• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.420-420
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• 2007

ZnO 나노막대는 산화물 반도체로서 넓은 밴드캡 (3.37eV)을 가진 반도체이며, 테라급의 전계 효과 트랜지스터(FET), 대기오염물질 모니터링 센서, 태앙전지용 전극, UV 발광소자, 전계방출 디스플레이의 팀 등 나노기술 전반에 활용해 최근 각광을 받고 있는 물질이다. 최근 디바이스 응용의 효율을 높이기 위한 방편으로 나노막대에서 박막으로의 연구가 활발하다. 본 실험은 MOCVD률 이용하여 p-si 기판위에 나노막대를 성장시킨 후 압력 및 온도 등의 공정변수를 조절하여 나노막대에서 박막으로 성장형태를 변화시켰다. SEM으로 1 차원 나노막대에서 2차원의 나노박막으로 성장이 된 ZnO 하이브리드 구조를 확인할 수 있었다. 또, PL장비를 이용해 ZnO의 UV영역의 파장을 확인할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.290-290
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• 2010

현재 세계적으로 화석연료의 고갈로 인해 신재생에너지에 대한 관심이 모아지고 있다. 그중에서 태양전지가 가장 주목을 받고 있으며 태양전지는 크게 무기와 유기 태양전지로 구분된다. 실리콘 및 화합물 반도체를 이용한 무기 태양전지는 높은 에너지 변환 효율을 보이고 있으나 생산단가가 높아 화석연료로부터 얻는 에너지에 비해 경제성이 떨어진다. 그중에서 유기 태양전지는 무기 태양전지의 효율에는 미치지 못하지만 제작공정의 비용이 낮고, 투명하고 다양한 색을 나타낼 수 있으며, 특히 유연성을 바탕으로 원하는 제품의 디자인을 구현 할 수 있는 장점을 가진다. Inverted 구조는 conventional 구조에 비해 Al과 같은 air-sensitive한 전극을 대체 할 수 있다는 장점을 가진다. 본 연구에서는 sol-gel상의 ZnO를 스핀코팅 방법으로 박막을 형성하여 inverted 구조 형태의 유무기 하이브리드 태양전지를 제작하였으며, ZnO 코팅 공정 조건 (두께, 열처리 온도)에 따른 태양전지의 특성변화(광 변환효율 및 수명 등)를 관측하였다. 최적화된 ZnO의 공정조건에서 제작된 하이브리드 태양전지는 3% 이상의 광 변환효율과 1000시간 이상의 반감 수명을 가지는 우수한 특성을 보였다.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.4
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• pp.103-109
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• 2022

This significance of the infant care system has emerged due to sudden infant death during sleeping. This paper presented a design and implementation of a prototype model, which is a infant care device controlled by a smartphone using Bluetooth technology. Prototype Device Model consists of MCU(microcontroller unit), Accelerometer Sensor, Temperature Measuring Sensor, Sound Measuring Sensor, Bluetooth Module, and Camera Module. The proposed application transfers the information to the parent's smartphone and computers, such as infant's falling, crying, and fever detection. A test verified the availability of a prototype infant care system model using Bluetooth Low Energy with operating the low power driving.

• Journal of Industrial Convergence
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• v.20 no.8
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• pp.61-67
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• 2022

The Internet of Things(IoT) is one of the key technologies in the Fourth Industrial Revolution. The IoT is a system that acquires information from various sensors and provides meaningful information to users. The method of obtaining information from sensor is using WIFI, Bluetooth and Server. is not accessible to external users because of different type of networks or local area communication. For this reason, there is a problem that external user cannot receive notification in regard to sensor information. In this paper, we want to establish a cloud message environment using Google's FCM(Firebase Cloud Messaging) and find out through experiments how users can receive notifications even if they are outside.

