• Journal of Welding and Joining
• /
• v.19 no.3
• /
• pp.325-333
• /
• 2001

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

• Journal of Welding and Joining
• /
• v.19 no.1
• /
• pp.82-87
• /
• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• Journal of Welding and Joining
• /
• v.13 no.3
• /
• pp.147-156
• /
• 1995

The change of microstructure in the bonded interlayer and tensile properties of joints were studied for liquid phase diffusion bonding using STS-310 and Incoloy-825 as base metal and base metal+B alloy as insert inetal. Main experimental results obtained in this study are as follows. 1) The optimum amount of B addition into the insert metal was found to be about 4mass%. 2) When isothermal solidification was completed, the microstructure in the bonded interlayer was the same with that of the base metal because of the grain boundary migration in the bonded interlayer. 3) All of the tensile specimen fractured at base metal and joints bonded at optimum condition exhibited tensile properties in excess of base metal requirements. 4) It was determined that fine car-borides and bordes such as M$_{23}$(C,B)$_{6}$, Cr$_{2}$B, and CrB in STS-310S and TiB in Incoloy-825 exist at the grain boundary around bonded interlayer. These precipitates almost disappeared after homogenizing treatment at 1373K for 86.4ks.s.

• Journal of Welding and Joining
• /
• v.9 no.3
• /
• pp.26-33
• /
• 1991

As it takes very long time for the Transient Liquid Phase(TLP) bonding, we tried to reduce the bonding time by changing insert material for the high diffusivity element. On this study boron powder was doped as a insert material on the bonding surface of Rene 80 superalloy, and diffusion treated at 1150.deg.C under vacuum. On this method differently from the TLP bonding the insert material was not melted during bonding but only the base metal reacted with the boron was inducedly melted. Therefore, as this bonding mechanism is different from the existing ones, it is suggested as a Melting Induced Diffusion Bonding. When this process was used for the diffusion bonding, the bonding time including homogenization decreased greatly compared to the conventional TLP bonding.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.7 no.2
• /
• pp.113-119
• /
• 2006

Brazing is an important manufacturing process in the fabrication of Heavy Water Reactor fuel rods, in which bearing and spacer pads are joined to Zircaloy-4 cladding tubes. The physical vapor deposition(PVD) technique is currently used to deposit metallic Be on the surfaces of pads as a filler metal. Amorphous Zr-Be binary alloys which are manufactured by rapid solidification process are under developing to substitute the conventional PVD-Be coating. In the present study, brazed joint with PVD and amorphous alloys of $Zr_{1-x}Be_{x}(0.3{\le}x{\le}0.5)$ as filler metals are compared by mechanism, microstructure and hardness. The thickness of brazed joint with amorphous alloys became much smaller than that of PVD-Be. The erosion of base metal did not occur in the brazed joint with amorphous alloys. The brazing mechanism for PVD-Be seems to be Be diffusion into Zr-4 with capillary action resulting from eutectic reaction while that for amorphous alloys are associated with the liquid phase formation in the brazed joint. The brazed joint microstructure with PVD-Be consists of dendrite while that with amorphous alloys is globular. The $Zr_{0.7}Be_{0.3}$ alloy shows the smooth interface with little erosion in the base metal and is recommended a most suitable brazing filler metal for Zircaloy-4.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.1
• /
• pp.55-62
• /
• 2023

In this study, Sn-3.0Ag-0.5Cu (wt.%, SAC305) solder dipping process was performed between Ni-foam skeleton with different pore per inch (PPI) to fabricate Ni-foam/SAC305 composite solder, and then applied to the transient liquid phase (TLP) bonding process to evaluate the microstructure and mechanical properties of the bonded joint. The Ni-foam/SAC305 composite solder preform consisted of Ni-foam and SAC305, and an intermetallic compound (IMC) having a (Ni,Cu)₃Sn₄ composition was formed at the Ni-foam interface. During TLP bonding process, the IMC at the Ni-foam interface was converted to (Ni,Cu)₃Sn₄+Au, and as the bonding time increased, the Ni-foam and SAC305 continuously reacted, and the bonded joint was converted into an IMC. And it was confirmed that the 130 PPI Ni-foam/SAC305 composite solder joint was converted into an IMC at the fastest rate. As a result of performing a shear test to confirm the effect of Ni-foam on mechanical properties, solder joints under all conditions exhibited excellent mechanical properties of 50 MPa or more in the early stages of the TLP bonding process, and the shear strength tends to increase as the bonding time increases.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.7 no.2
• /
• pp.33-42
• /
• 1970

