• Proceedings of the Computational Structural Engineering Institute Conference
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• 2011.04a
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• pp.157-160
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• 2011

본 연구에서는 광섬유 센서 기반 스마트 모니터링 시스템이 지중 열전도도 측정에도 효율적으로 적용될 수 있는지를 분석하였다. 이를 위해 광섬유 온도센서를 이용하여 지반의 열전도도를 측정할 수 있는 열응답 시험기가 개발되었다. 개발된 열응답 시험기는 기존의 RTD(Resistance Temperature Detector) 온도 센서 외에 광섬유 센서의 한 종류인 FBG(Fiber Bragg Grating) 센서도 실시간적으로 측정할 수 있는 시스템으로 구성되어 있다. 개발된 장비의 적용성 검증을 위하여 주문진 표준사를 이용하여 모형토조 내에 일정한 간극비에 맞추어 시료가 조성되었으며 지중열교환기는 U자형 파이프가 사용되었다. 20시간동안 열응답 시험을 통하여 광섬유 센서와 RTD 센서를 동시에 이용하여 온도값을 측정하여 표준사의 열전도도 값을 산출하였다. 그 결과 모형실험을 통한 열전도도 값은 탐침법을 통해 얻어진 열전도도 값과 선형 열원 모델(line source model) 해석해와 거의 유사하게 나타났으며 광섬유 센서와 RTD 센서와의 온도차는 0.1~0.3$^{\circ}$로써 유사한 값을 나타내었다. 따라서 본 연구에서 개발된 광섬유 기반 열응답 시험기는 지반의 열전도도를 측정하는데 효과적으로 사용될 수 있음을 알 수 있었으며 향후 지열시스템 가동에 따른 지중열 교환기의 손상도 평가 및 경보시스템 개발을 위해 지중열교환기의 거동을 실시간으로 모니터링 하는데 있어서도 효과적으로 사용될 수 있을 것으로 생각된다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.924-926
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• 2006

Sensor networks are an emerging area of mobile computing. Networked sensors represent a new design paradigm enabled by advances in micro electro-mechanical systems (MEMS) and low power technology. Created with integrated circuit (IC) technology and combined with computational logic, these 'smart' sensors have the benefit of small size, low cost and power consumption, and, the capability to perform on-board computation. Though this recent technological innovation has shown a significant promise in many application domains, it has also exposed several technical limitations that must be improved. In this paper, we discuss the system deploy issues for infrared thermo sensor camera calibration.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.32 no.4_1
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• pp.363-371
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• 2014

Most space-borne optical scanning systems adopt linear arrayconfigurations. The well-knownthree different types of space-borne sensors arealong-track line scanner, across-track linescanner, and three line scanner. To acquire accurate location information of an object on the ground withthose sensors, the exterior and interior orientation parameters are critical factors for both of space-borne and airborne missions. Since the imaging geometry of sensors mightchange time to time due to thermal influence, vibration, and wind, it is very important to analyze the Interior Orientation Parameters (IOP) effects on the ground. The experiments based on synthetic datasets arecarried out while the focal length biases are changing. Also, both high and low altitudes of the imagingsensor were applied. In case with the along-track line scanner, the focal length bias caused errors along the scanline direction. In the other case with the across-track one, the focal length bias caused errors alongthe scan line and vertical directions. Lastly, vertical errors were observed in the case ofthree-line scanner. Those results from this study will be able to provide the guideline for developing new linearsensors, so as for improving the accuracy of laboratory or in-flight sensor calibrations.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.5
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• pp.474-480
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• 2011

Space Imaging Sensor operated on LEO is affected from the Earth IR and Albedo as well as the Sun Radiation. The Imaging Sensor exposed to extreme environment needs thermal control subsystem to be maintained in operating/non-operating allowable temperature. Generally, units are periodically dissipated on spacecraft panel, which is designed as radiator. Because thermal design of the imaging sensor inside a spacecraft is isolated, heat pipes connected to radiators on the panel efficiently transfer dissipation of the units. First of all, preliminary thermal design of radiating area and heater power is performed through steady energy balance equation. Based on preliminary thermal design, on-orbit thermal analysis is calculated by SINDA, so calculation for thermal design could be easy and rapid. Radiators are designed to rib-type in order to maintain radiating performance and reduce mass. After on-orbit thermal analysis, thermal requirements for Space Imaging Sensor are verified.

