• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.65-65
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• 2003

청색 발광 LEDs의 개발과 상용화 이후에 백색조명등의 응용 가능성으로 인하여 이에 대한 많은 연구가 최근에 계속되고 있다 하지만 GaN의 많은 광학적인 장점에도 불구하고 이러한 소자의 기판으로 사용되고 있는 sapphire의 열악한 열적 특성은 소자의 열화를 야기할 수 있으며 특히 고출력작동 시에 소자성능 저하의 원인이 될 수 있다. 따라서 이러한 GaN를 기본으로 하는 LED의 경우 이에 대한 정확한 열 측정과 고출력 작동 시의 열적 모델링은 칩과 패키징 단위에서 모두 중요한 연구분야가 되고 있다. 고출력 GaN LED에 대하여 신뢰성에 관한 몇 가지 보고가 있지만, 이러한 보고의 대부분은 패키징 된 램프에 대한 분석이며 정작 칩에 대한 근본적인 열 분석과 신뢰성에 대한 연구결과는 미미한 실정이다 따라서 본 연구에서는 GaN LED 칩에 대하여 직접적인 열 분석을 시도하였다

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.33-36
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• 2009

콘덴서는 유도성 부하의 늦은 역률 보상으로도 사용되며, 비선형 부하에서 발생하는 고조파를 저감하기 위해 리액터에 직렬로 연결하여 사용되기도 한다. 콘덴서는 전압이 증가할 경우 전류도 함께 증가하고, 주파수가 증가할 경우 콘덴서에 흐르는 전류가 증가하기 때문에 전류의 증가는 바로 열의 증가로 콘덴서 절연에 스트레스로 작용하여 고장의 원인을 제공할 수 있다. 본 연구에서는 콘덴서에 인가되는 전압의 크기와 주파수를 변화시킬 경우 콘덴서에서 발생하는 열을 열화상 카메라로 측정하여 외부 및 내부에서의 온도분포를 분석하였다. 측정결과 전압과 주파수가 증가할 경우 콘덴서에서 열이 매우 높게 분포함을 확인할 수 있었다.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.113-119
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• 2012

The two-step water splitting thermochemical cycle is composed of the T-R (Thermal Reduction) and W-D (Water Decomposition) steps. The mechanism of this cycle is oxidation-reduction, which produces hydrogen. The reaction temperature necessary for this thermochemical cycle can be achieved by a dish-type solar thermal collector (Inha University, Korea). The purpose of this study is to validate a water splitting device in the field. The device is studied and fabricated by Kodama et al (2010, 2011). The validation results show that the foam device, when loaded with $CeO_2$ powder, was successfully achieved hydrogen production under field conditions. Through this experiment, we can analyze the characteristics of the catalyst and able to determine which is more advantageous thing to produce hydrogen compared with previous experiment that used ferrite-device.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2013.11a
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• pp.173-174
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• 2013

In this study, the tensile properties of sealants by heat deterioration were measured and analysed to gather the basic data of sealant because these studies do not have been investigated in Korea. Most general one-component silicone sealants were used and test specimen was I-type. The test parameters are sealant types which have different density and heat deterioration time in 80℃. As a result, the rat of reduction in area by heat deterioration was considerable increased at SR-A compared with SR-B. The tensile properties by heat deterioration decreased at SR-A because the specimen by deterioration occurred adhesive failure before tensile test. However, SR-B specimen was increased at maximum tensile stress but decreased at elongation in maximum tensile stress. Also, Maximum principal stress was measured at the edge of specimen by FEM simulation in order to find out failure points.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.2
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• pp.150-156
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• 2011

In this paper, infrared thermography measurement technique has been used to develop standard measurement technique for nondestructive testing of composite materials which is widely used in aerospace industries. To increase the defect detection rate, the related experiment used the lock-in IR-thermographiy method. Therefore it is of considerable interest in the field of non-destructive testing for fast discontinuity detection by using ultrasonic lock-in infrared thermography. The result also shows that as the investigation period of light source is lengthened according to the thickness of specimen, the possibility of detecting defects gets higher as well. However, the reason why the result values were not favorable when less than 50 mHz of light source was provided is because it was difficult to detect defects as the defect parts became a state of thermal equilibrium in general when thermal diffusivity affects the entire materials.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.10
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• pp.109-115
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• 2016

