• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.1
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• pp.81-87
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• 2000

A variable cutting speed control model was developed to be implemented for the flexible disk grinding process Control algorithm was based on the error referred by the discrepancy between current disk angle and intended one that are pro-posed to produce desired resulting depth of cut. Controller was implemented in two different aspect One was to initiate the control law from the beginning while the other was to activate as soon as the disk start to produce ground surface i.e. The beginning of the between edges stage. Several performance analysis were conducted comparing various process parameters such as cutting force disk angle depth of cut and disk speed with respect to process transition time Tentative results revealed that controller implemented from the earlier stages of the process showed better performance than the other revealed that controller implemented from the earlier stages of the process showed better performance that the other.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.31-31
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• 2004

차세대 정보통신 네트워크는 기하급수적으로 급증하는 트래픽 수요와 고속 및 대용량화는 서비스 형태에 따라 인터넷화 및 광통신화로 발전되고 있으며, 사용자들의 요구 통신 속도 또한 크게 증가하고 있어 2005-2010년경에는 인터넷 노드 하나가 처리해야 할 트래픽은 10-100Tbps가 될 전망이며 이를 수용, 교환처리, 전달하기 위한 방법으로 광통신 이외에는 기술적인 대안을 찾기 힘든 실정이다. 한국의 경우 세계최고의 광통신망 구축에 따라 광페룰의 기반 수요가 크게 기대되고 있으며, 전 세계적인 광통신망 구축계획(2005∼2007년, 초고속정보통신망 Fiber to the Home)에 따라 한국의 광통신 인프라에 대한 전세계의 관심이 고조되고 있다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.197-197
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• 2004

일반적으로 가공기는 주로 직선 운동 축과 회전 운동 축으로 구성되어 있으며, 여러 개의 축의 조합에 의하여 원하는 경로를 얻어내게 된다 여러 축이 조합이 되더라도 대부분 가공 동작의 경우는 하나의 축에 의한 단축 운동으로 충분히 만족할 만한 결과를 얻을 수 있다. 그러나, 금형 가공이나 렌즈가공 등은 단순한 회전이나 직선의 조합에 의한 곡선이 아닌 임의의 함수에 의한 곡선이므로 이러한 경우 2축 이상을 적절히 이동시켜서 원하는 형상을 얻어야 한다.(중략)

• Journal of the Korean Society for Precision Engineering
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• v.15 no.8
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• pp.26-32
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• 1998

The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed and depth of cut, on this parameter experimentally. Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.247-247
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• 2004

세라믹의 완전 소결체는 높은 경도와 취성을 가지기 때문에 연삭과 같은 입자가공이 행해지게 되어, 가공능률이 매우 낮고, 복잡한 형상 창성이 어렵다. 완전소결된 세라믹의 절삭가공에서는, 공구수명이 짧고, 가공속도가 매우 늦어 일반의 부품가공에 적용하기 어렵다. 또한 소결이 전혀 행해지지 않은 성형체의 절삭가공은 공작물의 강도가 약하기 때문에 가공속도, 가공능률, 부품의 척킹 및 치수 정밀도 등에 문제가 있다고 할 수 있다 이러한 문제 때문에 엔지니어링 세라믹의 고능률, 고품위 절삭에 관한 연구가 필요하다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.870-873
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• 2000

This investigation reports the grinding characteristics of quartz. Grinding experiments were performed at various grinding conditions including wheel mesh, table speed and depth of cut. The grinding forces and specific grinding energies were measured to compare the grindability of quartz with those of structural ceramics such as A1$_2$O$_3$, SiC, Si$_3$N$_4$ and ZrO$_2$. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM. The chip formation energy of quartz was about 6J/㎣, which is quite smaller than those of structural ceramics. Although plastic flows are occured in Si$_3$N$_4$ and ZrO$_2$, micro/macro cracks are occured in ground surface of quartz like in A1$_2$O$_3$ and SiC.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• Composites Research
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• v.12 no.5
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• pp.12-22
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• 1999

Aluminum based metal matrix composites(MMCs) are well known for their high specific strength, stiffness and hardness. They are gaining further importance because of their high wear resistance. In this study wear behavior of $Al/Al_2O_3/C$ hybrid MMCs fabricated by squeeze infiltration method was characterized by the abrasive wear test under various sliding speeds at room and high temperature. Wear resistance of MMCs was improved due to the presence of reinforcements at high sliding speed. Especially wear resistance of carbon hybrid MMCs was superior to other materials because of its solid lubrication of carbon. The friction coefficient of MMCs was not affected by the sliding speed.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.899-904
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• 2016

ELID grinding is an excellent technique for the mirror grinding of the variety of the advanced metallic or nonmetallic materials. The focus of this study is the development of an automatic-control electrolysis-speed device for the automation of the ELID-grinding process. For the development of the automatic-control electrolysis-speed device, analysis experiments regarding the ELID cycle and oxide-layer removal and creation were conducted according to a truing and dressing process. Also, a comparative experiment was conducted to confirm the variance of the electrolysis speed in accordance with changes of the voltage. The experiment results for the developed automatic-control electrolysis-speed device show that the developed device could control the electrolysis speed according to voltage changes through the use of the data that are monitored during the ELID-grinding process.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.26-31
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• 2002

In this study an experimental investigation was conducted to find the grinding characteristics of ceramics, STD11 and STS304 materials. The grinding force and the microscopic observation of the workpieces were obtained in surface grinding. Grinding characteristics of ceramics were inspected through the microscopic examination the cutting force, and the surface roughness. It has been found that the finding force of ceramics is relatively low as compared to that of steels and that CBN wheel has an excellent performance. The surface roughness was measured according to the feedrate and the depth of out.