• Journal of the Korean Professional Engineers Association
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• v.26 no.5
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• pp.47-55
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• 1993

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.572-578
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• 2001

This study is to research the heat transfer characteristics in copper-water heat pipes with screen wick, #100. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size is smaller than before. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle ${-6}^{\circ}$, #100 2layer screen mesh is shown the best heat transfer performance.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.12
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• pp.1023-1030
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• 2002

This paper is to research the heat transfer characteristic performance of the copper-water heat pipe with the screen wicks. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size has been much smaller. As a result, a high-performance cooling system is needed. Experimental variables are inclination angles, temperatures of cooling water and the mesh number of screen wicks. The distilled water was used for the working fluid. At the inclination angle $6^{\circ}$ in top heat mode, the two layers of the 100-mesh screen wick showed the best heat transfer performance. The thermal resistance of the two layers with the 100-mesh screen was 0.7~$0.8^{\circ}C$/W.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.48-53
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• 2001

This experimental study is to research heat transfer characteristics in copper-water heat pipes with screen wick, the 150 and 200-mesh. Recent advances in the miniaturization and large capacity of electronic devices have had a major impact on the design of electronic equipment. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle, number of layer and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle $6^{\circ}$, the 200-mesh screen wick 3-layer is shown the best heat transfer performance.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.1
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• pp.18-24
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• 2001

Woven wire wick is very effective structure because of its easiness to insert inside of pipe for a miniature heat pipe. The present study was conducted to investigate the effect of the effective flow passage with respect to wire helix angle. Also effective thermal conductivity were examined by defining mean porosity considering effective liquid flow passages. Effective heat transfer area is varied with respect to wire helix angle, and in the range of $\thet=60~65^{\circ}C$, heat transfer area is decreased about 15~20%. Permeability of woven wire wick shows similar value of 200 mesh screen wick. And comparison of experimental results on effective thermal conductivity shows a fairly good agreement with the analytical results.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.11
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• pp.880-889
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• 2002

The purpose of the present study is to examine the factors affecting the heat transfer limitations of screen mesh heat pipe for electronic cooling by theoretical analysis. Diameter of pipe was 6 mm, and mesh numbers are 50, 100, 150, 200 and 250 and water was selected as a working fluid. According to the change of mesh number, wick layer, inclination and saturation temperature, capillary pressure, pumping pressure, liquid friction coefficient in wick, vapor friction coefficient, capillary limitation, entrainment limitation, sonic limitation and boiling limitation we analyzed by theoretical design method of a heat pipe. As some results, the capillary limitation in small diameter of heat pipe is largely affected by mesh number and wick layer.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.2
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• pp.236-243
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• 1999

Aluminum/Freon-22 heat pipes were manufactured and tested which have a special wick geometry combining axial groove and screen mesh. There were 14 axial grooves in a cross-section and these were covered by two layers of 350 mesh screens to enhance the thermal performance. The performance test was conducted by varying the thermal load and tilt angle. Furthermore, the operation limits and overall heat transfer coefficient were investigated. The experimental results will be useful in a variety of applications, especially in design and manufacturing of a high-efficiency heat exchanger and energy recovery systems.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2231-2233
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• 2001

현대사회에서 네트윅이 차지하는 비중은 점점 커져가고 있다. 따라서 네트윅을 활용할 수 있는 많은 노력들이 이루어지고 있다. 네트웍 프로토콜의 하나인 TCP/IP프로토콜을 이용한 LAN은 다른 정보를 처리하는 장치들을 연결하고, 자원을 공유하며, 고속의 통신을 가능하게하는 시스템이다. 본 논문은 TCP/IP 프로토콜과 장비와 장비 사이의 직렬 통신 방법인 RS232를 연계하는 게이트웨이를 통한 시스템 제어와 모니터링을 목적으로 하고자 한다. 제어 대상 시스템은 여러 가지의 적용이 가능하지만 본 논문을 위해 80C19SKC CPU로 제어되는 스텝 모터를 사용하였다.

• Journal of the Korea Institute of Military Science and Technology
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• v.9 no.2 s.25
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• pp.127-135
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• 2006

Experimental studies of the cylindrical sintered-copper wick heat pipes were carried out to investigate the capillary heat transfer characteristics. Six models of the sintered-copper wick heat pipes were manufactured and tested to evaluate the heat transport limitations and the thermal characteristics. Also the performance of the heat pipes was analyzed theoretically and compared with the test results. The heat pipe models are divided into two sintered-wick groups and the nominal particle sizes are $180{\mu}m$(wick #1) and $200{\mu}m$(wick #2) respectively The experimental results showed that, the porosity of wick #1 was higher than that of wick #2, and also the wick #1 was generally superior than the wick #2 for the heat transport capability. The maximum heat transport rates were increased as the wick thicknesses and the vapor temperatures were increased.

• Proceedings of the Korean Information Science Society Conference
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• 1998.10a
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• pp.703-705
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• 1998

본 논문에서는 MPI를 이용하여 분산 공유 메모리 시스템을 구현한다. 또한 사이클이 없는 방향성 그래프를 기반으로 한 분산 락 알고리즘을 기반으로 네트윅 환경에 적당한 알고리즘을 제안하고 구현하다. 사용된 MPI 는 분산 메모리 시스템의 메시지교환의 표준이므로 MPI 가 구현되어 있는 대부분의 분산 메모리 시스템에서 활용이 가능하여 높은 이식성을 가진다.