWM(Pulse-Width Modulation) regulation scheme is presented in order to minimize switching losses. The trially-produced breadboards using IGBT are successfully demonstrated and discussed.

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전기응용

  • 대한전기학회
    • 전기의세계
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    • v.27 no.2
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    • pp.76-81
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    • 1978
  • (차례) I.전열 1.유도가열 및 유전가열 2.아아크 가열 및 저항가열 II.조명 1.조명의 기초와 측정 2.조명방식과 실제 3.광원 4.조명기구

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Induction Heating Device for Dental Implant Removal (인공치아의 임플란트 탈착을 위한 유도가열장치 연구)

  • Lee, Sang-Myung;Seo, Young;Song, Chang-Woo;Lee, Seung-Yop
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.5
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    • pp.305-311
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    • 2016
  • Induction heating is the process in which an electrically conducting object (usually a metal) is heated by electromagnetic induction through heat generated in the object by eddy currents. The main advantage of an induction heating device is the generation of the heat inside the target object itself. Hence, non-contact and safe heating devices are widely used in many industrial and medical fields. Recently, a new dental implant system was developed using a shape-memory alloy, wherein an artificial tooth could be easily removed from the dental implant by heating. This paper discusses the development of an induction-heating device to remove the dental crown in the new implant system. First, the finite element simulation of electromagnetic and thermal coupling analysis was implemented to obtain the temperature distributions of the target object for various frequencies, input currents, and coil shapes. Based on the simulation results, experiments were conducted by using prototypes, and an induction heating device was developed to remove the dental crown from the implant.

백색 LED증착용 MOCVD 유도가열 장치에서 가스 inlet위치에 따른 기판의 온도 균일도 측정

  • Hong, Gwang-Gi;Yang, Won-Gyun;Ju, Jeong-Hun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.115-115
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    • 2010
  • 고휘도 고효율 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색 LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 에피웨이퍼공정은 에피층과 기판의 격자상수 차이와 열팽창계수차이로 인하여 생성되는 에피결함의 문제로 기판과 GaN 박막층 사이에 완충작용을 해줄 수 있는 버퍼층 (Buffer layer)을 만든다. 그 위에 InGaN/GaN MQW (Multi Quantum Well)공정을 하여 고휘도 고효율 백색 LED를 구현 할 수 있다. 이 공정에서 기판의 온도가 불균일해지면 wafer 파장 균일도가 나빠지므로 백색 LED의 yield가 떨어진다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 등이 장비의 설계 요소이다. 본 연구에서는 유도가열방식의 유도가열히터를 이용하여 기판과 히터의 간격에 차이에 따른 기판 균일도 측정했고, 회전에 의한 기판의 온도분포와 자기장분포의 실험적 결과를 상용화 유체역학 코드인 CFD-ACE+의 모델링 결과와 비교 했다. 또한 가스의 inlet위치에 따른 기판의 온도 균일도를 측정하였다. 본 연구에서 사용된 가열원은 유도가열히터 (Viewtong, VT-180C2)를 사용했고, 가열된 흑연판 표면의 온도를 2차원적으로 평가하기 위하여 적외선 열화상 카메라 (Fluke, Ti-10)를 이용하여 온도를 측정했다. 와전류에 의한 흑연판의 가열 현상을 누출 전계의 분포로 확인하기 위하여 Tektronix사의 A6302 probe와 TM502A amplifier를 사용했다. 흑연판 위에 1 cm2 간격으로 211곳에서 유도 전류를 측정했다. 유도전류는 벡터양이므로 $E{\theta}$를 측정했으며, 이때의 측정 방향은 흑연판의 원주방향이다. 또한 자기장에 의한 유도전류의 분포를 확인하기 위하여 KANETEC사의 TM-501을 이용하여 흑연판 중심으로부터 10 mm 간격으로 자기장을 측정 했다. 저항 가열 히터를 통하여 대류에 의한 온도 균일도를 평가한 결과 gap이 3 mm일때, 평균 온도 $166.5^{\circ}C$에서 불균일도 6.5%를 얻었으며, 회전에 의한 온도 균일도 측정 결과는 2.5 RPM일 때 평균온도 $163^{\circ}C$에서 5.5%의 불균일도를 확인했다. 또한 CFD-ACE+를 이용한 모델링 결과 자기장의 분포는 중심이 높은 분포를 나타냄을 확인했고, 기판의 온도분포는 중심으로부터 55 mm되는 곳에서 300 W/m3로 가장 높은 분포를 나타냈다. 가스 inlet 위치를 흑연판 중심으로 수직, 수평 방향으로 흘려주었을 때의 불균일도는 각각 10.5%, 8.0%로 수평 방향으로 가스를 흘려주었을 때 2.5% 온도 균일도 향상을 확인했다.

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A Study on Quality Changes of Domestic Frying Oils by Thermal Oxidation (시판식용유의 가열시간에 따른 품질 변화에 관한 연구)

  • Chang, You-Kyung;Lee, Joung-Won;Kim, Teak-Je
    • Korean Journal of Food Science and Technology
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    • v.10 no.2
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    • pp.112-118
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    • 1978
  • Four domestic frying oils (soybean, corn, rapeseed and rice bran oil) were studied on their changing properties according to thermal oxidation by means of chemical analysis of their compositions and measurements of various physical and chemical properties. The content of linoleic acid which is an essential unsaturated fatty acid and the total amount of unsaturated fatty acids were highest in soybean oil (53.2% and 80.3% respectively) among the unheated frying oils and the degree of its thermal degradation was lowest during the continuous heating period for 48 hours at $180^{\circ}C$. However in general, the contents of unsaturated fatty acids were sharply decreased by thermal oxidation whereas the saturated fatty acid contents ranging 10-17% were not changed considerably, which largely agreed with the results of iodine value measurements. The free acid and peroxide values were also lowest in soybean oil (0.09 and 5.6 respectively) among the unheated oils whereas an anomalously high free acid value was observed in rapeseed oil (54.8) which was packed in unleveled glass bottles. Such a high value is probably ascribed to the photo-catalyzed oxidation during storage. The viscosity measurements have shown similar values before heating, but after thermal oxidation for 32 hours the rapeseed and rice bran oils became too thick to measure viscosity by capillary flow method with heavy darkening in color.

