• Proceedings of the KSEEG Conference
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• 2002.04a
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• pp.249-252
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• 2002

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.259-259
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• 2004

정밀부품의 가공 시에 발생되는 burr는 제품의 정밀도, 성능과 제품의 생산성에도 부정적인 영향을 끼치다. 따라서 효율적인 burr의 제거는 제품의 성능의 향상뿐만 아니라 생산성의 향상에도 긍정적인 영향을 미칠 수 있다. 자기 연마법(Magnetic Abrasive Finishing)은 연마제의 연마특성과 철의 자기화 성질을 이용한다. 자기장내의 자기력선의 응집현상을 통해서 burr를 제거하는 방법이다. 자기 유도자에 의해 형성된 magnet flow를 따라 지립이 정렬을 하고 정렬된 지립은 브러쉬의 역할을 하여 burr를 제거하게 된다.(중략)

• Journal of the Mineralogical Society of Korea
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• v.22 no.4
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• pp.353-358
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• 2009

The ability of natural abrasives which were recovered from CRT glass polishing process was evaluated. Comparing the center line average roughness values of a glass polished with new pumice (Ra = $0.039{\mu}m$) and with new garnet (Ra = $0.031{\mu}m$), the glass surface polished with the recycled pumice and the garnet had less pits on the surface with smaller Ra values (Ra = $0.025{\mu}m$ for recycled pumice and Ra = 0.029 for recycled garnet). Recycled rouge contains amorphous glass fragments so that it should be used as a cement replacement rather than recycle into an abrasive. Nnatural abrasives, pumice and garnet powder, which are used in CRT glass polishing process can be recycled into abrasives so that it can help to minimize costs and environmental impact from the production of abrasives and the disposal of waste sludge.

• Journal of the Korean Society for Railway
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• v.11 no.3
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• pp.272-279
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• 2008

The importance of maintenance of rail surface defects is increasing more according to the KTX operation. That is because during high speed operation of rolling stock, rail surface defects may cause shortened fatigue life of rail, acceleration of track degradation and reduced ride comfort. The paper was intended to study the establishment of rail grinding criteria of high-speed railway lines considering the KTX operation circumstances. For this, the specimens of UIC 60 rail on Kyeong-Bu high-speed operation lines were collected and they were tested for metallographic structure and measured for the hardness. As the factors affecting RCF causing the defects of rail surface, passing tonnage, running speed and track condition are considered.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.136-141
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• 1993

진공챔버,위생튜브등 정밀한 내면을 필요로 하는 경우 표면거칠기를 향상시키기 위한 방법으로 전해가공 및 수작업을 하는 경우가 대부분인데 이는 가공비가 비씨고 다듬질 시간이 많이 걸리는 등 매우 비경제적이다. 더구나 길이가 긴 관이나 구부러진 관의 내면은 기계적으로 다듬질이 매우 어렵다. 그러나 최근에 개발된 전자기장을 이용한 자력 연마가공법은 기존의 기계적인 가공법과는 달리 실제 가공을 행하는 공구부와 ㅣㅇ를 구동하는 구동부 사이에 공극을 허용하기 때문에 이를 이용하여 회전이 불가능한 곡관의 내면다듬질을 가능하게 하였다. 지금까지 연구들은 단순히 전자석 및 전원으로 이루어진 수동가공 시스템으로서 가공공정 자체의 특성파악에 집중되어 왔으나 자력연마법의 장점중의 하나인 다듬질 공정의 자동화 가능성을 실현시키기 위해서는 공정의 제어가 필요하다. 본 연구에서는 이를 실현시키기 위한 기초연구로서 컴퓨터구동 회전자력연마가공 시스템을 개발하고 그 기본특성을 알아보기 위해 유한요소법을 이용하여 원형 요오크 및 여섯개의 자극에 대해 자력선의 분포를 알아보았다. 또한 이로부터 가공영역의 자속밀도를 계산하고 다듬질 가공을 가능케 하기위한 회전자화의 발생방법에 대해 고찰하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.218-223
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• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.525-529
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• 1999

A cone shape drum polisher was developed to make up for the demerits of conventional CMP apparatus. The developed equipment has several superiorities. First of all, it can achieve uniform velocity profile on all the contact line because of its shape and easy to control the amount of slurry at the position of use. The whole area of wafer surface is exposed to the visual area except the contact line between wafer and drum, hence we can detect polishing end point more easily than any other polishing equipments. Also it has additional merits such as small foot print and polishing load. Polishing characteristics were investigated by developed equipment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.690-693
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• 2003

Soft x-ray microscopy provides a unique set of capabilities in-between those of visible light and electron microscopy. It has long been recognized that nature provides a 'water window' spectral region between the K shell x-ray absorption edges of carbon (~290eV) and oxygen (~540eV), where organic materials show strong absorption and phase contrast, while water is relatively non-absorbing. This enables imaging of hydrated biological specimens that are several microns thick with high intrinsic contrast using x-rays with a wavelength of 2.3~4.4nm. Soft X-ray microscopy is therefore well suited to the study of specimens like single biological cells. The most direct advantage of X-ray microscope is their high spatial resolution when compared with visible light microscopes, combined with an ability to image hydrated specimens that are several microns with a minimum of preparation. Our study describes the conceptual design of soft x-ray microscope system based on a laser-based source for biomedical application with high resolution ($\leq$50nm) and short exposure time ($\leq$30sec).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.145-146
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• 2012

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.8
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• pp.722-727
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• 2016

In this study, we attempted to reduce the generation of waste acids in the electropolishing process by improving the current efficiency. The optimum conditions of the electropolishing process when using the round bus bar were determined by the Taguchi method. The current density, polishing time, electrolyte temperature and flow rate were selected as the control factors for the current efficiency in the electropolishing process. An orthogonal array was created by considering three levels for each factor and experiments were carried out. The larger-the-better SN ratios were calculated by the Taguchi method. The current density was the most important factor affecting the current efficiency and the polishing time was the least important one. The optimum conditions to minimize the generation of waste acids were a current density of $45A/dm^2$, polishing time of 4 min, electrolyte temperature of $65^{\circ}C$ and flow rate of 7 L/min. The results of the ANOVA confirmed that the effects of the current density, electrolyte temperature and flow rate are significant at the 95% confidence level. The increase in the contact area and contact force afforded by using the round bus bar improved the current efficiency which, in turn, reduced the amount of waste acids generated. Further research is planned to investigate the effect of the type of bus bar on the current efficiency.