In this paper, In this paper, we use two methods to compare the slim speakers. That way, the diaphragm scan using laser and diaphragm photographed using a thermal imaging camera. Slim speaker has the structure of a flat plate type. Break-up mode by this characteristic is displayed in a larger size. Further, since the installation space is narrow, it has limited moving coil cooling. As a result, the break-up mode slim speakers, a significant impact on quality. In this study, try to connect the break-up mode of the diaphragm, the heat transfer mode of the diaphragm. Experiment for comparison, a two-step. The first step is to measure the divided vibration through the vibration plate scan. The second step measures the diaphragm photographed using a thermal imaging camera. Then, compare the results of both of the same frequency. Thus, comparing the heat transfer pattern and the pattern of break-up mode. Tend to be analysis of break-up mode from the pattern comparison, and document for the optimum design.

• Journal of the Korean Society for Railway
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• v.16 no.6
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• pp.466-472
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• 2013

The use of a concrete track is gradually growing in urban and high-speed railways in many part of the world. The resilient pad, which is essentially when concrete tracks are used, plays the important role of relieving the impact caused by train loads. The simple fatigue test[1] to estimate the variable stiffness of resilient pads is usually performed, but it differs depending on the practical conditions of different railways. In this study, the static stiffness levels of used resilient pads according to passing tonnages levels were measured in laboratory tests. Also, the simple fatigue test and the multi-stress accelerated degradation test for new resilient pads were performed in a laboratory. The static stiffness of the used pad was compared with the results of tests of usage times and cycles. The results of the comparison showed that the variable static stiffness levels of the used pad were similar to results of the multi-stress accelerated degradation test considering the fatigue and heat load. With a T-NT equation related to the degree of the multi-stress accelerated degradation, a model of multi-stress accelerated degradation for a resilient pad was devised. It was found through this effort that the total acceleration factor was approximately 2.62. Finally, this study proposes an equation for a multi-stress accelerated degradation model for polyurethane resilient pads.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.3
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• pp.8-14
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• 2002

UV, heat, and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the polymer surface. Especially, this study is focused on the inter-relation between chemical changes and electrical properties. In contact angle to measure the change of activated degree, that of polymers surface shows a slight hydrophobicity of 73$^{\circ}$~91$^{\circ}$. But, discharge treatment and UV treatment of 300 nm wavelength changed it to the hydrophilic one with the decrease of contact angle, 13.8$^{\circ}$ and 20$^{\circ}$ respectively. Thermal-treatment and UV treatment of 430~500 nm wavelength changed the surface to the hydrophobic one with the increase of contact angle, 90$^{\circ}$ and 80.1$^{\circ}$ respectively.  

• Fire Science and Engineering
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• v.15 no.1
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• pp.108-115
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• 2001

In this paper, we analyzed the properties change of electric wire when the thermal stress was applied to 600V grade polyvinyl chloride insulated wire (IV). In the structure analysis, normal wire has the properties of direction on the surface, but in case of deteriorated wire at above $400^{\circ}c$, it formed the carbide, the crack and the crystal. The surface composition rate of normal wire was Cu : 100%, but the section composition of the deteriorated wire at $800^{\circ}c$ showed Cu : 78.89%, O : 21.11%. In result of analyzing the differential scanning calory of copper wire, the new reaction peak was observed on the deteriorated wire at above $700^{\circ}c$. In case of the deteriorated wire as $150^{\circ}c$ at the differential thermal analysis, an endothermic reaction appeared at $264^{\circ}c$ lower than the reactive point of normal wire. The occupation rate of oxygen according to the deterioration of copper wire is about 20% at $500^{\circ}c$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.67-73
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• 2017

An analysis of thermal degradation of epoxy based adhesive performed by thermogravimetry tests are presented in this study. Six different heating rates were employed for the weight change measurements. Based on the data, an Arrhenius type modeling equation was developed by calculating activation energies and proportional constants, and $n^{th}$ polynomial function was adopted to predict the weight change rates. The prediction results by the modeling was compared with the data using the average activation energy. It was found that the activation energy at the each heating rate was not same due to the different degradation kinetics, especially at the high heating rate. To overcome this pitfall, a new approach using exponential function series was introduced and employed. The calculation results showed very good agreements with the test data regardless of the heating rates.