• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.133-133
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• 2003

• Transactions of the Korean hydrogen and new energy society
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• v.22 no.6
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• pp.827-834
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• 2011

Epoxy/graphite/expanded graphite composites have been prepared in various weight ratios and thermal degradation and electrical properties were estimated in order to use for the bipolar plate materials in PEMFC. Thermogravimetric analysis (TGA) showed that the epoxy/graphite system cured by a curing agent GX-533 was most proper because its weight loss until $80^{\circ}C$ at which PEMFC would be operated was 0.3 wt%, and differential scanning calorimetry (DSC) analysis showed its cure temperature would be sufficient at $80^{\circ}C$. The activation energy for the cure reaction was 132.0 kJ/mol and the pre-exponential factor was $1.76{\times}10^{17}min^{-1}$. Electrical conductivity on the surface of the bipolar plate prepared under a pressure of 200 $kgf/cm^2$ was increased from 4 to 25 $S/cm^2$ by increasing expanded graphite (EG) content from 50 phr to 90 phr. The percolation threshold was initiated around 75 phr and the corrosion rate at 80 phr was 1.903 $uA/cm^2$.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.4
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• pp.593-602
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• 2004

This paper is a study on the model of simultaneous heat and mass transfer process in the absorption of refrigerant vapor into a lithium bromide solution of water-cooled vertical plate absorber. The model can predict temperature and concentration profiles as well as the effect of Reynolds number on them. Also. the variations of the absorption heat and mass fluxes. and the heat and mass transfer coefficients have been investigated. The numerical result shows that the interface temperature and concentration decrease as film Reynolds number does. The absorption heat and mass fluxes, and the heat and mass transfer coefficients get their maximum values adjacent to the inlet solution. Analyses on a constant wall temperature condition have been also carried out to exam the reliability of the present numerical method by comparing to previous investigations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.81-85
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• 2002

전기 전자 제품에 사용되는 반도체 칩이나 부품들은 작동시 발열을 하게 되며 이러한 열은 적절히 제거되지 않은 경우 전기 전자 제품의 오작동을 유발시키는 요인이 된다. 발열부품이 작동할 때 발생되는 열을 제거하기 위해서 히트싱크나 냉각팬과 같은 구조를 발열 부품 장착시 같이 설치하는 방법이 일반적으로 사용되는 냉각구조 형태지만 이와 같은 냉각 구조는 최근의 전기 전가 제품의 소형화 추세에 부응하는데는 한계가 있다. 따라서 이러한 냉각 구조의 한계를 보완하기 위한 방안으로써 소형화한 히트싱크, 즉 두께와 방열의 중요 요인이 되는 히트싱크의 방열핀의 크기를 나노미터 단위에서 밀리미터 단위로 제조한 마이크로 히트 싱크를 제조하여 그 효용성에 대해 연구하고자 하였다. 마이크로 히트싱크의 제조는 균일한 포어를 포함한 폴리머 멤브레인에 열전도성이 뛰어난 금속을 무전해 도금하는 방법으로 제조하였으며 주사현미경으로써 관찰하였다.

• Transactions of the Korean hydrogen and new energy society
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• v.32 no.3
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• pp.180-188
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• 2021

This paper conducted a study on the ortho-para hydrogen conversion in the cryogenic heat exchanger filled with catalysts for hydrogen liquefaction by utilizing the numerical model of plate-fin heat exchanger considering catalytic reaction of ortho-para hydrogen conversion, heat and mass transfer phenomena and fluid dynamics in a porous medium. Various numerical analyzes were performed to investigate the characteristics of ortho-para hydrogen conversion, the effects of space velocity and activated catalyst performance.