• Proceedings of the Korean Society of Computer Information Conference
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• 2020.07a
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• pp.281-282
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• 2020

2019년 통계청의 보고에 의하면 1인 가구 수는 전체 가구 수 중 29.9퍼센트인 603만 9000가구로 600만 가구를 돌파하였고, 계속해서 상승 추세에 있다. 1인 가구 비율이 상승함에 따라 반려동물 사육 가정의 비율 또한 상승하고 있다. 본 논문에서는 반려동물을 사육하는 1인 가구를 위해 반려동물의 생체데이터, 활동량 등을 웨어러블 기기를 통해 측정하고, 센싱된 데이터를 원격으로 모니터링할 수 시스템을 제안한다. 아두이노를 이용하여 반려동물의 온도 등의 생체데이터와 활동량 체크를 위한 가속도 센서 데이터를 측정하고 와이파이 통신을 이용하여 데이터베이스 서버로 전송하는 기기를 구성하고, 센싱된 데이터를 사용자가 다운받아서 데이터를 분석, 모니터링할 수 있는 모바일 앱 인터페이스를 제공한다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.2
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• pp.135-141
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• 2019

Internet of thing becomes more active, many sensor devices are increasing. Sensors can use network wired network or use mobile communication network. From the viewpoint of the transmission rate, the mobile communication network can be roughly divided into two types of high-speed communication and low-speed communication. In the case of hundreds of millions of sensors in the mobile communication network, resources are wasted to use high-speed communication. Communication is required to reduce the transmission rate and appropriately allocate resources without wasting such resources. As the Internet of Thing has been activated, Narrowband Internet of Thing(NB-IoT), which is one of the low-power technologies in recent mobile communications, is in the spotlight from various companies. Currently, it can be seen that only NB-IoT or other low power consumption communication has the potential to be able to connect to the Internet with rapidly increasing sensor devices. In this paper, we designed and implemented a heater controller using Huawei NB-IoT communication Module, a server that collects controller information, and an application that allows default settings for devices. The main function of this system is to collect temperature and heater status and give it to the server, control the heater from the server, and set parameters for the heater to operate automatically. The system can be applied to places where wired communication is not established, such as road information, smart agriculture, and small reservoirs as well as heaters.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.8-16
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• 2023

The importance of next-generation packaging technologies is being emphasized as a solution as the miniaturization of devices reaches its limits. To address the bottleneck issue, there is an increasing need for 2.5D and 3D interconnect pitches. This aims to minimize signal delays while meeting requirements such as small size, low power consumption, and a high number of I/Os. Hybrid bonding technology is gaining attention as an alternative to conventional solder bumps due to their limitations such as miniaturization constraints and reliability issues in high-temperature processes. Recently, there has been active research conducted on SiCN to address and enhance the limitations of the Cu/SiO₂ structure. This paper introduces the advantages of Cu/SiCN over the Cu/SiO₂ structure, taking into account various deposition conditions including precursor, deposition temperature, and substrate temperature. Additionally, it provides insights into the core mechanisms of SiCN, such as the role of Dangling bonds and OH groups, and the effects of plasma surface treatment, which explain the differences from SiO₂. Through this discussion, we aim to ultimately present the achievable advantages of applying the Cu/SiCN hybrid bonding structure.

• KIISE Transactions on Computing Practices
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• v.23 no.10
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• pp.599-604
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• 2017

A useful application of smart assistants is to predict and suggest users' daily behaviors the way real assistants do. Conventional methods to predict behavior have mainly used explicit schedule information logged by a user or extracted from e-mail or SNS data. However, gathering explicit information for smart assistants has limitations, and much of a user's routine behavior is not logged in the first place. In this paper, we suggest a novel approach that combines explicit schedule information with patterns of routine behavior. We propose using inference based on a Markov decision process and learning with a reward function based on inverse reinforcement learning. The results of our experiment shows that the proposed method outperforms comparable models on a life-log dataset collected over six weeks.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.41 no.4
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• pp.461-466
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• 2016

In this paper, a capsule body shaped surveillance/monitoring device is developed. The device includes a camera and GPS module to transmit live video data and real time GPS coordinates respectively using the Intel Edison module. A control application is developed for the smart phones and tablets to wirelessly view the live video stream and location of the capsule device and also to switch between the multiple capsule devices installed at different locations. The coordination between the developed device and the smart phone / tablet is done using the wireless function of the Intel Edison module.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.