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The Study on FTPM and PSPM of High Frequency Induction-Heating Iron Load (고주파유도가열 철부하의 FTPM 및 PSPM 제어에 관한 연구)

  • 임영도;김두영
    • The Transactions of the Korean Institute of Power Electronics
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    • v.5 no.2
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    • pp.192-199
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    • 2000
  • This paper describes a Phase-Shift Pulse Modulation(PSPM) and Frequency Trad이ng Pulse Modulation(FTPM) s series resonant high-frequency inverter using IGBT for the power control of high-frequency induction heating u using Neuro-Fuzzy, which is practically applied for 20kHz~500kHz induction-heating and melting power supply in i indust껴aJ fields. The adaptive frequency tracking based on the PSPM(phase-shifting pulse modulation) r regulation scherne is presented in or$\tau$ler to l11lmmlZe svvitching losses. The trially-produced breadboards using N Neuro Fuzzy controller are successfully demonstrated cUld cliscussed.

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High-Frequency Induction Heating System Design of a PFM and PWM method using Fuzzy Control (퍼지제어기를 이용한 PFM 방식과 PWM방식의 고주파 유도가열기의 설계)

  • 장종승;설재훈;박종오;임영도
    • Journal of the Korean Institute of Intelligent Systems
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    • v.8 no.2
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    • pp.43-49
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    • 1998
  • This paper describes a phase-shift pulse-width modulation and pulse-frequency modulation seriesresonant high-frequency inverter using IGBT for the power control of high-frequency inductionheating using fuzzy, which is practically applied for 2 0- 5~0 0~~ ~in 1d uction-heating and meltingpov~er supply in industrial fields. The adaptive frequency tracking based phase-shifting PWMregillation scheme is presented in order to minimize switching losses. The trially-producedbreadboards using IGBT are succesfully demostrated and discussed.discussed.

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유한한 크기를 가지는 유도 결합 플라즈마에서 비충돌 가열 매커니즘 연구

  • Gu, Seul-Lee;Gang, Hyeon-Ju;Kim, Yu-Sin;Jang, Yun-Min;Gwon, Deuk-Cheol;Jeong, Jin-Uk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.140.2-140.2
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    • 2015
  • 낮은 압력의 평판형 유도 결합 플라즈마 (Inductively Coupled Plasma, ICP)에서 챔버 높이를 바꾸면서 전자 에너지 확률 함수 (Electron Energy Probability Function, EEPF)를 측정하였다. 측정된 전자 에너지 확률 함수에서 기울기가 평평한 부분이 관찰됐고, 이러한 전자 에너지 분포함수의 평평한 부분은 챔버 높이를 증가함에 따라 높은 전자 에너지로 옮겨졌다. 이러한 현상을 분석하기 위해서 2차원 비충돌 가열 메커니즘이 포함된 유도 결합 플라즈마 모델로부터 전자 에너지 확산 계수와 이론적인 전자 에너지 확률 함수를 구하여 실험 결과와 비교하였다. 이를 통하여, 측정된 전자 에너지 확률 함수의 평평한 부분은 전자 튕김 공진 (electron bounce resonance)에 의한 것임을 알 수 있었다.

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COG (Chip On Glass) Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field (교류자기장에 의한 유도가열체를 이용한 평판 디스플레이용 COG (Chip On Glass) 접속기술)

  • Lee Yoon-Hee;Lee Kwang-Yong;Oh Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.315-321
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    • 2005
  • Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm${\times}$5 mm size and $600{\mu}m$ thickness reached to $250^{\circ}C$ within 60 seconds. However, the temperature of the glass substrate was maintained below $100^{\circ}C$ at a distance larger than 2 mm from the Cu induction heating body. COG bonding was successfully accomplished with reflow of Sn-3.5Ag solder bumps by applying magnetic field of 230 Oe at 14 kHz for 120 seconds to a Cu induction heating body of 5mm${\times}$5mm size and $600{\mu}m$ thickness.

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Comparative Study on Numerical Analysis using Co-simulation and Experimental Results for High Frequency Induction Heating on SCM440 Round Bar (연동해석을 통한 SCM440 환봉의 고주파 유도가열 해석 및 실험 비교분석에 관한 연구)

  • Lee, Inyoung;Tak, Seungmin;Pack, Inseok;Lee, Seoksoon
    • Journal of Aerospace System Engineering
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    • v.11 no.3
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    • pp.1-7
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    • 2017
  • The applications of high-frequency induction heating has recently been studied in various industrial fields. In this study, induction heating is applied to a SCM440 specimen that is widely used in industry. The specimen was made up of a cylinder 20 mm in diameter and 160 mm long. An induction heating power supply module was used to generate heat in the cylinder at a high frequency (approximately 85 kHz) for 50 seconds. The temperature of the specimen was measured at the 150 mm length in 5 second intervals. Results such as joule heat and temperature are compared with the numerical model analysis using an electromagnetic-thermal co-simulation technique. The analytical model of the cylinder was modeled by considering the skin effect. The median measured temperature after induction heating was conducted for 50 seconds was $57.65^{\circ}C$, compared to a predicted analytical value of $57.27^{\circ}C$. Thus, the analytical results are in good agreement with the experimental results, and this model can predict the induction heating phenomenon numerically.