• Title/Summary/Keyword: 연마

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Polishing of Oxide film by colloidal silica coated with nano ceria (나노 세리아 입자가 표면 코팅된 콜로이달 실리카 슬러리의 Oxide film 연마특성)

  • Kim, Hwan-Chul;Lee, Seung-Ho;Kim, Dae-Sung;Lim, Hyung-Mi
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.35-37
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    • 2005
  • 100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.

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Study on Abrasive Adhesion and Polishing Effect in Wet Magnetic Abrasive Polishing (습식자기연마(WMAP)에서 입자의 구속과 가공효과에 관한 연구)

  • Son, Chul-Bae;Jin, Dong-Hyun;Kwak, Jae-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.8
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    • pp.887-892
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    • 2014
  • In a conventional magnetic abrasive polishing process, the polishing abrasives are mixed with ferrous particles and slight cutting oil to form a cluster of abrasives. However, when a tool rotates at a high revolution speed, most of the polishing abrasives are scattered away from it due to the increase in centrifugal force. This phenomenon directly reduces the polishing efficiency. The use of a highly viscous matter such as silicone gel instead of cutting oil for mixing is one method to solve this problem and increase abrasive adhesion. Another method to avoid high abrasive scattering is the application of wet magnetic abrasive polishing (WMAP). In WMAP, abundant mineral oil is preliminarily applied to the workpiece surface. This study experimentally evaluated the effect of WMAP on abrasive adhesion. The relationship between the amount of working abrasives and polishing conditions was characterized. Despite the lower adhesion ratio of polishing abrasives, the surface roughness was found to be significantly improved as the result of WMAP.

Variation of abrasive feed rate with abrasive injection waterjet system process parameters (연마재 투입형 워터젯 시스템의 공정 변수에 따른 연마재 투입량 변화)

  • Joo, Gun-Wook;Oh, Tae-Min;Kim, Hak-Sung;Cho, Gye-Chun
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.17 no.2
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    • pp.141-151
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    • 2015
  • A new rock excavation method using an abrasive injection waterjet system has been developed to enhance the efficiency and reduce the vibration of tunnel excavation. The abrasive feed rate is an important factor for the cutting performance and the economical efficiency of waterjet-based excavation. In this study, various experiments were performed to explore the effects of major process parameters for both the abrasive feed rate and the suction pressure occurring inside the mixing chamber when the abrasives are inhaled. Experimental results reveal that the abrasive feed rate is affected by geometry parameters (abrasive pipe height, length, and tortuosity), abrasive parameters (abrasive particle size), and jet energy parameters (water pressure and water flow rate). In addition, the relation between the cutting performance and the abrasive feed rate was discussed on the basis of the results of an experimental study. The cutting performance can be maximized when the abrasive feed rate is controlled appropriately via careful management of major process parameters.

The evaluation of surface roughness and polishing time between polishing systems (연마시스템에 따른 복합레진의 표면거칠기와 연마시간에 대한 평가)

  • Kim, Ye-Mi;Shin, Su-Jung;Song, Min-Ju;Park, Jeong-Won
    • Restorative Dentistry and Endodontics
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    • v.36 no.2
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    • pp.119-124
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    • 2011
  • Objectives: The purpose of this experiment was to evaluate four different polishing systems of their polishability and polishing time. Materials and Methods: 4 mm diameter and 2 mm thickness Teflon mold was made. Z-250 (3M ESPE) hybrid composite resin was slightly overfilled and pressed with slide glass and cured with Optilux 501 for 40 sec each side. Then the surface roughness (glass pressed: control group) was measured with profilometer. One surface of the specimen was roughened by #320 grit sand paper and polished with one of the following polishing systems; Sof-Lex (3M ESPE), Jiffy (Ultradent), Enhance (Dentsply/Caulk), or Pogo (Dentsply/Caulk). The surface roughness and the total polishing time were measured. The results were analyzed with one-way ANOVA and Duncan's multiple range test. Results: The surface roughness was lowest in Pogo, and highest in Sof-Lex. Polishing times were shortest with Pogo, and followed by the Sof-Lex, Enhance and Jiffy. Conclusions: One-step polishing system (Pogo) is very effective to get the smooth surface in a short time, therefore it can be recommended for final polishing system of the restoration.

Ability of the Natural Abrasives Recovered from Sludge (재활용 천연광물 연마재의 연마성능)

  • Cho, Sung-Baek;Seo, Myeong-Deok;Cho, Keon-Joon;Lee, Su-Jeong
    • Journal of the Mineralogical Society of Korea
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    • v.22 no.4
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    • pp.353-358
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    • 2009
  • The ability of natural abrasives which were recovered from CRT glass polishing process was evaluated. Comparing the center line average roughness values of a glass polished with new pumice (Ra = $0.039{\mu}m$) and with new garnet (Ra = $0.031{\mu}m$), the glass surface polished with the recycled pumice and the garnet had less pits on the surface with smaller Ra values (Ra = $0.025{\mu}m$ for recycled pumice and Ra = 0.029 for recycled garnet). Recycled rouge contains amorphous glass fragments so that it should be used as a cement replacement rather than recycle into an abrasive. Nnatural abrasives, pumice and garnet powder, which are used in CRT glass polishing process can be recycled into abrasives so that it can help to minimize costs and environmental impact from the production of abrasives and the disposal of waste sludge.

