• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.333-338
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• 2002

자기베어링의 회전정밀도에 영향을 미치는 인자로 PWM 전력증폭기, 위치 센서 등과 같은 자기베어링 구성 장치의 동특성 및 정밀도, 시스템의 정확한 모델링, 제어기법, 런아웃 등이 있다. 본 연구에서는 능동 자기베어링을 제어하기 위해 자기베어링의 PWM 전력증폭기와 회전축을 모델링하고 이를 바탕으로 능동 자기베어링 제어를 위한 PID 제어기를 구성하였으며, 변위 센서의 부착위치 및 회전축의 진원도의 영향으로 발생하는 주기적인 런아웃 요소를 첨가하여 런아웃의 영향을 확인하였으며, 런아웃 (Runout)에 의해 발생하는 에러(Error)를 효과적으로 제어하여 자기베어링의 제어 정밀도를 향상시키기 위한 방법으로 기본적인 PID 제어기에 최소평균자승(Least Mean Square, LMS) 알고리즘을 적용한 적응 피드포워드 제어기를 구성하여 자기베어링의 능동 제어에서 발생하는 주기적인 런아웃을 효과적으로 제어할 수 있음을 MATLAB을 통한 시뮬레이션을 통해 확인하였다.

• 한국레이저가공학회지
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• 제12권3호
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• pp.7-13
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• 2009

The process of thermal-degradation of thin-film polymeris studied in this work for various laser sources from CW to fs. Samples composed of a thin polymer layer sandwiched between two glass plates are irradiated by the lasers and the threshold irradiance of polymer carbonization is experimentally measured. In the numerical analysis, the transient temperature distribution is calculated and the number density of carbonization in the polymer layer is also estimated. It is shown that pulsed lasers can result in more uniform distribution of temperature and carbonization than the CW laser.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 추계학술대회 논문집
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• pp.687-692
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• 1993

This paper deals with the generation of laser scan path for manufacturing 3-dimensional body using StereoLithography. The purpose of this study is to develop one module of the StersoLithography system(SLA) for Rapid Protyping and Manufacturing. AutoCAD system is used to supply CAD information from model. The X-Y controller which was made for a special purpose is used to test this system. The system software developed is composed of 3 main modules, the first module is calculating the boundary point os laser scan path. The scound module is generating final output file which is used to down load on the controller. The result of this study shows a good algorithm to generate laser scan path on the basis of simple mathematical background.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.753-756
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• 2005

Rapid prototyping (RP) technologies are mainly performed by layered manufacturing (LM) process which manufactures 3D physical objects by depositing 2D sections in a direction. Thus, deformations are apt to occur in overhanging area of the RP processed part. Also, excessive adhesion between part and platform of the RP apparatus is generated. In order to prevent these problems, most of the RP technologies adopt support structure. Main element to support a part in the support structure is strand. In actual field, however, the number of strand is determined by the software operating reference guide or RP system operator's experience. In this paper, a methodology to determine the optimal strand spacing is presented through experiments and measurements for the SL part deformation by change of strand spacing and part weight in the support structure of the stereolithography.

• 동의신경정신과학회지
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• 제18권3호
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• pp.321-330
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• 2007

Bacteremia is the transient presence of bacteria (or other microorganisms) in the blood. Bacteremia may result no symptom to the healthy persons, but it may result symptoms such as pylexia, headache and even septic shock to the patient in immunosuppression. In this case, a 75 years old male patient had a dental caries and cerebrovascular accident ago, therefore was in a bad condition and often caught cough. Suddenly be bad a headache with a high fever caused by Streptococcus Mutans Bateremia. After defervescence, a slight fever and a headache remained. It may the symptoms of Yolgwol headache(熱厥頭痛) , so Cbeougsaugsabwa-taug(淸上瀉火湯), the symptoms such as a slight fever and a headache are on the mend.

• 한국가스학회지
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• 제1권1호
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• pp.64-72
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• 1997

화학 플랜트에서의 이상상황 발생시, 안정된 공정으로 복귀시키기 위하여 운전자의 의사결정을 지원하는 goal tree를 합성하는 시스템을 개발하였다. 운전자의 경험적 지식을 바탕으로 발생 가능한 많은 사고들의 특징과 이상의 규모등에 적절하게 대응조치상황을 발견할 수 있도록 지식베이스를 구축하였다. 그리고, 인공지능기법을 이용하여 적용공정에 대한 구체적인 대응조치상황을 생성하였다.

• 대한산업공학회지
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• 제41권3호
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• pp.267-274
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• 2015

In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.76-77
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• 2006

본 연구를 통하여 전력수급계획에 필요한 연간 시간대별 총수요를 예측하는 산법을 개발하였다. 예측과정은 크게 평상일 예측과 특수일 예측으로 구분된다. 평상일의 경우는, 연중 최대수요가 발생하는 하절기 기상으로부터 연중 최대수요를 예측한 다음, 하향식 접근에 의해 주간-일간-시간대별 평상일 수요를 예측하며, 특수일 수요는 예측된 평상일 수요와 평상일 대비 상대계수 모형으로부터 예측한다. 예측의 정확도를 개선하기 위하여 시계열 자료에 가중치를 부여하고, 실적자료가 생길 때마다 자동으로 모형이 갱신되도록 하였으며, 수요예측 결과를 검증, 보정하기 위해 주간수요예측을 재수행할 수 있다. 또한 계획된 월간 전력량 제약에 협조하는 예측산법도 포함하였다.