• Journal of Korean Society of Steel Construction
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• v.25 no.5
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• pp.569-578
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• 2013

In a super-tall building construction, thick and large-sized embed plates are usually used to connect mega structural steel members to RC core wall or columns by welding a gusset plate on the face of the embed plate with T-shape. A large amount of heat input accumulated by weld passes causes the plates to expand or deform. In addition, the temperature of concrete around the plates also could be increased. Consequently, cracks and spalls occur on the concrete surface. In this study, the effect of weld heat on embed plates and 80MPa high strength concrete is investigated by considering weld position (2G and 3G position), edge distance, concrete curing time, etc. Measured temperature of the embed plates was compared with the transient thermal analysis results. Finally, push-out tests were performed to verify and compare the shear studs capacity of the embed plate with design requirement. Test result shows that the shear capacity of the plate is reduced by 14%-19% due to the weld heat effect and increased as the concrete curing time is longer.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.7-11
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• 2003

The semiconductor chips or electronic components generate heat, which causes malfunction of the parts when it was not cooled properly. Bulky heat sink and cooling fan are used to get rid of the heat. However, with this bulky system, it is hard to integrate the electronics system in a small scale. The cooling efficiency of the system depends on the surface area of the heat sink, thermal conductivity of the material and the method of integration. In order to develop a novel cooling system, a micro-heatsink with a large surface area while retaining small volume was fabricated by electroless deposition of gold/copper inside a Track-etched membrane. The structure of the micro-heatsink was investigated using SEM or optical microscope. It was also found that the micro-heatsink is more efficient than a flat copper plate.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.1
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• pp.49-59
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• 2005

The evaporation heat transfer experiments are conducted with the shell and plate heat exchanger (S&PHE) without oil in the refrigerant loop using R-410A. An experimental refrigerant loop has been established to measure the evaporation heat transfer coefficient h. of R-410A in a vertical S&PHE. Two vertical counter flow channels were formed in the S&PHE by three plates haying a corrugated trapezoid shape of a $45^{\circ}C$ chevron angle. UP flow of the boiling R-410A in one channel receives heat from the hot down flow of water in the other channel The effects of the refrigerant mass flux. average heat flux. refrigerant saturation temperature and vapor qualify are explored in detail. Similar to the case of a plate heat exchanger. even at a very low Reynolds number, the flow in the S&PHE remains turbulent. The Present data shows that the evaporation heat transfer coefficients of R-410A increased with the vapor qualify. The results indicate a rise in the refrigerant mass flux caused an increase in the h.. Raising the imposed wall heat flux is found to slightly improve h., while h, is found to be lower at a higher refrigerant saturation temperature. Based on the present data. empirical correlation of the evaporation heat transfer coefficient is proposed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.433.2-433.2
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• 2014

그래핀(graphene)은 탄소나노튜브(CNTs)에 비해 가격 경쟁력이 있고 우수한 광투과성과 전기 및 열 전도성을 갖고 있어 반도체 소재, 방열 소재, 접점 소재 등에 적용 가능성이 높은 재료로 주목받고 있다. 특히 모바일 디바이스의 소형화, 고집적화 등의 이슈로 인해 그래핀 소재의 방열 소재 적용을 위해 다양한 연구가 진행되고 있다. 한편 산화 구리 나노선(CuO Nanowire)은 전기 및 열전도도가 우수하고 1차원 나노 구조는 부피대비 큰 표면적, 종횡비가 커서 뛰어난 열전도 구조로서 방열 소재로 응용되기 좋은 조건을 갖고 있다. 본 연구에서는 2차원 구조의 그래핀 나노플레이트(Graphene Nanoplatelet)와 1차원 구조의 CuO NW를 하이브리드화를 통해 열전도도 향상를 개선시키고자 하였다. 소재 합성은 GNP에 Cu 무전해 도금을 진행한 후 열산화 방식을 적용하여 CuO NW를 직접 성장시키는 방식으로 진행하였다. 합성된 GNP-CuONWs 다차원 나노구조체의 열전도도 측정은 에폭시에 분산시켜 레이져 플레쉬법을 이용하였다. 미세 구조 관찰 결과, CuO NW 성장 거동은 열처리 온도 및 시간 그리고 O2 가스의 순환 환경이 주요인자로 작용하는 것을 확인하였다. 열전도도 향상은 다차원 구조의 특성으로 인해 면접촉과 선접촉이 동시에 이루어졌기 때문인 것으로 분석되었으며, 이러한 CuO NWs morphology와 열전도도 향상과의 상관 관계에 대해 논의할 것이다.