• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1377-1384
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• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.10a
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• pp.11-16
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• 1997

In this study, the finite element analysis of AA6061 wheel forging processes over hot working range is performed and a thermo-viscoplasticity theory applicable to hot forging is applied for simulation. Aluminum alloy has frequently been utilized to manufacture automobile and aircraft parts due to its various advantages such as lightness, good forgeability, and wear resistance. Several forging conditions are applied to the simulation, such as die speeds, rib thicknesses, and depth of die cavity. The effectiveness of the simulation results is summarized in terms of metal flow, strain distributions, temperature distributions, forging load, which are essential to over all process design.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.207-225
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• 1992

The study is concerned with the thermo-viscoplastic finite element analysis of axisymmetric forward hot extrusion through square dies. The problem is treated as a nonsteady state problem because the distribution of temperature and material properties are continuously changing with the punch travel. In square die extrusion, difficulties arise from the severe distortion and die interference of elements at the aperture rim of the die even with a small punch travel. And finite element computation is impossible without intermittent remeshing. Accordingly, an automatic remeshing technique is proposed by employing specially designed mesh structure near the aperture rim. The analysis of temperature distribution includes heat conduction through material interfaces, heat convection and radiation to the atmosphere and is carried out by decoupling the heat analysis from the analysis of the deformation. The extrusion load and the distributions of strain rate and temperature are computed for the given cases rendering reasonable results. Computed grid distortions are found to be in good agreement with the experimental results. It has been thus shown that the proposed method of analysis can be effectively applied to the axisymmetric hot extrusion through square dies.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.126-133
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• 2002

The cutting thickness of ultra-precision machining is generally very small, only a few micrometer or even down to the order of a few nanometer. In such case, a basic understanding of the mechanism on the micro-machining process is is necessary to produce a high quality surface. When machining at very small depths of cut, metal flow near a rounded tool edge become important. In this paper a finite element analysis is presented to calculate the stagnation point on the tool edge or critical depth of cut below which no cutting occurs. From the simulation, the effects of the cutting speed on the critical depths of cut were calculated and discussed. Also the transition of the stagnation point according to the increase of the depths of cut was observed.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.12
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• pp.2970-2981
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• 1993

In hot closed-die forging the load increases rapidly near the final stage. Preforming operation is important to both the sound final forging and die-service life. In this study, the material flows during preforming and final forging are investigated. The physical modeling with Plasticine as a model material showed clear flow patterns. The forging process were numerically simulated by the finite element method with the isothermal and the non-isothermal models. The flow patten of the isothermal simulation showed good agreements with the experiments. Temperature changes and pressure distributions on the die surfaces during one cycle of the forging process were obtained from the non-isothermal simulation. High pressure and temperature were developed at certain areas of the die surfaces. It was concluded that those areas usually coincide with each other and should be distributed by the preforming operations to enhance the die life.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1042-1049
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• 1997

LMFBR(Liquid Metal Fast Breeder Reactor) vessel is operated under the high temperatures of 500-550.deg. C. Thus, transient thermal loads were severe enough to cause inelastic deformation due to creep-fatigue and plasticity. For reduction of such inelastic deformations, Y-piece structure in the form of a thermal sleeve is used in LMFBR vessel under repeated start-up, service and shut-down conditions. Therefore, a systematic method for inelastic analysis is needed for design of the Y-piece structure subjected to such loading conditions. In the present investigation, finite element analysis of heat transfer and inelastic thermal stress were carried out for the Y-piece structure in LMFBR vessel under service conditions. For such analysis, ABAQUS program was employed based on the elasto-plastic and Chaboche viscoplastic constitutive equations. Based on numerical data obtained from the analysis, creep-fatigue damage estimation according to ASME Code Case N-47 was made and compared to each other. Finally, it was found out that the numerical predictio of damage level due to creep based on Chaboche unified viscoplastic constitutive equation was relatively better compared to elasto-plastic constitutive formulation.