Study on Scintillator Polishing Technology for Increasing the Detection Efficiency of Radiation Detectors Using Plastic Scintillators (플라스틱 섬광체를 이용한 방사선 검출기의 검출 효율을 높이기 위한 섬광체 연마 기술 연구)

  • Kim, Jeong-Ho;Joo, Koan-Sik
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.456-462
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    • 2014
  • Scintillators were polished in four steps using polishing paper, to reduce the optical loss occurring at their cross section when radiation detectors are fabricated with plastic scintillators. We studied the correlation between the polishing steps and detection efficiency and assessed the detection characteristics that are dependent in the polishing steps. Our results showed that the detection efficiency increased by approximately 7.75 times for a detector that used a scintillator polished in four steps, compared to a detector that used an depolished scintillator. For detectors fabricated using scintillators polished in different steps, better detection characteristics were obtained in terms of the activity, distance, and location of radiation, compared to detectors fabricated with an depolished scintillator.

Performance Improvement based on the Teaching Control for Sweeping Robot (연마로봇의 교시기반 제어에 의한 성능개선)

  • Jin, Taeseok
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.7
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    • pp.1525-1530
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    • 2014
  • In this research, we describe teaching based sweeping control for grinder robot has been proposed as a system which is suitable to work utilizing pressure sensitive alternative to human. Teaching method is used for grinder robots operations because of their position accuracy, path accuracy, and machining reaction force. A grinder robot for two-dimensional iron plate was developed on the basis of an force sensor based teaching method. An automatic-path-generation method and experimental results using specific points was adopted to reduce the number of teaching points and time. And also, in order to determine the proper machining conditions, various machining conditions such as grinder-wheel rotation speed and robot moving speed, were evaluated.

Development and Verication of a Robot Off-line Programming System for Die Polishing Process (금형 연마작업을 위한 로봇 오프라인 프로그래밍 시스템의 개발 및 적용)

  • Kang, Sungchul;Kim, Munsang;Lee, Kyo Il
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.1
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    • pp.69-77
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    • 1997
  • 본 논문은 금형의 마무리 연마 작업을 로봇을 이용하여 자동화하기 위한 오프라인 프로그래밍 시스템개발을 그 내용으로 하고있다. 3차원 자유곡면 형상을 갖는 금형을 연마하기 위한 로봇 작업 경로를 효율적으로 생성하기 위해서는 기존의 교시 방법이 아닌 CAD시스템과 연계된 시뮬레이션 방식의 자동 경로 생성 방법이 요구된다. 본 연구에서 개발된 금형 연마 작업을 위한 오프라인 프로그래밍 시스템은 연마 작업 시뮬레이션을 위한 기하학적 모델링 기능, 로봇의 작업 공간을 고려한 작업장 배치 기능, 연마 로봇의 효율적인 기구학 해, 3차원 그래픽 시뮬레이션, 3차원 물체간의 충돌 검사 기능 및 유기적인 관계형 데이타 베이스 기능 등으로 구성된다. 본 시스템의 시뮬레이션 결과를 로봇의 위치 보정 과정을 거쳐 로봇 작업 프로그램 으로 변환함으로써 최종적으로 실제 연마 작업이 가능한, 정확하고 안전한 로봇 프로그램을 생성하였다.

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Study of transmission of Candida albicans in denture by dental polishing lathe (의치에서 치과기공용 연마기를 통한 캔디다균의 전염성에 대한 연구)

  • Lee, Gi-Ho;Song, Young-Gyun
    • Journal of Dental Rehabilitation and Applied Science
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    • v.30 no.3
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    • pp.199-205
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    • 2014
  • Purpose: The purpose of this study was to evaluate the transmission of candida in denture by dental polishing lathe. Materials and Methods: Maxillary complete dentures made from the same model were infected with Candida albicans. The infected dentures were polished by dental polishing lathe with sterile pumice and distilled water. And then sterile maxillary complete dentures were polished with same method. Polishing surface was wiped with a cotton swab and the sample was checked for Candida albicans. The polishing wheel at room temperature was checked for Candida albicans every 24 hours for 3 days. Results: A considerable number of Candida was found on the polished sterile dentures. And the Candida albicans in polishing wheel was detected at up to two days. Conclusion: An anti-infection measure is urgently needed when dental polishing lathe is used for denture polishing, because of the possibility of fungal infection.

A Study on the Improvement of Oxide-CMP Characteristics by Dispersion Time and Content of Abrasive (연마제의 분산시간과 첨가량이 Oxide-CMP에 미치는 영향)

  • Park, Sung-Woo;Han, Sang-Jun;Lee, Sung-Il;Lee, Young-Kyun;Choi, Gwon-Woo;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.527-527
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    • 2007
  • CMP가 1980년 IBM에 의해 반도체 웨이퍼의 표면 연마를 위해 적용된 후, 많은 연구 개발의 노력으로 반도체 집적회로의 제조 공정에서 필수 핵심기술이 되었으나, 소모자재(연마패드, 탄성지지대, 슬러리, 패드 컨디셔너)의 비용이 CMP 공정 비용의 70% 이상을 차지하는 등 제조단가가 높다는 단점을 극복할 수가 없었다. 특히, 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어, 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 연구 중이다. 슬러리의 변수로는 연마입자의 종류 및 특성, 용액의 pH, 연마입자의 슬러리내 안정성 등이 있다. 슬러리내 연마입자는 연마량과 균일도 측면에서 밀접한 관계를 가지고 있다. 또한, 연마제의 영향에 따라 연마율의 차이 즉, CMP 특성의 변화를 보이고 있기 때문에 투입량 또한 최적화가 필요하다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(de-ionized water; DIW)에 $CeO_2,\;MnO_2,\;ZrO_2$ 등을 첨가한 후 분산시간에 따른 연마 특성과 atomic force microscopy (AFM)분석을 통해 표면 거칠기를 비교 분석하였다. 그리고, 세 가지 종류의 연마제를 각각 1wt%, 3wt%, 5wt% 첨가하여 산화막에 대한 CMP 특성을 알아본 후, scanning electron microscopy (SEM) 측정과 입도 분석을 통해 그 가능성을 알아보았다.

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