• 전기전자학회논문지
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• 제25권1호
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• pp.95-100
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• 2021

조선소에서 선체 블록과 용접 피더의 위치를 알면 작업자의 위치 정보를 쉽게 얻을 수 있다. 이 데이터는 작업장 안전 모니터링 시스템 구축에 매우 유용하다. 그러나 선체 구조와 용접 공정의 특수성 때문에 작업장에 고정 통신망을 적용하기 어렵다. 본 연구에서는 전용 통신선을 대신할 수 있는 유도 전력선 통신을 선체블록과 같은 금속매체에 적용하는 기술을 검토하였다. 용접기의 전원 케이블에 설치할 유도 결합기로 페라이트 코어를 사용하였고, 금속 블록의 지지대에 체결할 결합기로 나노 결정질 코어를 적용하였다. 제안된 커플러는 COMSOL AC/DC 모듈로 3차원 모델링 하였고 동작 원리를 시각화하기 위하여 유한 요소 해석을 수행하였다. 알루미늄 프로파일을 사용한 금속블록 통신 성능 테스트에서 용접 전극의 블록 접촉으로 통신 채널이 형성되었을 때 대역폭은 6 Mbps 이상 유지되었다.

• 한국전기전자재료학회논문지
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• 제37권1호
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• pp.26-35
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• 2024

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p-Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

• 청정기술
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• 제28권2호
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• pp.154-162
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• 2022

알루미늄 (Al) 금속을 전구체 및 구조체로 이용, 수열 반응을 통하여 Al@Al₂O₃와 Al@Ni-Al LDH (LDH = layered double hydroxide) 코어-쉘 복합 구조체를 합성하였다. 제조된 구조체의 형상, 조성, 결정 구조는 수용액에 존재하는 이온들에 의하여 크게 영향을 받았으며, 이를 활용하여 다양한 특성의 촉매 구조체 유도가 가능하였다. Al@Ni-Al LDH 코어-쉘 구조체의 환원을 통하여 Ni 나노 입자가 고정화된 Ni/Al@Al₂O₃ 촉매를 제조하였고, CO₂ 메탄화 반응에 적용하여 촉매의 특성을 평가하였다. Ni/Al@Al₂O₃ 촉매는 전통적 incipient wetness impregnation 방법에 의하여 제조된 Ni/Al₂O₃ 촉매에 비교하여 Ni 입자의 분산도와 균일성이 매우 높았으며 약 2 배 이상의 CO₂ 전환율로 높은 촉매적 활성과 더불어 구조의 안정성을 보여 주었다. 이러한 Ni/Al@Al₂O₃ 구조체 촉매의 우수한 특성은 Al 금속을 기반으로 한 새로운 개념의 촉매 구조체 설계와 합성 방법의 타당성을 보여준다.

• 한국재료학회지
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• 제22권4호
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• pp.190-194
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• 2012

The formation of high-quality polycrystalline silicon (poly-Si) on relatively low cost substrate has been an important issue in the development of thin film solar cells. Poly-Si seed layers were fabricated by an inverse aluminum-induced crystallization (I-AIC) process and the properties of the resulting layer were characterized. The I-AIC process has an advantage of being able to continue the epitaxial growth without an Al layer removing process. An amorphous Si precursor layer was deposited on Corning glass substrates by RF magnetron sputtering system with Ar plasma. Then, Al thin film was deposited by thermal evaporation. An $SiO_2$ diffusion barrier layer was formed between Si and Al layers to control the surface orientation of seed layer. The crystallinity of the poly-Si seed layer was analyzed by Raman spectroscopy and x-ray diffraction (XRD). The grain size and orientation of the poly-Si seed layer were determined by electron back scattering diffraction (EBSD) method. The prepared poly-Si seed layer showed high volume fraction of crystalline Si and <100> orientation. The diffusion barrier layer and processing temperature significantly affected the grain size and orientation of the poly Si seed layer. The shorter oxidation time and lower processing temperature led to a better orientation of the poly-Si seed layer. This study presents the formation mechanism of a poly seed layer by inverse aluminum-induced crystallization.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.75.2-75.2
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• 2010

We studied the fabrication of polycrystalline silicon (pc-Si) films as seed layers for application of pc-Si thin film solar cells, in which amorphous silicon (a-Si) films in a structure of glass/Al/$Al_2O_3$/a-Si are crystallized by the aluminum-induced layer exchange (ALILE) process. The properties of pc-Si films formed by the ALILE process are strongly determined by the oxide layer as well as the various process parameters like annealing temperature, time, etc. In this study, the effects of the oxide film thickness on the crystallization of a-Si in the ALILE process, where the thickness of $Al_2O_3$ layer was varied from 4 to 50 nm. For preparation of the experimental film structure, aluminum (~300 nm thickness) and a-Si (~300 nm thickness) layers were deposited using DC sputtering and PECVD method, respectively, and $Al_2O_3$ layer with the various thicknesses by RF sputtering. The crystallization of a-Si was then carried out by the thermal annealing process using a furnace with the in-situ microscope. The characteristics of the produced pc-Si films were analyzed by optical microscope (OM), scanning electron microscope (SEM), Raman spectrometer, and X-ray diffractometer (XRD). As results, the crystallinity was exponentially decayed with the increase of $Al_2O_3$ thickness and the grain size showed the similar tendency. The maximum pc-Si grain size fabricated by ALILE process was about $45{\mu}m$ at the $Al_2O_3$ layer thickness of 4 nm. The preferential crystal orientation was <111> and more dominant with the thinner $Al_2O_3$ layer. In summary, we obtained a pc-Si film not only with ${\sim}45{\mu}m$ grain size but also with the crystallinity of about 75% at 4 nm $Al_2O_3$ layer thickness by ALILE process with the structure of a glass/Al/$Al_2O_3$/a-Si.