• Proceedings of the Korean Information Science Society Conference
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• 2008.06b
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• pp.298-302
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• 2008

주어진 작은 크기의 칩 내부에 많은 기능 (예: 멀티미디어, 음성/영상 등)을 작동시키기 위해서는 고집적(high-integration)의 회로가 구현되게 된다. 이러한 고집적 회로는 작동할 때 상당한 양의 전력 소모를 유발하게 되어 결국 배더리 수명을 단축시키는 상황을 가지게 한다. 더욱 심각한 상황은 고 밀도의 칩 안에서의 많은 전력 소모는 열의 발생을 더욱 가속화 시키게 되며, 결국 칩 작동의 신뢰성(reliability)을 상당히 잃게 만든다. 본 연구에서는 칩의 작동에 따른 열 발생으로 유발되는 칩의 온도 상승을 감지하는 센서회로 구현에 관한 것이다. FPGA 칩은 주 목적의 기능을 수행하는 회로들을 구현함과 동시에 추가적으로 열 감지 센서 회로를 구현할 자원을 FPGA가 제공을 해 주어야 하는데, 주목적의 회로 공간(즉, 자원) 사용으로 인해 열 센서 회로 구현 자원이 충분하지 않을 경우나 여러 지역에 사용 가능한 자원이 소규모로 흩어진 경우 등 센서 구현을 위한 자원 탐색 및 구현 가능성에 대해 점검하는 알고리즘이 필요하다. 본 연구는 이러한 알고리즘을 개발하여 그 효용성을 실험을 통해 보이고 있다. 제안한 알고리즘의 특징은 Branch-and-Bound에 기반을 두고 있으며, 알고리즘의 수행 시간 단축을 위한 효과적인 search tree pruning 기법을 제안하고 있다.

• The Journal of the Acoustical Society of Korea
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• v.39 no.4
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• pp.255-262
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• 2020

In modern passive sonar systems, a towed array sensor is used to minimize the effects of own ship noise and to get a higher SNR. The thin and long towed array sensor can be guided in a non-linear form according to the maneuvering of tow-ship. If this change of the array shape is not considered, the performance of beamformer may deteriorate. In order to properly beamform the elements in the array, an accurate estimate of the array shape is required. Various techniques exist for estimating the shape of the linear array. In the case of a method using a heading sensor, the estimation performance may be degraded due to the effect of heading sensor noise. As means of removing this potential error, weighted polynomial fitting technique for estimating array shape is developed here. In order to evaluate the performance of proposed method, we conducted computer simulation. From the experiments, it was confirmed that the proposed method is more robust to noise than the conventional method.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.72-76
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• 2006

본 연구에서는 웨이브릿과 신경망을 결합하여 플라즈마 고장을 감시하기 위한 시계열 모델을 개발하였다. 본 기법은 플라즈마 증착장비에 의해 수집된 18 개의 센서정보에 적용하여 평가하였다. 이산치 웨이브릿(Discrete Wavelet Transformation)은 장비에서 수집된 센서정보의 전 처리를 위해 이용되었다. 시계열 모델의 성능은 과거와 미래정보의 함수로 평가하였다. 수집된 18 개의 센서정보에 대한 모델성능 비교를 위해 표준화된 성능평가지표가 적용되었다. 평가결과, 본 기법에 의해 개발된 시계열 모델은 대략 4% 정도의 예측에러를 보였다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.10
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• pp.1020-1025
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• 2010

On-board black body is used for radiation temperature calibration of spaceborne radiometers and imaging systems. The thermal design of black body proposed in this study is basically composed of heaters to heat-up the black body from low to high temperature during the calibration, heat pipe to transfer residual heat on the black body just after calibration to radiator on the S/C and heaters on the radiator to keep the certain temperature range of the black body during non-calibration. In the present work, the effectiveness of thermal design of on-board black body has been investigated by on-orbit thermal analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.4
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• pp.313-319
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• 2017

Fiber optics sensors that have been mainly applied to aerospace areas are now finding applicability in other areas, such as transportation, including railways. Among the sensors, the fiber Bragg grating (FBG) sensors have led to a steep increase due to their properties of absolute measurement and multiplexing capability. Generally, the FBG sensors adhere to structures and sensing modules using adhesives such as an epoxy. However, the measurement errors that occurred when the FBG sensors were used in a long-term application, where they were exposed to environmental thermal load, required calibration. For this reason, the thermal curing of adhesives needs to be investigated to enhance the reliability of the FBG sensor system. This can be done at room temperature through cyclic thermal load tests using four types of specimens. From the test results, it is confirmed that residual compressive strain occurs to the FBG sensors due to an initial cyclic thermal load. In conclusion, signals of the FBG sensors need to be stabilized for applying them to a long-term SHM.

• Journal of the Korea Society of Computer and Information
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• v.16 no.12
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• pp.11-21
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• 2011

An embedded sensor is significantly influenced by its spatial environment, such as barriers or distance, through low power and signal strength. Due to these causes, noise data frequently occur in an embedded sensor. Because the information acquired from the embedded sensor exists in a time series, it is hard to detect an error which continuously takes place in the time series information on a realtime basis. In this paper, we proposes an error detection method based on time-series prediction that detects error signals of embedded sensors in real time in consideration of the physical characteristics of embedded devices. The error detection method based on time-series prediction proposed in this paper determines errors in generated embedded device signals using a stable distance function. When detecting errors by monitoring signals from an embedded device, the stable distance function can detect error signals effectively by applying error weight to the latest signals. When detecting errors by monitoring signals from an embedded device, the stable distance function can detect error signals effectively by applying error weight to the latest signals.