This report is concerned with the fahrication with the falricationof silicon VVC diode by the double diffusion planer technique. At first, some design charts for VVC diode were derived by considering the voltage-capacitance relations, the critical field intensity at the metallurgical junction, and the cut-off frequency of the diode. These charts enables the fabrication engineers to design VVC diode easily without going into the sophisticated design theory. We started with a 2.5 ohm-cm n-type epitaxial silicon wafer. The phosphorous was diffused by POCl3 impurity source. Then boron diffusion followed make hyperabrupt p-n junction by BN source. The maximum to minimum capacitance ratio of the diode as a tuning diode for a TV tuner made in these experiments was 4:1. Measured electrical characteristics of the sample diodes showed in good agreement with the theoretical expectations. Slicing and polishing technique of the silicon wafer and diffusion technique of the impurity atoms, which were employed in our study, are also stated briefly in this report.

• Journal of Welding and Joining
• /
• v.21 no.4
• /
• pp.69-74
• /
• 2003

The mechanical properties of STD11 Joints by using TLP (Transient Liquid Phase Diffusion) bonding method employing MBF-30 and MBF-80 insert metals were investigated with concerning to the microstructural change. TLP bonding of STD 11 was carried out at 1323∼1423K for 0.6ks∼3.6ks in vacuum. The microstructure and the element distribution of the interlayer between tool steels and insert metals showed specific feature with bonding conditions. It was found that the width of the interlayer increased at initial bonding stage. However, the width of interlayer showed nearly constant value during the isothermal solidification. After isothermal solidification was completed, the joint showed homogeneous element distribution and similar microstructure with base metal because of the grain boundary migration to the bonded interlayer. The bonding strength measured by a tensile test has been varied with the bonding conditions. The maximum joint strength, 760MPa, was obtained with the condition of 1423K for 1.2ks using MBF30 insert metal in this experiment.

• Journal of Welding and Joining
• /
• v.18 no.4
• /
• pp.96-103
• /
• 2000

This study investigated the effects of bonding temperature and bonding atmosphere on high temperature mechanical properties of transient liquid phase(TLP) bonded joints of heat resistant alloy using MBF-50 insert metal. Specimens were bonded at 1,423~1,468K for 600s. Microconstituents of {TEX}$Cr_{7}(C,B)_{3}${/TEX}were formed in the bonded region when the bonding temperature was low. The amount of microcostituents in the bonded layer decreased with increasing the bonding temperature, and the microconstituents in the bonded layer disappeared at the bonding temperature above 1,468K. The tensile strength of the joints at elevated temperatures increased with the increase the bonding temperature and was the same level as one of the base metal in the bonding temperature over 1,453K. Microstructure and alloying element distributions of the bonded region bonded in Ar and $N_2$atmosphere were similar to those of the bonded in vacuum. The creep rupture strength and rupture lives of joints were almost identical to those of base metal.

• Journal of the Korean Ceramic Society
• /
• v.37 no.10
• /
• pp.994-1000
• /
• 2000

Mn-Ni-Co계 스피넬을 모재로 선택하여 상업용 페라이트 등 다양한 종류의 Fe-스피넬과 동시 소결 가능성을 검토할 목적으로 각 소재의 소결 거동, 서미스터와의 계면 반응이나, 2차상의 형성 등에 대해 알아보았다. 대부분의 페라이트 조성이 Mn 스피넬과 새로운 2차상을 형성하지는 않는 것을 알 수 있었다. 상업용 페라이트의 경우 115$0^{\circ}C$ 소결 온도에서 접합이 가능한 조성은 다량의 액상이 존재하며 접합계면의 폭이 상대적으로 넓으므로 서미스터 특성에도 좋지 않은 영향을 줄 수 있을 것으로 생각된다. 반면에 MFN1과 MFN2 조성은 접합계면에서 새로운 2차상이 형성되지 않고 원소의 상호확산도 작아 NTC 서미스터의 동시소결용 보호재로서의 가능성이 높은 것으로 확인되었다.